DS-FlexTRAK-CD-FlexTRAK-CDS-Plasma-Systems-MARCH.pdf

The Flex TRAK ® -CD and Flex TRAK ® -CDS syst ems provide the f ollowing: • Pre-die attach, pre-wire bond, pre-mold enc apsulation, and pre-underll plasma treatment c apabilities. • A con v enient touchscreen grap hical…

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The FlexTRAK
®
-CD and FlexTRAK
®
-CDS systems
provide the following:
• Pre-die attach, pre-wire bond, pre-mold encapsulation, and
pre-underll plasma treatment capabilities.
• A convenient touchscreen graphical user interface (GUI).
• Production-ready, strip-handling system.
• A compact plasma chamber, short plasma cycle, and
proprietary process control for maximum throughput and
excellent cost of ownership.
• Unmatched production exibility with support for a wide
range of strip sizes.
• Access to service components via front pull-out shelves.
Key Applications
Plasma Contamination Removal and Cleaning
• Fluorine and other halogens.
• Metals and metal oxides.
• Organic compounds.
Plasma Etching and Surface Roughening
• Improve die adhesion and wire bonding.
• Improve mold adhesion and reduce
delamination.
Surface Activation
• Improve die adhesive ow, eliminate voids, and
enhance adhesion.
• Improve mold material ow, eliminate voids,
and reduce wire sweep.
• Improve underll ow, eliminate voids,
enhance adhesion, and increase wicking speed.
MARCH FlexTRAK-CD and FlexTRAK-CDS
High-Throughput Plasma Processing of Strip-Type Components for Semiconductor Packaging Applications
Specications
FlexTRAK-CD and FlexTRAK-CDS
Enclosure
Dimensions
W x D x H – Footprint FlexTRAK-CD: 1068W x 1166D x 1600H; 1966H mm with Light Tower
(42W x 46D x 63H; 77H in. with Light Tower)
FlexTRAK-CDS: 1190W x 1320D x 1640H; 2114H mm with Light Tower
(47W x 52D x 65H; 83H in. with Light Tower)
Net Weight FlexTRAK-CD: 430 kg (948 lbs.)
FlexTRAK-CDS: 550 kg (1213 lbs.)
Equipment Clearance
Right, Left, Back – 254 mm (10 in.), Front – 940 mm (37 in.)
Chamber
Maximum Volume FlexTRAK-CD: 5.5 liters (338 in³)
FlexTRAK-CDS: 9.6 liters (585 in³)
Electrodes
Variable Electrode Congurations Power-Ground, Ground-Power, Power-Power
Working Area FlexTRAK-CD: 305W x 305D mm (12W x 12D in.)
FlexTRAK-CDS: 305W x 550D mm (12W x 21D in.)
RF Power
Standard Wattage 600 W
Frequency 13.56 MHz
Gas Control
Available Flow Volumes 50, 100, or 250 sccm
Maximum Number of MFCs 3
Control System
and Interface
Software Control EPC with PC-based touchscreen interface
Remote Interface SMEMA, SECS/GEM
Vacuum Pump
Standard Purged Dry Pump 16 cfm
N2 Purged Pump Flow 2 slm
Facilities
Power Supply 220 VAC, 15A, 50/60 Hz, 1-Phase, 12 AWG, 3-Wire
Process Gas Fitting Size & Type 6.35 mm (0.25 in.) OD Swagelok Tube
Process Gas Purity Lab or Electronic Grade
Process Gas Pressure 0.69 bar (10 psig) min. to 1.03 bar (15 psig) max., regulated
Purge Gas Fitting Size & Type 6.35 mm (0.25 in.) OD Swagelok Tube
Purge Gas Purity Lab or Electronic Grade N2/CDA
Purge Gas Pressure 2 bar (30 psig) min. to 6.9 bar (100 psig) max., regulated
Pneumatic Valves Fitting Size & Type 6.35 mm (0.25 in.) OD Swagelok Tube
Pneumatic Gas Purity CDA, Oil Free, Dewpoint ≤7°C (45°F), Particulate Size <5 µm
Pneumatic Gas Pressure 3.45 bar (50 psig) min. to 6.89 bar (100 psig) max., regulated
Exhaust 25.4 mm (1 in.) OD Pipe Flange
Compliance
SEMI S2/S8 (EH&S/Ergonomics)
International CE Marked
Ancillary
Equipment
Gas Generators Nitrogen (Requires Additional Non-Optional Hardware)
FlexTRAK-CD and FlexTRAK-CDS
For more information, visit our
website to nd your local regional
oce or representative.
We have several global locations to
serve you.
North America
Asia Pacic
EMEA
www.nordson.com/electronics
info-electronics@nordson.com
Essential System Capabilities
Essential
Capabilities
Reliable, cost-
eective plasma
treatment.
These compact automated systems uniformly treat microelectronic
components for advanced semiconductor packaging applications. Low
maintenance and dependability deliver excellent cost-of-ownership.
Nordson Electronics Solutions builds the future of electronics reliability all across the globe. We’re proud of the decades
of service and solutions we’ve provided to enhance semiconductor reliability. No matter where you are, you’ve likely
manufactured or purchased a product made reliable with our equipment. The FlexTRAK-CD and FlexTRAK-CDS systems
oer high-throughput processing of strip-type components for semiconductor applications, designed to last and provide
cutting-edge capabilities continuing a time-honored tradition.
Explore the FlexTRAK-CD and FlexTRAK-CDS capabilities. Continue to see how we support the future.
For more information, contact us at info-electronics@nordson.com.
FlexTRAK-CD
FlexTRAK-CDS
The FlexTRAK-CDS system features a large-capacity plasma chamber that can
process up to 10 strips per plasma cycle. All substrate areas receive uniform treatment
while maintaining tight control over process parameters for repeatable results.
The FlexTRAK-CD system features a plasma chamber that can process up to 5 strips
per plasma cycle. All substrate areas receive uniform treatment while maintaining
tight control over process parameters for repeatable results. Also included in the
system is a patented plasma module for exceptional uniformity and run-to-run process
repeatability.
July 2024
North America Headquarters
2762 Loker Avenue West
Carlsbad, CA 92010-6603, USA
+1.760.431.1919