Yamaha_Datasheet_YSi-SP_EN .pdf
SPI func tion suppor ts vast range of analyses High ac cur acy- hig h speed inspections E x tensive M2M solution to c omplete Y ama ha T rue T otal Line Solution 1 -hea d sol ution for va rious inspections 3D Solder Past…
SPI function supports vast range
of analyses
High accuracy-
high speed inspections
Extensive M2M solution to complete
Yamaha True Total Line Solution
1-head solution for various
inspections
3D Solder Paste Inspection Machine
YSi-SP
SMT Innovation
NEW
Noise Noise
only
Phase shift
2D + Phase shift
YSi-SP
Standard mode
25 µm
High resolution mode
First image
capture
Second
image capture
12.5 µm
• Focus adjustment
Reproduces accurate shapes by combining with phase
shift method.
Super high resolution technology delivers switchable
resolution for each visual field.
• Focus adjustment • Focus adjustment
Highly accurate 3D inspections by applying unique 3-step algorithm
Supports high-speed and high-resolution
inspections on just 1 unit!
The camera height corrects by
automatic focus adjustment to
follow up on any PCB warpage
down to ± 5 mm.
Measure the surface area by
accu rately extracting the con-
tour of the solder paste by 2D
ring lighting.
Measure height of solder
paste by phase shift method
and extract volume value.
3D solder printing inspection
Foreign matter inspection (option)
Resolution selector
PCB warpage display
3D bond coating inspection (option)
High precision 2D contour extraction
Accurately reproducing
shapes is difficult due to
noise.
Gives high reproducibility for
extracting contours by 2D
inspection.
YSi-SP
3D Solder Paste Inspection Machine
FEATURE 1
“1-head solution” to perform various inspections
FEATURE 2
Achieves high-accuracy high-speed inspections using
3D + 2D inspection, image resolution switch-over and more
One head type supports all types of inspections. Eliminate cycle time and configuration costs and increase your
productivity.
Full range of options support for a wide range of production lines via ultra-high resolution capable of printing
inspection of ultra-small parts such as 0201 (0.25 mm × 0.125 mm) to 03015 (0.3 mm × 0.15 mm) chips; bonding
inspections capable of inspecting the adhesive coating state of dispensers; and foreign matter inspections
capable of detecting foreign substances adhering to the PCB, and other options that are adaptable to various
production lines.
• Automatic setup changes
Settings such as production line PCB data and conveyor width are sequentially sent from upstream units by
scanning ID such as for barcodes listed on PCB and instruction sheets to automatically to shorten the time
needed to switch setups and make changeovers.
Saves all pad images and measurement data, performs statistics and analysis of holes and slits by multiple
methods, software from 1 PC connects to up to 6 SPI units.
YSi-SP
3D Solder Paste Inspection Machine
• Feed back print information
Feed back printing information and cleaning instructions acquired by
SPI to the downstream printer to give high print quality.
• Bad mark data feed forward
Once the YSi-SP recognizes a bad mark on the PCB, it sends that information to the
downstream mounter to avoid redundant recognition and shorten cycle time.
• Automatically converts coating inspection data
Create coating data from the dispenser and send
to SPI in just one click!
FEATURE 3
A thorough and extensive machine-to-machine
(M2M) solution
FEATURE 4
Statistical Process Control (SPC) for diverse statistical
processing
FEATURE 5
Optional features to enable handling various products
The Yamaha brand can provide all main equipment needed for component mounting in one package and by
linking SPI with each piece of equipment creates a production line having boosted quality and productivity.