Valence-3508-Tech-Sheet-Revision-00-10.pdf
Selective Soldering System The Valence 3508 is designed for high mix, high volume, high level PCB production. The system is a continuous duty, multi-station, in-line selective soldering system utilizing an electromagneti…
Selective Soldering System
The Valence 3508 is designed for high mix, high volume, high level PCB production. The system is a
continuous duty, multi-station, in-line selective soldering system utilizing an electromagnetic pump.
The Valence 3508 can be programmed in minutes, and is highly configurable and customizable. With a
three-shift processing area and stainless steel ball screws, the Valence 3508 selective soldering system
increases production efficiency and reduces downtime associated with maintenance.
The system includes Hentec’s ConductorPRO™ software with free software upgrades, ProHeat™ in-
dependent programmable nitrogen heat control and proprietary Gaussian Miniwave tips. The Gaussian
Miniwave tips achieve an industry leading keep-away of 0.5 mm. The three-stage system provides flux,
top and bottom preheating, and soldering simultaneously lowering cycle time by as much as 40 percent.
Features
• Electromagnetic solder pump
• Digital pyrometer
• Top and bottom side preheat
• Top side preheat in
solder station
• Auto-load | In-line SMEMA
• High efficiency ball screw
• 3 stage system
• 508 mm (20 in.) process area
• 25 lbs. solder pot capacity
• Fiducial auto-correct
• 2 witness cameras with
monitors
• Closed loop wave height
sensor
Options
• Dual flux
• 2nd solder pot assembly
• Annual spare parts kit
• Self-contained N
2
generation
• Fume extraction system
• Extended warranty -
12 months
• Gaussian nozzles
• Large Gaussian
miniwave nozzles
Key Benefits
• Free software upgrades
• 2 year system warranty
• 4 year solder pot warranty
Operation
X/Y/Z Motion Control Closed Loop Servo Motors
Motion Type X/Y/Z Ball Screw
Accuracy Ball Screw | ± .002 in. (0.0508 mm)
Max Speed X/Y/Z axes 5 in. (127 mm) per second
Interpolated Motion Yes | Simultaneous X, Y and Z
Max Process Range 508 x 508 mm (20 x 20 in.)
Min/Max PCB Size 25.2 x 25.2 to 558.5 x 609.6 mm
(1 x 1 in. to 22 x 24 in.)
Load Method Automatic | In-line SMEMA
Solder Process Control
Approach 360° | Unlimited Access to All Solder Points
Nozzle Material Wetted Chromium Alloy
Nozzle Sizes (ID) 1.5, 2, 2.5, 3, 4, 5, 8, 10, 20 mm & custom
Keep-away 1.5 mm (0.159 in.) Standard
0.5 mm (0.19 in.) Capable
Max Wave Height 6 mm (0.236 in.) Standing Wave Height
Component Max Height 76.2 mm (3 in.) | Top & Bottom of PCB
Flux Process Control
Spray Fluxer 6-20 mm (0.236-0.787 in.)
No Solids Content Limitation
Drop Jet Fluxer 0.5-2 mm (0.196-0.059 in.)
14% Solids Max
Dual Fluxers / Chemistry* Two Independent Nozzles & Plumbing
Flux Capacity 1 Liter (0.264 gals.)
Pressurized (per tank)
Solder Pot Management
Solder Pot Capacity 11.4 kg | 25 lbs.
Temp Control PID proportioning (0-400°C) ± 2°C
Pump Style Electromagnetic Pump
Heat Time 50 Minutes
Dross Production 42.52 grams (<1.5 oz.) per 8 Hours
Maintenance Cycle NA
Nitrogen Management
N
2
Inertion Hentec ProHeat™
N
2
Temp Control 0-400 °C Closed Loop Set Point
Consumption | Purity 1.13 M
3
/hour
(40 CFH) @ <10 PPM O
2
Physical
Safety UL and CE Compliant
Dimensions 3429 x 1524 x 1524 mm
(135 x 60 x 60 in.)
Weight 1088 kg (2,400 lbs.)
Ship Weight 1570 kg (3,400 lbs.)
Electrical 208-240 VAC | 3-PH
3 Wire / 30 Amp
Air (CDA) 80 PSI
Nitrogen <10 PPM O
2
| 1.1 M
3
/hour (40 SCFH)
Exhaust <8.4 M
3
/hour (<5 SCFM)
SELECTIVE SOLDERING SYSTEM
© 2021 BTU International. | An AMTECH Company | All rights reserved.
Revision 0, 2021
Headquarters | United States
BTU International, Inc
23 Esquire Road
North Billerica, MA 01862, USA
T 1-978-667-4111
F 1-978-667-9068
E btuhq@btu.com
Asia Pacific
BTU Shanghai, China
T +86-21-58669098
F +86-21-58669231
E btuasia@btu.com
Europe
BTU Europe Ltd., UK
T +44 (0) 1252 660010
F +44 (0) 1252 660011
E sales@btu.co.uk
BTU is the exclusive distributor of Hentec Industries selective soldering, lead tinning and test products in Asia