Yamaha_Datasheet_YRP10_EN.pdf
World-class speed and performance! Capable of fully autonomous changeover tasks! NEW Sin gle-l ane : L 51 0 x W 51 0 mm Dua l-l ane : L 420 x W 3 30 mm Dua l-l ane i ndependent produc tion Posit ioning r epeat abilit y 6…
World-class speed and performance!
Capable of fully autonomous changeover tasks!
NEW
Single-lane: L 510 x W 510 mm
Dual-lane: L 420 x W 330 mm
Dual-lane independent
production
Positioning repeatability
6σ ± 8 μm Cpk ≥ 2
Ultra-high-speed performance
6 seconds/cycle
Premium printer
SMT Innovation
YRP10
FEATURE 1
Ultra-fast cycle time
We achieved high productivity by totally redesigning the drive system to optimize the movement layout and cut the board
transfer
time to attain a cycle time including stencil cleaning of 6 seconds at the world’s fastest level (optimal in-house
conditions; normal
print time is 10 seconds), reaching a speed 20 % faster than conventional operation.
FEATURE 2
Supports fully autonomous stencil exchange
Automatic stencil exchange (option)
The function presets the stencil needed for the next
production task while the printer is operating and
automatically makes setups changeovers. Space-
saving design with small footprint sets and recovers
used stencils all in one batch at the machine rear. This
slashes the time
needed for stencil replacement since
workers can do stencil
presetting in advance whenever
they have time available with out having to stop the
printer.
The squeegee head is now equipped with a new
solder receiver plate to prevent solder from falling onto
the stencil during replacement.
Automatic solder transfer (option)
During stencil replacement, this function automatically
scoops up solder paste remaining on the used stencil
and swiftly transfers it to the new stencil now in place.
Solder paste transfer takes place during auto stencil
replacement while maintaining the rolling diameter
which eliminates lost time and human error in setups
and changeovers.
FEATURE 3
Delivers both high quality & super-accurate printing
YAMAHA’s original 3S head
[3S: Swing Single Squeegee]
Program changes squeegee attack
angle and speed to an ideal setting
to provide optimal printing condi-
tions that match the solder being
used.
Auto cleaning system
High-eciency cleaning system as
standard equipment. New cleaner
head ensures a huge reduction in
cleaning cloth consumption.
Stencil vacuum
A stencil vacuum mechanism
delivers consistent high-accuracy
printing with no eects from stencil
droop. Also drastically cuts the
setup time since no oset entry
is needed during back and forth
printing movement.
Automatic push-up pin exchange (option)
The function automatically replaces the push-up pins which
support the PCB from below. Two gripper heads do high-
speed replacements that not only slash setup/changeover
times but also reduce human error. Even the large PCB
such as 420 x 420 mm can be supported by maximum of
200 pins with a margin. Pin layout can be set using mounter
data and images captured by AOI, simplifying data creation.
YRP10
Premium Printer
YRP10
Premium Printer
Composite image
alignment function
By combining images from two
cameras in one layer, the operation
of the PCB for printing stencils
and its relative positioning can be
performed simply and accurately.
Flexible dual-lane
Connecting two YRP10s in series enables a fully
independent dual-lane operation. Dual-lane operation and
automatic changeover feature are supported at the same
time. Addition of a traverse conveyor flexibly connects
the YRP10s to the downstream equipment.
FEATURE 4
Dual-lane fully independent production
2D print inspection (option)
Supports full-on pro-level inspections
with a dedicated camera. Feed
-
back from inspection results allows
over-printing and stencil cleaning.
Composite
image
Image of the PCB
recognition camera
Image of the stencil
recognition camera
Full range of options
Touch panel
An easy-to-use and clear interface ensures smooth and sure operation.
Display is switchable between 5 languages (Japanese, English, Chinese,
Korean, German).
2D inspection camera
PSC (auto solder replenishment)
Right-to-left transport
PCB vacuum system
Temperature control unit
Solder remaining quantity detection
UPS system
IT option
PSC system (option)
[PSC: Print Stability Control]
The PSC system stabilizes the
rolling diameter of the solder paste
that aects print quality. This system
shortens the setup changeover time
and reduces the amount of solder
loss in the process. PSC is available
in syringe type (6 or 12 oz./173 or
346 cc) or as POT type.
W330 mm dual-lane
Large PCBs the size of up to L 420 × W 330 mm can be
produced in a dual-lane. You can increase the number of
PCBs to take and the number of PCBs to be conveyed
by the carrier, boosting production eciency.