Viscom_Brochure_AOI_S3088_ultra_chrome_SPI_en.pdf

3D SPI The S3088 ultra chr ome is a 3D SPI system that off ers unbeatable advantages to maximize c ost efficiency in SMT production. Key featur es include an inspection speed of 90 cm²/s and a field of view size of 58.2…

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3D SPI
The S3088 ultra chrome is a 3D SPI system that offers unbeatable
advantages to maximize cost efficiency in SMT production. Key
features include an inspection speed of 90cm²/s and a field of
view size of 58.2mm by 58.2mm. The orthogonal optical resolu-
tion is 10μm and is combined with four angled views to deliver
perfect, shadow-free inspection results – which are key for very
small inspection areas. Viscom’s optional FastFlow handling offers
extremely high throughput rates. Assemblies are synchronously
infed and outfed at high speed.
This system, configured to meet optimum cost/benefit aspects,
is based on the unique and proven XM camera technology from
Viscom and combines precise defect detection with the highest
inspection speed. The S3088 ultra chrome inspects all quality cri-
teria for solder paste deposits, including volume, shape, surface,
height, offset, paste bridges and paste smearing.
Evaluating the 3D measurement data and linking the results via
Quality Uplink with the paste printer, placement system, AOI and
AXI allows for effective process control and sustainable quality
improvement. In this way, Viscom’s 3D SPI system delivers indica-
tions of process weaknesses that can be automatically adapted,
e.g. adjusting the screen cleaning cycles or correcting print dis-
placement or placement offset.
www.viscom.com
High Throughput 3D Solder
Paste Inspection with
Maximum Inspection Quality
S3088 ultra chrome | SPI system
Extremely high throughput
due to FastFlow handling
Enhanced quality and
speed of inspection
Four angled views for
shadow-free inspection images
High reproducibility
Very easy operation:
color images for verification and
efficient program generation
Viscom Quality Uplink for
best first-pass yield results
Color-assisted 3D solder paste
volume calculation
Paste bridge after soldering
www.viscom.com
Headquarters: Viscom AG
·
Carl-Buderus-Str. 9 - 15
· 30455 Hanover, Germany
·
Phone +49 511 94996-0
·
Fax +49 511 94996-900
·
info@viscom.de
You will find our international subsidiaries
and representatives at:
#Viscom_S3088_ultra_chrome_SPI_EN21100003 | © Viscom AG. All rights reserved. | Specifications subject to change without notice. Windows® and Intel® Core™ i7 are registered trademarks.
Dimensions in mm
Front view Top view
Technical Specifications
Side view
S3088 ultra chrome | SPI system
Inspection scope
3D SPI
Inspection of solder paste deposits (stencil printing or dispensing technology,
up to pad sizes for 01005 components) as well as sinter paste inspection.
Inspection of component presence, surface, height, print displacement
(X/Y offset), paste smearing and, as options: shape, coplanarity, open area
analysis, OCR and DCM
Camera technology
3D camera technology
Measuring procedure Fringe projection process
Z-resolution 0.1µm
Angled view cameras
Number of megapixel cameras 4
Orthogonal camera
Resolution 10μm high resolution, 20μm standard resolution
Field of view size 58.2 mm x 58.2 mm (2.3" x 2.3")
Performance data
Repeat accuracy of height measurement 2μm (on certification target), height <<10% @ 6σ (on certification target)
Paste height Up to 4,000μm
Software
User interface Viscom vVision/EasyPro
Statistical process control Viscom SPC/vSPC, open interface (optional)
Verification station Viscom vVerify/HARAN
Remote diagnosis Viscom SRC (software remote control) (optional)
Programming station Viscom PST34 (optional)
System computer
Operating system Windows®
Processor Intel® Core™ i7
PCB handling
Transport concept Single lane (dual lane as S3088 DT system)
Printed circuit board size (L x W) 508mm x 508mm (20" x 20"), longboard option available
Transfer height 850-950mm ± 20mm (33.5" - 37.4" ± 0.8")
Width adjustment Automatic
PCB clamping Pneumatic
Upper transport clearance (max.) 50mm (2")
Lower transport clearance 45 mm (1.8"), up to 85 mm (3.3") optional; 40 mm (1.6") with PCB support
Inspection speed
Up to 90cm
2
/s
Other system data
Positioning unit Synchronous linear motors
Interfaces SMEMA (standard), IPC Hermes standard, other interfaces on request
Power requirements 400V (other voltages on request), 3P/N/PE, 8A, 4 - 6bar working pressure
System dimensions 994mm x 1565mm x 1349mm (39.1" x 61.6" x 53.1") (W x H x D)
Weight 720kg (1587 lbs)
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