Viscom_Brochure_MXI_X8011-II_PCB_en.pdf - 第4页

T echnical Specifications # Viscom_SYS_X80 1 1-II_PCB_EN1 90900 09 Subject to tec hnical changes. Windows ® and Intel ® Core™ i7 are registered trademarks. Headquarters: Viscom A G Carl-Buderus-Straße 9 - 15 · 30455 Hano…

Brilliant Image Quality, Optimized Processes

Very long service life, flexible use

Powerful open microfocus

transmission tube; sealed

direct beam tube optional

Highest magnification

and excellent images

Use of high-quality

flat-screen detectors

Intuitive operation and

comprehensive analysis functions:

Viscom XMC and Viscom SI

Upgrade possible with Viscom

proprietary computed tomography

EasyClick principle for easy

mounting of handling units

Unique Quality Uplink for simplified

classification and process control

Worldwide competent on-site service

hotline and remote maintenance

THTs under angled

radiation

Fast automatic inspection and

highly precise random sample

checking in one system

In modern SMD production, components such as BGA, QFN or QFP are gain-

ing ground. Because their connectors are mostly hidden, many solder joints

can only be reliably checked with an X-ray inspection. The high resolution X-ray

inspection system X8011-II PCB was developed especially for these tasks. Typi-

cal applications are, for example, the inspection of electronic assemblies and

components, quality assurance in power electronics, or non-destructive spe-

cial inspections. With the X8011-II PCB, electronics manufacturers can

draw on the first-class automatic analysis routines of the Viscom AXI family

X7056 with this off-line solution as well. Through the simultaneous availability

of the automatic X-ray analysis (Viscom SI) and the manual or semi-automatic

inspection (Viscom XMC), this system offers the highest flexibility.

BGA under

angled radiation

QFP orthogonal

radiation

QFN orthogonal

radiation

XVR-CT analysis by Viscom

Brilliant Image Quality, Optimized Processes

First-class inspection results,

great system versatility

With the X8011-II PCB, Viscom offers a smart and economical X-ray inspection system. The

application scope reaches from random sample analysis and special inspection of indi-

vidual components up to automatic start-up support and small series inspection.

Thanks to integration of the proven automatic SI inspection analyses, the system is

ideally suited for high-mix low-volume manufacture.

The heart of the X-ray technology is the open Viscom microfocus transmis-

sion tube (up to 200 kV) with high resolution. Optionally, a sealed direct

beam tube (up to 130 kV), for example, can also be employed. Both tubes are

distinguished by their stable X-ray radiation during continuous opera-

tion. High resolution digital flat panel detectors are used for the

highest magnifications and optimum image quality for evaluation

of X-ray images. The practice-oriented, modular Viscom system concept

offers practically every individual user optimum inspection

possibilities.

The Viscom XMC software is available on the system for special

inspections or non-standard components. With the intuitive

operation and comprehensive analysis functions, the inspec-

tion objects can be easily and precisely checked. In addition, 3D

reconstruction with the Viscom proprietary XVR computed

tomography is also possible here. Thus, in addition to the

improved localization of defects, individual slices or section

images can also be visualized with this process.

The very special strength of the system is the fully automatic

X-ray analysis with the Viscom SI software. It combines over 30

years of experience in assembly inspection and is especially orient-

ed to SMD production. And so the well-known Viscom inspection

depth of the X7056 inline family is also available for the offline world.

Yet another advantage is the uniform user interface. This saves

training expense and facilitates communication between differ-

ent inspection systems.

The practical feature Viscom Quality Uplink can be used for the X8011-II

PCB. By linking the inspection results from SPI, AOI, AXI and MXI, this func-

tion provides a simplified classification and effective process control.

For example, all inspection data from the Viscom 3D solder paste inspection

can be displayed on the verification station of the X8011-II PCB. Defect causes

are easier to track down and process optimization is simplified. With these

features, the system X8011-II PCB offers many possibilities in high performance

X-ray inspection.

Viscom Quality Uplink:

SPI analyses/3D data

XVR-CT analysis by Viscom

Object table Rotation module Motorized rotation/tilt axis CT axis

Universal, versatile exchangeable modules for perfect sample handling

Technical Specifications

# Viscom_SYS_X8011-II_PCB_EN19090009

Subject to technical changes. Windows

and Intel

Core™ i7 are registered trademarks.

Headquarters:

Viscom AG

Carl-Buderus-Straße 9 - 15

· 30455 Hanover

· Germany

Tel.: +49 511 94996-0

Fax: +49 511 94996-900

info@viscom.com

www.viscom.com

You will find our international subsidiaries and

representatives in Europe, the USA and Asia at:

www.viscom.com

Dimensions in mm

Front view Side view Top view

X-ray technology

X-ray tube Sealed direct beam tube or open microfocus

transmission tube (optionally also TXD X-ray tube, < 1.5 µm)

High voltage 20 - 130 kV / 20 - 160 kV / 20 - 200 kV

X-ray current 50 - 300 µA / 5 - 1000 µA

Target power max. 20 W / max. 40 W max. 40 W

Geometric magnification max. 35 times / max. 2650 times max. 2650 times

Image converter High resolution High resolution

Diagonal 7.3" FPD, 14 bit 11" FPD, 14 bit

Proven resolution < 16 - 50 µm / < 4 µm / < 1.5 µm

(at 90 kV/80 µA)

Detector swivel range 0° 0 - 60° 0 - 60°

Additionally via the

rotation and tilt axis +/- 45° (90°)

X-ray cabinet

Designed to meet requirements for fully protected devices in accordance

with German Radiation Protection Act (StrlSchG), German Radiation Pro

tection Ordinance (StrlSchV), CE mark and additional international stan-

dards for worldwide use. Radiation leakage rate < 1 µSv/h

Software

User interface Viscom XMC / Viscom SI optional

Available software packages BGA analysis software

QFN analysis software

THT analysis software

ACA analysis software (surface analysis)

Fully automatic Viscom SI analysis software

XVR-CT software (planar, rotary)

Verification station Viscom HARAN

Viscom Quality Uplink to AOI, AXI, and SPI from Viscom

for process optimization

System computer

Operating system Windows

Monitor High-resolution 24" LCD display for special depiction of grayscale

values in the SMT and electronics sectors (DICOM Standard)

Inspection object handling

Manipulator X-Y-Z X-Y-Z plus rotation module

Max. table travel range Horizontal x/y-axis: 460 mm x 435 mm (18.1" x 17.1")

Vertical z-axis: 290 mm (11.4")

Max. rotation module travel range

−

Horizontal x/y-axis: 350 mm x 430 mm (13.8" x 16.9")

Vertical z-axis: 290 mm (11.4")

n x 360°

Inspection object weight Up to 10 kg (22 lbs) (with rotation module, 5 kg/11 lbs)

Sample change Motorized window opening

Optional additional axes available

Yes

Other system data

Power requirements 230 V (other voltages on request), 1P/N/PE, 16 A

System dimensions

Approx. 1144 mm x 2007 mm x 1420 mm (W x H x D) (45" x 79" x 55.9")

Weight Approx. 2100 kg (4630 lbs)

X8011-II PCB eco

X8011-II PCB plus X8011-II PCB ex