03236889-01-03 Galaxy Tech Spec.pdf - 第6页
6 DEK Galaxy Machine Footpri nt without HTC
5
DEK Galaxy
Machine Productivity Options
Process
Specification
Print Method
Paste Dispenser
Paste roll height monitor
Ball Placement
ProFlow® ATx
Printing Environments Control
Static – Air Ioniser
Temperature – Temperature Control Module (TCM)
Stencil Frame
VectorGuard®
Under Stencil Cleaning
Typhoon Under Stencil Cleaner (620mm, poly blade insert only)
Software & Communications
Specification
Substrate Handling
Flexible boards
Selective print pass through
Singulation
Topside Referencing System (TRS)
Virtual Panel Tooling (VPT)
Software & Communications
Off Line Printer Programming
GEM on TCP/IP
Remote Smart Factory (RSF)
Transport
Specification
Substrate Support
Vacuum tooling capability
Vacuum tooling sensor
Vacuum cups
Grid-Lok® Tooling
Universal wafer pallet
Precision wafer pallet
Substrate Transport
Single piece conveyor with flat belts (heavy boards)
High Throughput Conveyor (HTC) with round belts
Heavy pallet rails
Wafer Transport Solution (WTS)
Remote board stop (for use with heavy board option)
Substrate Fixture
Over Top Snuggers (OTS)
Snuggers (edge clamping)
Foil-less clamps
Vision
Specification
HawkEye®
HawkEye® Bridging
Other
Specification
Product Data Capture
Verification & Traceability
ProDEK closed loop
Camera Barcode Reader
6
DEK Galaxy
Machine Footprint without HTC
7
DEK Galaxy
Machine Footprint with HTC