Technical datasheet-VF345.pdf - 第4页
5. Fl PH S PH S PH S (ST) 4. 2Fl PH 2S PH 2S (DT) 3. Fl PH S PH S (ST) 2. 2Fl PH 2S (ST) 1. Fl PH S (ST) Near Zero Defect Soldering Where quality is paramount, manual soldering cannot guarantee the reproducible results a…
SELECTIVE SOLDERING
VerSaFlOW
VERSAFLOW 3/45
Optimal Efficiency Combined with Highest Flexibility
VERSAFLOW 3/45
Dual track machine with dual flux,
preheat and solder modules
Modular & Compact Machine Platform Increases
Production Flexibility & Reduces Costs
ERSA, a world market leader for in-line selective sol-
dering systems for the past decade, has successfully
launched its third generation of selective machines in
the premium segment, the VERSAFLOW 3 Series.
Increased production efficiency, increased throughput
& flexibility and decreased floor space requirements
& running costs, make up just a few of the technology
highlights of the VERSAFLOW 3.
The VERSAFLOW 3/45 encompasses a new modular
machine platform which offers significant floor space
area savings when compared to the previous VERSA-
FLOW machines. An in-line selective solder machine
has three basic functional modules: flux, preheat and
solder. Depending on the job & throughput require-
ments, additional solder pots, fluxers and/or preheat
modules can be added to the machine after initial instal-
lation. This means that your VERSAFLOW 3 machine
can grow with your business. Machine configurations
from the smallest to the largest can be seen in Table 1.
5. Fl PH S PH S PH S (ST)
4. 2Fl PH 2S PH 2S (DT)
3. Fl PH S PH S (ST)
2. 2Fl PH 2S (ST)
1. Fl PH S (ST)
Near Zero Defect Soldering
Where quality is paramount, manual soldering cannot
guarantee the reproducible results achievable in an auto-
mated wave soldering process. Where keeping operational
costs to a minimum, however, conventional wave solder-
ing may no longer be a viable alternative, especially in a
lead-free environment with the high costs of solder. The
tremendous operational costs associated with increased
maintenance and bath analysis, higher dross formation,
triple the costs to fill the solder pot; shorter bath life due
to copper accumulation, enormous nitrogen costs, and
higher DPM and scrap rate might cause manufacturers to
examine the possibility of switching from wave soldering to
a selective soldering process.
The VERSAFLOW selective soldering process advantages
of “Better, Faster, Cleaner & Cheaper” can translate not
only into a tremendous increase in lead free soldering
quality, but also into significant costs savings!
Single & Dual track
VERSAFLOW 3/45
Basic Machine Configuration
The VERSAFLOW selective solder nozzle and pot
The revolutionary design of the ERSA VERSAFLOW
selective solder nozzle and pot offer a level of solder joint
process control never before dreamed of in a production
soldering process. All dynamic and static functions such
as solder level, wave height and solder temperature are
continually monitored & traceable. The maintenance-
free, electromagnetically operated solder delivery system
ensures a constant solder flow rate with no moving parts.
Exact wave height is precisely adjustable for repeatable
results. VERSAFLOW guarantees perfect solder joint defi-
nition and reproducibility, as well as complete documenta-
tion of individual solder parameters. All of these unique
features combine with the improved solder wave peel-off
function to offer individually programmable process param-
eters per solder joint!
MODULAR PLATFORM
Table 1: Fl = Flux Module, PH = Preheat Module, S = Solder Module,
ST = Single track transport, DT = Dual track transport
This table shows only some of the many possible configurations.
5. Fl PH S PH S PH S (ST)
4. 2Fl PH 2S PH 2S (DT)
3. Fl PH S PH S (ST)
2. 2Fl PH 2S (ST)
1. Fl PH S (ST)
Advantages of VERSAFLOW Technology:
High flexibility due to modular design
Highest solder joint quality and significant reduction
of DPM down to near Zero Defect
Shorter cycle times than in manual/robotic soldering
Highest throughput via dual track transport & parallel
processing in flux, preheat & solder module
High process safety, soldering at 0°; stationary PCB
during the soldering process
Optimal heavy mass multilayer soldering via top side
convection heating in the solder module
Processing of 2 solder alloys in one solder module
Increased positioning accuracy
Extensive software package with process documen-
tation; Possibility to connect traceability systems
Efficient and easy programming via graphic
programming
1.
2.
3.
1
2
3
FLUX PREHEAT
1. Flux dots, 3 mm; 2. Flux tracks, 3 mm ea.; 3. Flux track, 6 mm
Bottom-side short wavelength IR & top-side, convection heating technology
Dual track fluxing Dual track preheating
Precision Fluxing Efficiency
VERSAFLOW 3 machines integrate a programmable,
precision micro drop fluxing system for selective point
or track fluxing with automatic spray accuracy control.
The flux head delivers an absolutely precise & defined
amount of flux to the smallest of areas on the PCB.
The flux pattern on the joint or PCB can be focused dots
or tracks of flux as small as 3 mm in diameter or larger!
In this way, only the precise amount of flux required is
utilized, thereby reducing flux waste and keeping ionic
contamination to an absolute minimum. For multi panel
applications, up to 4 individually synchronised working
spray heads can be installed per flux module.
Preheating Flexibility
The VERSAFLOW 3 combines three different heating
technologies from both the top & bottom-side guaran-
teeing the greatest preheat flexibility. Bottom-side short
wavelength IR, top-side, convection heating technology
as well as a new top side Hybrid heating technology
extends the process flexibility for the preheating of high
mass assemblies.
All energy efficient bottom side preheating cassettes
are segmented; depending on the specific job require-
ment, preheat configuration or total length can be var-
ied in order to ensure optimum efficiency and maximum
workflow flexibility.