SQ3000-X-8025714-REV_E.pdf

SQ3000- X ™ 3D A OI Contact C yberOptics today for more informa tion +1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.c om Copyright © 2018. C yberOptics Corporation. All rights reserved. Sp…

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SQ3000-X™ 3D AOI
Contact CyberOptics today for more information
+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com
Copyright © 2018. CyberOptics Corporation. All rights reserved. Specications subject to change without notice. 8025714 Rev E
SQ3000-X
™
3D AOI
The Ultimate in Speed and Accuracy
with Large Board Capability
Powered by
MRS Technology
Inspection Capabilities MRS Sensor Ultra High Resolution MRS Sensor
Inspection Speed 40 cm
2
/sec (2D+3D), High Speed option
available: 50 cm
2
/sec (2D+3D)
15 cm
2
/sec (2D+3D)
Minimum Component Size 0402 mm (01005 in.) 0201 mm (008004 in.)
PCB Size Minimum: 50 x 50 mm (2 x 2 in.), Maximum: 710 x 620 mm (28.3 x 24.4 in.)
Component Height Clearance Top: 50 mm
Bottom: 30 mm
PCB Thickness 0.3 - 5 mm
Maximum Board Weight 10 kg (22 lbs)
Component Types Inspected Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips,
connectors, header pins, and more
Component Defects Missing, polarity, tombstone, billboard, ipped, wrong part, gross body and lead damage,
and more
Solder Joint and Other Defects Gold nger contamination, excess solder, insucient solder, bridging, through-hole pins
3D Measurement Inspection Lifted Lead, package coplanarity, polarity dimple and chamfer identication
Measurement Gage R&R <10% @ ±3σ (±80 µm process tolerance)
Z Height Accuracy 1 µm on certication target
Z Height Measurement Range 6 mm at spec, 24 mm capability 3 mm at spec, 10 mm capability
Vision System & Technology
Imagers Multi-3D sensors
Resolution Sub 10 µm 7 µm
Image Processing Autonomous Image Interpretation (AI
2
) Technology, Coplanarity and Lead Measurement
Programming Time <15 minutes (for established libraries)
CAD Import Any column-separated text le with ref designator, XY, Angle, Part no info; Valor process
preparation
System Specications
Machine Interface SMEMA, RS232 and Ethernet
Power Requirements 100-120 VAC or 220-240 VAC, 50/60 hz, 10 amp max.
System Dimensions 134 x 139 x 139 cm (W x D x H)
Weight ≈1242 kg (2738 lbs.)
Options
Barcode Reader, Rework station, SPC Software, Alignment Target
Standard SQ3000, SQ3000-D (Dual Lane), and SQ3000-DD (Dual Lane - Dual Sensor) models available
Front Side
NEW
Ultra-High Res
MRS Sensor
Multi-Reection Suppression (MRS) Technology
SQ3000-X™ oers unmatched accuracy with the revolutionary MRS
technology by meticulously identifying and rejecting reections caused
by shiny components and reective solder joints. Eective suppression of
multiple reections is critical for accurate measurement making MRS an
ideal technology solution for a wide range of applications including those
with very high quality requirements.
CyberOptics has advanced the proprietary Multi-
Reection Suppression (MRS) sensor to an even
ner resolution. The Ultra-High Resolution MRS
sensor enhances the SQ3000-X 3D AOI platform,
delivering superior inspection performance,
ideally suited for the 0201 metric process and
micro-electronic applications where an even
greater degree of accuracy and inspection
reliability is critical.
Large Board Capability
SQ3000-X™ supports large boards up to 710 x 620 mm, and is capable of
inspecting the most demanding assemblies at up to 40 cm
2
/sec (2D+3D)
inspection speed without compromising on measurement accuracy
and repeatability. CyberOptics’ new Ultra High Res MRS Sensor with an
inspection speed of 15 cm
2
/sec (2D+3D), provides ner resolution for
even more applications.
SQ3000-X
™
The Ultimate in Speed and Accuracy
High Precision Accuracy with Multi-Reection
Suppression (MRS) Sensor Technology
The SQ3000-X™ is powered by CyberOptics’ breakthrough 3D sensing
technology comprising four multi-view 3D sensors and a parallel
projector delivering metrology grade accuracy at production speed.
CyberOptics’ unique sensor architecture simultaneously captures
and transmits multiple images in parallel while proprietary 3D fusing
algorithms merge the images together. The result is ultra-high quality
3D images and high-speed inspection.
Billboard
Lifted Leads Insucient Solder
AI
2
- Faster, Smarter Programming
AI
2
(Autonomous Image Interpretation) technology is all about keeping it simple - no parameters to adjust
or algorithms to tune. And, you don’t need to anticipate defects or pre-dene variance either - AI
2
does it
all for you. With AI
2
, you have the power to inspect the most comprehensive list of features and identify the
widest variety of defects. AI
2
oers precise discrimination with just one panel inspection making it a perfect
solution for high-mix and high-volume applications.
Fast, Scalable SPC Solution
CyberReport™ oers full-edged machine-level to
factory-level SPC capability with powerful historical
analysis and reporting tools delivering complete
traceability for process verication and yield
improvement. CyberReport™ is easy to setup and simple
to use while providing fast charting with a compact
database size.
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
Intuitive, Easy-to-Use Software
The SQ3000-X™ software is a powerful yet extremely simple,
designed with an intuitive interface that reduces training eorts
and minimizes operator interaction – saving time and cost. The
SQ3000-X software includes multi-touch controls and 3D image
visualization tools, taking ease-of-use to a whole new level.
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER