ED-7306_E.pdf

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JEITA ED-7306

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Standard of Japan Electronics and Information Technology Industries Association

Measurement methods of package warpage at elevated temperature

and the maximum permissible warpage

Foreword

This standard was prepared by the Subcommittee on Integrated Circuit packages, Technical

Standardization Committee on Semiconductor Device Packages (TSC), Japan Electronics and Information

Technology Industries Association.

The increased reflow temperatures associated with lead-free reflow processes are prone to cause larger

warpages of packages and PWB, which have resulted in the detrimental effect on the yield of the board

level assembly. Under such circumstances, the Subcommittee started deliberations to standardize the

measurement method of package warpage at elevated temperature on Jun. 2005. After the deliberations

and agreements on the measurement methods and the criteria of the maximum permissible package

warpage, this standard was approved by TSC in Mar. 2007.

1. Scope

This standard stipulates the package warpage criteria and the package warpage measurement methods at

elevated temperature for BGA, FBGA, and FLGA

2. Normative references

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document applies.

JEITA EDR-7315 Design guide for semiconductor packages, Ball Grid Array Package (BGA)

JEITA EDR-7316 Design guide for semiconductor packages, Fine-pitch Ball Grid Array and

Fine-pitch Land Grid Array (FBGA/FLGA)

JEITA ED-4701/300 Environmental and endurance test methods for semiconductor devices

TEST METHOD 301B

Resistance to soldering heat for surface mounting devices (SMD)

JEITA ED-7304 Measuring method for Package Dimensions of Ball Grid Array

3. Terms and definitions

For the purposes of this document, the following terms and definitions apply.

3.1 Measuring zone

The area to be measured to determine the package warpage.

a) For the packages whose standoff height is more than 0.1 mm, such as BGA and FBGA, the measuring

zone is the area where terminals are located. This area is bordered by the lines connecting the centers

of the outermost neighboring solder balls (See Fig. 1 and Fig. 2). If there are thermal balls at the

package center, their area is also considered as a part of measuring zones.