4000Plus Brochure.pdf
4000 Plus Bondtester Engineer ed for Excellence www .nor dsondage.com
4000Plus Bondtester
Engineered for Excellence
www.nordsondage.com
XY Stage
A range of XY stages are available from
160mm x 160mm right through to 300mm
x 210mm. Including high precision,
higher speed and zone shear options.
In addition to this there is even the
option of a heated work stage up to 400 degrees C at 200kg
max, complete with adjustable temperature control.
Irrespective of the industry: semiconductors, or the various
microelectronics sectors of automotive, power, hybrid, or high
reliability, the Nordson DAGE 4000Plus has the versatility and
accuracy that gives its users total condence in the quality
of its products. It features the latest patented bond testing
technology, for example the anti-backlash system. e Nordson
DAGE 4000Plus is capable of testing from 250 milligrams right
through to 500kg, catering for both standard and specialized
applications. Remember too, that the 4000Plus builds on
the success of the Nordson DAGE 4000, so data correlation
between the machines is assured.
The Nordson DAGE 4000Plus is the
most advanced bondtester on the
market, offering unsurpassed
accuracy and repeatability.
Developed by the world leader in
bond testing technology, the Nordson
DAGE 4000Plus represents the
industry standard in bond testing.
Image Capture System
Quick and simple to set-up, located in close
proximity to the test head to aid faster
testing. Improves test automation.
Featured Applications
Ribbon pull – With an extensive range of load
tools including hooks and tweezer jaws, all
sizes and types of ribbons can be tested.
Hot bump/pin pull – A new load cartridge
makes this groundbreaking test even
better, especially for evaluating PCB
substrate materials and low prole solder
bumps.
First bond ball pull of copper wires and pull of
studs, bumps and pillars – For the rst time
custom pull jaws enable tensile tests on these
important interconnects.
Fatigue pull and shear – Fatigue analysis is
emerging as an increasingly important
method in evaluating solder joint reliability.
A mix of software control and hardware
enables fatigue testing in both pull and
shear modes.
Passivation layer shear – A combination of
software and a special load tool provides a
solution to ball shear where access is
limited by the passivation layer.
Highly Configurable
e Nordson DAGE 4000Plus provides ultimate versatility.
Choose from a range of XY stages up to 300mm of travel in
one axis, and a unique range of load cartridges including push
cartridges up to 50kg, pull cartridges up to 100kg and shear
cartridges up to 200kg (500kg capable using special xtures
for shear). An extensive range of load tools provides for
standard and specialized applications. A wide choice of
optics is available to suit every application. e standard
mainframe vertical working envelope of 120mm will meet
most applications. However please consult factory for any
special requirements.
Pull/Push Test Shear Tests
Wire Ball
Ribbon Solder ball
Hot bump/pin pull Standard die shear
Cold bump pull Cavity
Copper wire bonds, studs and pillars Passivation layer
Stud bump Low profile zone shear
Vector Wafer bump
Fatigue Fatigue
Push Low profile die shear
Tweezer peel High force die shear
High force pull (up to 100kg) Horizontal stud pull
Vertical stud pull Cu pillar shear
Extensive Testing Capability
Current and emerging applications are fully catered for
with load cartridges combined with standard and
specialized fixtures to perform shear tests up to 500kg,
pull tests up to 100kg and push tests up to 50kg.
Leading The Way In Bond Testing
Flexural Testing
Fatigue Testing
Torsion Testing
Brittle Fracture Testing
Die pull/flip chip pull Micro bump shear
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Confidence In Your Results
Data Traceability
e 4000Plus is calibrated in accordance with International
standards, providing full traceability and integrity in product
testing. Calibration is performed using O.I.M.L class M1
tolerance weights directly traceable to National Standards;
UKAS or optional NIST Class 1 weights.
Automatic Load Tool Alignment
e optional self-aligning shear tool sleeves ensure that
the correct load is applied by compensating for misaligned
die attach.
Data Correlation
Nordson DAGE recognizes that data correlation is
fundamental for cross referencing test results between old
and new platforms. Existing users of Nordson DAGE
bondtesters (4000 Optima and 4000) can condently
compare data between old and new machines. Further, we
know that many users collect data on the same product from
multiple machines, either on the same site or even dierent
sites, and need to be sure that the data will correlate with
ultimate integrity given identical congurations and
test parameters.
Nordson DAGE have carried out exhaustive internal GR&R
studies to prove correlation between old and new machines.
e 4000Plus plays a critical role in data correlation but
equally important is Paragon™, our bond testing software.
Import and export protocols and database management tools
also ensure data streams from new, old or multiple machines
can be compared.
Data Integrity
e 4000Plus oers exceptional repeatability and
reproducibility of results, with a total system accuracy
of +/-0.1% of the load range selected (see detailed
specications).
Ultimate Step Back Accuracy
Control of shear height (step back) is critical to
consistent test results in shear applications.
Nordson DAGE has developed a unique patented
anti-backlash system that aids setting and control
of step back. Shear height can be set and maintained
to single micron accuracy across the range of load
cartridges. Additionally, on the S25G load cartridge
the step back accuracy is a superlative +/- 0.25 microns.
e accuracy is qualied through laser measurement.
Increased Efficiency
Image Capture Camera
e image capture system provides high resolution images for
failure mode analysis and ducial alignment. Its close proximity
to the tool maximizes throughput, particularly for automated
tests.
e camera has a built-in light source to provide optimal
illumination and ne focus is achieved using the precise
movement capabilities of the 4000Plus test platform.
A wide range of objective lenses ensure that the optimal
resolution and depth of eld can be achieved with
magnications up to 1500x.
The 4000Plus test platform offers a wide range of
optical solutions for bond testing and materials
testing, featuring imaging systems for failure mode
analysis, alignment and live recording of tests.
Image Capture System Borescope Imaging System
Trinocular Camera Side Alignment Camera System
Borescope Imaging System
e borescope provides high magnication imaging, ideal for
precise tool alignment. Based on medical endoscope technology,
it is perfect for ultra ne pitch devices such as ne wire bonds or
very small geometries such as micro bumps and copper pillars.
e borescope contains its own light source and can be positioned
in and out of the viewing position using its precision slide with
constant focus on the test sample.
Trinocular Camera
e trinocular camera can be attached to any stereo zoom
microscope with a C-mount.
With an appropriate microscope, the eld of view can be adjusted
from wide to close up and is ideally suited for macro positioning.
Used in conjunction with the side alignment camera, the two
views (front and side) enable precise tool alignment, particularly
for small, delicate or dicult samples.
Side Alignment Camera
e side view camera is ideal for testing micro features such as
copper pillars, micro bumps and TSVs. e system enables a
secondary view point of feature to be tested, providing accurate
and repeatable tests.
e side alignment camera is attached to the cartridge mount,
giving ultra stable, vibration free, imaging with constant focus
on the tool tip.
All camera systems use a USB connection and can be
field retrofitted.
Image capture camera can be utilized as a fiducial
alignment camera for automation.
You can test faster with the unique vector controls, utilizing
the newly styled key-pad featuring programmable nudge
buttons for precise positional alignment.
Paragon™ software’s virtual map for programming a pattern
Ultimate step back accuracy
shear
tool
gold ball bond
passivation
layer
silicon
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