VisionXS_CN_EN.pdf - 第12页

12 VisionXS It is important to have a high-performance cooling tract in order to guarantee optimum sol- dering results and ensure that modules are cooled gently . Rehm Thermal Systems offers a wide range of cooling tract…

VisionXS

lter

cooler

drop formation

low

maintenance

expenses

Pyrolysis at 500 °C

Option

Residues are separated with the help of a special granulate during py-

rolysis. Long molecular chains are broken down (cracked) into smaller

elements by means of thermal ssion. Temperatures ranging from 500

to 900 °C are required to this end. Afterwards, the molecular chains are

small enough to be taken up by the granulate and removed from the pro-

duction process. The granulate only needs to be changed once a year,

making the pyrolysis unit easy to maintain – and you prot from minimal

downtime. Your manufacturing processes continue to run smoothly.

残渣在高温（500°C至900°C）作用下通过一种表面粗糙的特殊颗粒材料，大分子

链被拆分为更小的分子（“裂解”）。随后，小分子沉积在颗粒材料表面并从制程

中被去除。此颗粒材料每年仅需更换一次，因此热解装置的维护十分便捷，停机

时间也大大降低，确保生产稳定进行。

pyrolysis

热分解系统

closed loop process atmosphere

闭环制程气体循环

closed loop cooling

闭环冷却循环

Liquid residues condense above all on the cooling

tract’s lter units, by which they are then removed.

The system is easy to clean. The lters are ex-

changed in sets at the back of the system. The

process chamber doesn’t even have to be opened.

Optional 7 stages for max efciency, Filters up to

98% increase process safety.

液体残留物首先在冷却区单元内冷凝过滤，然后被排

出。过滤单元易于清洁，过滤器可以通过系统背部直接

更换而无需打开炉膛。可选配七段过滤，最高过滤效率

高达98%。

Cold condensation |

冷凝

Ecient cleaning for a clean and dry process chamber

System integrated solution

Reliable, stable process

Easy accessibility

Low maintenance effort

高效清洁，保证炉膛清洁、干燥

一体化系统解决方案

可靠、稳定制程

易于操作

低维护需求

VisionXS

It is important to have a high-performance cooling tract in order to guarantee optimum sol-

dering results and ensure that modules are cooled gently.

Rehm Thermal Systems offers a wide range of cooling tract variants for reflow convection

soldering with VisionXS, which can be precisely ne-tuned to suit any production process. The

water-cooled standard solution with heat exchanger and adjustable ventilation system works

as an effective "Closed Loop" system. There are several efcient, additional options for large

and high-mass boards, primarily a power cooling unit as an extended cooling tract or a bottom

cooling system.

为获得最佳焊接结果以及组件得到平缓冷却，需配备高性能冷却系统。

锐德为VisionXS提供了多种冷却系统，并支持精确微调以适应个性化生产制程。带热交换器和可调通风系

统的标准水冷解决方案可作为“闭环”系统，实现高效冷却。对于大型高密度PCB板，您可以加装底部冷却

系统。

Stress-free to below 50 °C

with powerful cooling systems

无应力冷却至50℃以下性能强劲的冷却系统

Stress-free cooling using individually adjustable ventilators in the classic cooling zones

Optimum cooling of large, high-mass boards thanks to additional bottom cooling

Flexible combination possibilities through a range of different options

New, sustainable cooling principle as a result of liquid nitrogen cooling

利用冷却区中多个可单独调节的风机实现无应力冷却

提供底部冷却系统选件，完美冷却大型、高密度组件

多种冷却选项。支持灵活配置

创新型可持续液氮冷却技术

VisionXS

Option

In the SSP (Speed Switch Process) the process atmosphere cooling

process takes place without impacting the nitrogen level. Extra

pipes are installed in the pre-heating and peak zones to serve as

an outlet through which the cooler ambient air can be drawn by

the internal exhaust system and a fan upon activation of the SSP,

serving to achieve the zones' target temperature. Quick exhaust is

activated when there is a change of program to a lower temperature

prole and is deactivated once the temperature tolerances have

been reached.

在快速换线制程 (SSP) 中，制程气体冷却不影响炉膛内氮气含量。激活SSP

后，内部排气系统和风扇可通过位于预热和加热区的额外管道进行换气，以

达到目标温度。当焊接程序切换至更低温度曲线时，快速排气选项将激活，

并在温度达到程序设定范围时自动停止。

SSP

The VisionXS transforms the classic cooling tract into a two or four-layer system, cooling cell length 350 mm and recirculation

90°crosswise to transport direction.Individually adjustable ventilators in each of the zones make it possible to precisely control

the cooling process and influence the cooling gradient accordingly.

根据具体的生产线条件，VisionXS回流焊系统将冷却区分为2-4个阶段，冷却模组长度350mm和横向90

°冷风循环。

每个冷却区中的风机可单独

调节，从而精确控制冷却制程和冷却梯度。

Bottom Cooling |

底部冷却

Bottom cooling makes it possible to cool high-mass boards easily

and effectively. The cold process air is blown onto the board in equal

measures from above and below in order to facilitate a particularly

homogeneous cooling process and to reduce tension in the material.

It is possible to adjust the ventilator speeds for each module. This

means additional cooling measures, such as an outfeed belt with

ventilators, are unnecessary thanks to the low outlet temperatures.

It is predominantly modules with inhomogeneous distribution of the

copper positions that will be protected against twisting and warping

as a result of bottom cooling.

底部冷却系统能够可靠、高效地冷却重型PCB板：冷空气同时从上方和下方

输送到PCB板，实现均匀冷却，降低组件应力影响。每一个模块区域的风机

转速都可单独调节。底部冷却系统可以提供应用所需的超低出口温度，因此

无需再使用带风机的出口传送带等其他额外部件。此外，底部冷却系统还能

够可靠保护铜层分布不均匀的特殊组件，防止其发生扭曲和变形。

Cooling zone with bottom cooling

配备底部冷却的冷却区

Quick Exhaust |

快速排气

Quick exhaust serves to extract process atmosphere rapidly as a means of achieving the desired temperature change. Here the

process gas in the cooling line is extracted via the internal exhaust system. Quick exhaust is automatically activated if there is a

change of program to a colder prole. As soon as the temperature is within the tolerance range specied by the program, quick

exhaust is automatically deactivated. In the case of soldering processes in a nitrogen atmosphere the desired residual oxygen

value must then be reset by adding nitrogen.

快速排气选项可快速抽出制程气体，达到所需温度变换。冷却管道内的制程气体通过内部排气系统抽出。如果焊接程序切换到更低温度曲线，

则快速排气选项将自动激活，并在温度达到程序设定范围时自动停止。在氮气焊接制程中，此时必须添加氮气以达到所需残余氧气含量。

Cooling Cell |

冷却模组