Asterion_EV_Brochure.pdf

Enhanced Capability Hybrid W edge Bonder One Bonder , Multiple Interconnect Solution One Bonder , Multiple Interconnect Solution The Asterion TM EV (Extended V ersion) Wedge Bonder is built on a reengineered architecture…

Enhanced Capability

Hybrid Wedge Bonder

One Bonder, Multiple Interconnect Solution

The Asterion

EV (Extended Version) Wedge Bonder is built on a

reengineered architecture that includes an expanded bond area, new robust

pattern recognition capabilities and extremely tight process controls.

Together these deliver heightened productivity, bonding quality, and

reliability. The enlarged bondable area enhances flexibility and reduces line

integration costs. Asterion is driven by a precise new direct-drive motion

system that requires minimum maintenance and delivers high repeatability.

The graphical editor, multi-segment bonding, global parameter change, and

a library of new software features, make programming and optimizing

bonding process of complex devices relatively easier.

Key Features

Battery Bonding

▪ Compensation for height variations between surfaces

▪ Real-time physical testing with the non-destructive pull tester

▪ Self-contained/Built-in wire feed dispensing system

▪ No heat applied, all work done at ambient temperatures

Productivity

▪ Large bondable area (300 mm x 860 mm) reduces indexing/loading time

▪ Resistive touchscreen monitor

Performance

▪ Consistent process results

Configuration Flexibility

▪ Single platform offering a range of interconnect solutions for Al and Cu wires —

Large wire, small wire and PowerRibbon

with a wide range of bond head selection

▪ Supports multi-device and multi-lane automated handler

Ease of Use

▪ Intuitive Graphical User Interface (Windows 7 OS)

Maintenance and Reliability - Lower Cost-of-Ownership

▪ Highly reliable direct-drive XYZT motion system requires no adjustments and less

frequent preventive maintenance

▪ Reduced preventive maintenance requirements on major components

For sales, service and manufacturing locations, visit www.kns.com

The Asterion EV logo, Asterion EV, K&S logo, and Kulicke & Soa are trademarks of

Kulicke & Soa Industries, Inc.

WB-007-01/2017

Enhanced Capability

Hybrid Wedge Bonder

Enhancements

Options

Additional Enhancements

Specifications

Graphical Editor for convenient program editing Loop Former option enables advanced square shaped

loops profiles

Robust PR (GS4) with Feature Find and Geometric

Model modes developed for difficult patterns like direct

bonded copper (DBC) substrates

Multi-Segmented Bonding cycle allows precise

control and flexibility of the bonding process

▪ Light intensity calibration normalizes PR light settings across all machines

▪ Process programs, stored on a host for control, are available to download to

individual bonders

▪ Process logging for each bond can be stored and accessed offline for

traceability

▪ Consumable tracking and bar code verification capability

General

Power Requirements (Electrical): 180 - 240 VAC, Single Phase,

50/60 Hz, 2.0 kVA

Nitrogen: Min 275 kPa - Max 1000 kPa, 2-10 L/min

(Small wire only)

Work Height: Adjustable 939 - 985 mm from Floor

Foot Print:

With operator panel: 800 (W) x 1971 (D) x 1955 mm (H)

Whout operator panel: 800 (W) x 1728 (D) x 1955 mm (H)

Weight: 1015 kg Uncrated without work holder insert

CE Certification: Standard

Pattern Recognition/Optics/Vision

Vision System: GS4 Pattern Recognition System

New PR Modes: Feature Find, Single Point with Angle, Geomodel

Motion System

X, Y Axes: Linear motors, 0.1 μm Resolution

Bond Area: 300 x 860 mm

Z-Axis: Voice Coil, 0.1 μm Resolution; 50 mm Z-Stroke

Θ-Axis: Direct Drive; ± 220°, 0.0057° Resolution

Repeatability: ± 3.0 μm at 3 σ

Interconnect Options

Large Wire - Wire Range: 100 - 500 μm Diameter

PowerRibbon - In Development

Material Handler

Handler Bay:

With Insert: 1080 (D) x 424 mm (H)

Open Bay: 1080 (D) x 583 mm (H)

Standard Integrated Handlers Available

Non-Destruct Pulltesting

Bondhead Pulltest:

Large Wire ALC bond head

Configurable bond head

▪ Newly designed Graphical Bond head Set-up aid option (GBS) reduces

consumable replacement time & ensures a repeatable set-up

▪ Bond Process Monitoring option (BPM) helps keep tight control of the

bonding process

▪ SECS-GEM option enables factory automation and communication

▪ Programmable status light can be programmed for customized conditions

Non-Destructive Pulltest gives 100% physical testing

of the bonds after they are made which in turn offers

real-time quality physical control

Bonded Device Review can capture camera images

after bonding a device in Auto and display them for

review while bonding the next device