MK7-Reflow-Oven.pdf - 第6页

I Vertical Curing Dven Heller Vertical Dven Specifications Heller has developed Vertical Curing Ovens for inline applications . By the design of vertical transfer , it is able to save the costly floor space and get stabl…

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HilUEII
I
II
I
I
I
i
1
III
Vacuum
Assisted
Reflow
Heller
Reflow
Dven
MK
5
+
MK
7
Basic
Models
and
Specifications
Heller
Industries
has
developed
a
vacuum
module
that
inserts
directly
in
its
reflow
oven
line
to
meet
rising
demand
of
high
volume
,
void
free
,
automated
inline
soldering
.
This
vacuum
assisted
reflow
has
been
shown
to
reduce
the
voids
in
a
solder
joint
by
99
%
and
allows
thermal
profiles
to
be
directly
ported
from
non
-
vacuum
reflow
applications
to
achieve
low
COO
and
high
UPH
.
Model
Overall
Length
#
of
#
of
Max
Heat
Zones
CODI
Zones
PCB
Width
15
D
5
I
TDp
(
std
.
)
External
Coal
optional
Features
73
H
15
D
5
5
22
"
(
2
m
)
•
Applies
multi
-
zones
to
suit
various
thermal
profile
requirements
•
Able
to
achieve
<
1
%
total
void
area
spec
•
Provides
optimized
cycle
(
average
30
60
s
)
to
achieve
high
UPH
•
Utilizes
advanced
pumping
package
for
fast
pump
down
time
•
Adopts
high
efficient
flux
collection
system
to
eliminate
flux
condensation
•
Utilizes
a
heater
in
the
Vacuum
chamber
to
minimize
liquid
time
I
7
D
7
nnnnnn
I
Top
(
std
.
)
Bottom
CDDI
/
External
Cool
optional
If
142
"
I
7
D
7
22
"
I
fzr
|
zg
|
z
3
jz
<
|
z
5
j
|
ZB
|
Z
?
[
I
82
B
/
18
D
9
183
"
XUXXI
XI
JX
2
Tap
(
std
.
)
Bottom
Coal
/
External
CDDI
optional
I
82
B
8
22
"
(
4
.
G
5
m
)
1
!
圔里
_
里
_
183
"
O
I
With
Heller
Vacuum
Without
Vacuum
I
8
D
9 9
22
"
(
4
.
B
5
m
)
(
>
15
-
25
%
VOIDS
)
(
<
1
%
VOIDS
)
193
B
/
19
I
3
網闘閱
0
圓
《
国
232
"
iUl
■
几几
XI
XUX
iX
AA
AAA
IS
3
G
ID
3
Tap
(
std
.
)
Bottom
CDDI
/
External
Cool
optional
22
"
(
5.89
m
)
.
i
.
.
.
-
'
232
"
trtrti
仃
t r
Vu
1913
13
IT
(
5.89
m
)
2
D
43
3
Top
(
std
.
)
Bottom
CDDI
/
External
CDDI
optional
2
B
7
"
Heller
Vacuum
Assisted
Reflow
Oven
Specifications
a
13
IT
(
B
.
78
m
)
2
D
49
1808
MK
5
-
VR
1911
MK
5
-
VR
1912
MK
5
-
VR
1936
MK
5
-
VR
2043
MK
5
-
VR
Model
4
Top
(
std
.
)
Bottom
CDDI
/
External
CDDI
optional
1
W
I
5
22
"
nf
^
(
7.44
m
)
araBT
”
gr
^
Power
Supply
400
/
415
/
480
VAC
400
/
415
/
480
VAC
400
/
415
/
480
VAC
400
/
415
/
480
VAC
400
/
415
/
480
VAC
2
I
5
G
N
2
N
2
N
2
N
2
N
2
Process
Gasses
5
Tap
(
std
.
)
Bottom
CDDI
/
External
CDDI
Optional
Option
:
Formic
Acid
Option
:
Formic
Acid
Option
:
Formic
Acid
Option
:
Formic
Acid
Option
:
Formic
Acid
342
,
f
2
I
5
G
17
22
"
(
8
.
B
9
m
)
Convection
Heating
/
Top
7
+
Bottom
7
+
1
IR
(
Top
)
Convection
Heating
/
Top
10
+
Bottom
10
+
1
IR
(
Top
)
Convection
Heating
/
Top
11
+
Bottom
11
+
1
IR
(
Top
)
Convection
Heating
/
Top
8
+
Bottom
8
+
1
IR
(
Top
)
Convection
Heating
/
Top
10
+
Bottom
10
+
1
旧
(
Top
)
Heating
Zones
Cooling
zones
2
Top
Option
:
Bottom
3
Top
Option
:
Bottom
3
Top
Option
:
Bottom
3
Top
Option
:
Bottom
3
Top
Option
:
Bottom
NOTE
:
I
82
B
+
I
33
B
+
2
D
43
+
2
D
43
+
2
I
5
G
models
utilize
a
3
D
,
r
wide
by
\
T
long
heater
module
to
allow
drop
-
in
profile
compatibility
with
other
vendors
1
ovens
.
I
7
D
7
+
I
8
D
9
+
I
9
I
3
models
utilize
a
3
D
"
wid
日
by
ID
"
long
heater
mndule
to
provide
improved
profile
^
sculpting
"
and
reduced
liquid
times
.
Module
sizes
up
to
3
B
”
wide
are
available
upon
request
far
large
boards
up
to
28
"
wide
and
increased
dual
rail
width
.
Standard
:
<
10
Torr
Option
:
5
Torr
Standard
:
<
10
Torr
Option
:
5
Torr
Standard
:
<
10
Torr
Option
:
5
Torr
Standard
:
<
10
Torr
Option
:
5
Torr
Standard
:
<
10
Torr
Option
:
5
Torr
Min
.
Vacuum
Level
Max
.
Working
Temperature
Standard
:
350
°
C
Option
:
400
°
C
/
450
°
C
Standard
:
350
°
C
Option
:
400
°
C
/
450
°
C
Standard
:
350
°
C
Option
:
400
°
C
/
450
°
C
Standard
:
350
°
C
Option
:
400
°
C
/
450
°
C
Standard
:
350
°
C
Option
:
400
°
C
/
450
°
C
Max
Board
Size
(
cm
)
500
Lx
450
Wx
29
H
500
Lx
450
Wx
29
H
350
Lx
350
Wx
29
H
350
Lx
350
Wx
29
H
500
Lx
450
Wx
29
H
*
WE
can
configure
the
machine
you
need
.
Heller
Pressure
Cure
Dven
Fluxless
Reflow
(
Formic
Acid
)
Heller
Industries
has
developed
fluxless
reflow
which
utilizes
Formic
Acid
(
HCOOH
)
to
replace
standard
flux
agents
.
Formic
Acid
has
been
shown
to
be
an
effective
reducing
agent
in
fluxless
solder
reflow
.
It
eliminates
the
need
for
pre
-
reflow
fluxing
and
post
-
reflow
flux
cleanup
steps
.
Heller
industries
can
map
the
formic
acid
concentration
profile
and
reduce
02
ppm
to
~
10
ppm
for
bumping
application
.
Excellent
results
demonstrated
for
wafer
bumping
application
and
C
4
Flip
Chip
process
.
Heller
has
developed
Pressure
Cure
Oven
(
PCO
)
or
Autoclave
to
minimize
voiding
and
increase
adhesion
strength
for
bonding
processes
typically
used
in
die
attach
and
underfill
applications
.
PCO
pressurizes
air
into
a
rigid
vessel
and
heats
with
forced
convection
.
When
the
curing
process
is
complete
,
the
pressure
oven
automatically
relieves
its
pressure
to
1
atm
and
cools
.
Features
Heller
Pressure
Cure
Dven
Specifications
•
Can
use
any
reflow
profile
(
e
.
g
.
,
tent
or
soak
profile
)
with
formic
acid
•
Can
adjust
formic
acid
profile
in
oven
in
conjunction
with
thermal
reflow
profile
•
Includes
Formic
acid
safety
system
(
i
.
e
.
,
sensors
/
detectors
)
adheres
to
industry
standards
•
Offers
optional
Formic
acid
abatement
systems
for
Green
Process
Solution
•
Offer
optional
real
time
formic
acid
concentration
monitor
system
}
•
Capable
of
running
both
formic
acid
process
and
flux
process
*
•
SEMI
S
2
-
S
8
certified
*
•
Process
time
:
Generally
120
min
or
User
'
s
spec
•
Operating
temp
:
60
°
C
-
220
°
C
•
Maximum
temp
:
220
。
。
•
Operating
pressure
:
1
bar
-
10
bar
•
Capacity
:
24
Magazines
(
typical
)
•
Cooling
method
:
PCW
(
17
°
C
~
23
°
C
)
•
Cooling
water
pressure
:
25
-
40
psi
*
Option
Heller
Fluxless
Reflow
Dven
Representative
Pressure
/
TEmp
Profiles
(
User
Configurable
)
•
13
convection
heating
zones
and
4
convection
cooling
zones
•
Formic
acid
delivery
system
•
Real
time
formic
acid
concentration
and
02
PPM
measuring
•
Environmental
monitoring
system
and
exhaust
abatement
system
for
operation
safety
Applications
Temp
.
200
°
C
Top
and
Bottom
Die
60
°
C
Voids
0
INDUSTRY
4
.
D
Compatibility
30
min
90
min
120
mln
Time
Pressure
.
Internet
of
Manufacturing
(
loM
)
—
Smart
factories
,
intelligent
machines
and
networked
processes
through
the
use
of
cyber
-
physical
systems
.
10
bar
Heller
offers
Host
Computer
/
loM
Interfacing
.
This
integration
provides
:
•
Central
control
•
Production
reporting
—
#
of
boards
processed
,
up
time
,
down
time
•
MTBF
/
MTTA
/
MTTR
•
Energy
management
and
control
•
Traceability
of
product
Heller
offers
compatible
interfacing
for
:
-
CFX
(
AMQP
MQTT
)
-
Hermes
-
PanaCIM
&
iLNB
-
Fuji
Smart
Factory
-
ASM
-
Custom
interfaces
available
upon
request
Voids
0
20
min
90
min
110
min
Time
I
Vertical
Curing
Dven
Heller
Vertical
Dven
Specifications
Heller
has
developed
Vertical
Curing
Ovens
for
inline
applications
.
By
the
design
of
vertical
transfer
,
it
is
able
to
save
the
costly
floor
space
and
get
stable
temperature
profiles
.
Compared
with
traditional
ovens
,
vertical
curing
oven
can
fulfill
the
automatic
in
line
production
with
superior
temperature
uniformity
.
Major
applications
:
Die
Attach
,
Flip
Chip
,
Underfill
,
COB
Encapsulation
.
Vertical
Oven
Models
755
-
250
755
-
350
Height
(
mm
)
1670
2000
Length
(
mm
)
1850
2500
Width
(
mm
)
1500
1800
Vertical
Pitch
(
mm
)
19.05
31.75
Edge
width
clearance
(
mm
)
5 5
Max
board
width
(
mm
)
250
350
Min
board
width
(
mm
)
75
90
Max
board
length
(
mm
)
250
350
Maximum
Board
weight
0.15
kg
1
kg
Minimum
Cycle
Time
(
sec
)
18
12
Min
Process
Time
(
min
)
15
7
/
18
+
Max
Zone
Temperature
Setpoint
150
C
180
C
Max
Product
Temperature
125
C
150
Up
/
Down
Conveyor
(
Boards
)
24
Up
/
24
Down
18
Up
/
18
Down
Vacuum
Clamp
Conveyor
Heller
Industries
has
invented
a
vacuum
clamp
that
moves
within
a
conveyor
belt
system
inside
a
horizontal
vacuum
reflow
oven
.
Vacuum
clamp
carriers
return
underneath
oven
from
exit
to
entrance
to
provide
continuous
operation
.
This
vacuum
clamping
design
has
proved
effective
for
wafer
or
substrate
warpage
mitigation
.
Features
•
Small
Footprint
-
as
small
as
185
cm
•
Fast
Curing
Time
-
down
to
7.5
minutes
Heller
Horizontal
Vacuum
Chucks
•
Adjustable
Curing
Times
-
up
to
several
hours
Reflow
Oven
•
Adjustable
Product
Width
-
from
7.5
cm
to
35
cm
•
Air
Atmosphere
•
SMEMA
Compatible