PSV3500 Datasheet web.pdf
- Up to 700 parts/hour - Supports 2 FlashCORE III programmers (8 sockets) - Supports 1 LumenX programmer (8 sockets) A UT OMA TED PROGRAMMING WITH EASY CHANGEOVER PSV3500 The PSV3500 is the cost - eective entry point fo…
- Up to 700 parts/hour
- Supports 2 FlashCORE III
programmers (8 sockets)
- Supports 1 LumenX
programmer (8 sockets)
AUTOMATED PROGRAMMING
WITH EASY CHANGEOVER
PSV3500
The PSV3500 is the cost-eective entry point for high-quality
automated device programming for low volume applications.
Productive: Ideal for rst time automation
- Integrated media options
- Fiber laser & ink dot marking
- Parts down to 2 mm x 3 mm
- Large parts up to 42.5 mm x
42.5mm
FLEXIBLE OPTIONS
- Universal device support on
FlashCORE III
- Ultra-fast programming for
eMMC and UFS on LumenX
OPTIMIZED ALGORITHMS &
UNIVERSAL DEVICE SUPPORT
- HIC adapters for highest
programming yield
- Value added software
HIGHEST QUALITY
PROGRAMMING RESULTS
Reliable: Engineered for highest quality programming, uptime, & production yield
- Proven pick & place head,
programming engine &
handling software
INTELLIGENT SYSTEM
DESIGN & INTEGRATION
- +/- 30 micron for repeatable
precision placement
INTEGRATED VISION SYSTEM
FOR PRECISE PLACEMENT
- Signicantly reduce labor
cost
- Save up to 3x cost per
programmed part
LOWEST TOTAL COST
Aordable: High quality automated programming for the lowest cost per device
- Works with existing
FlashCORE & LumenX
adapters & algorithms
- Growing support for
LumenX ensures your
investment is protected
now and in the future
INVESTMENT PROTECTION
- Local service, engineering &
support
- Regional spare parts
GLOBAL SERVICE & SUPPORT
Redmond, WA
www.dataio.com
info@dataio.com
+1 800-3-DATAIO
DATA I/O CORPORATION
PRODUCTIVE.
RELIABLE.
AFFORDABLE.
• Throughput:
• Placement Accuracy:
• Pick-and-Place Method:
• Probe Stroke:
• Alignment:
• Regulatory Compliance:
DEVICE HANDLING SYSTEM
Americas
Data I/O Corporation
Redmond, Washington, USA
Website: www.dataio.com
Email: sales@dataio.com
Europe
Data I/O GmbH
Gräfelng, Germany
Website: www.dataio.de
Email: salesgmbh@data-io.de
Asia
Data I/O Electronics (Shanghai) Co. Ltd
Shanghai, China, PRC
Website: www.dataio.cn
Email: ChinaSales@dataio.cn
Handler rated up to 700 devices per hour
± .02 mm
Single-probe stepper actuated z-motion with
servo-drive theta (rotation axis)
50 mm (max)
Upward looking camera
CE Compliant, RoHS, WEEE
• System Software:
• Frame Dimensions:
• Shipping Dimensions:
• Net Weight:
• Shipping Weight:
TaskLink for Windows, CH700, Windows 10
1290 mm D x 870 mm W x 1520 mm H
(not including media I/O)
1310 mm D x 930 mm W x 1760 mm H
(not including media I/O)
450 kg (992 lbs)
550 kg (1212 lbs)
• Tape Input:
• Tape Output:
• Tray Feeder
Input/Output:
• Manual Tray:
• Tube Input
• Reject Bin
I/O MEDIA OPTIONS
8/12/16/24/32/44/56 mm
8mm - 44 mm (adjustable)
Supports up to 20 JEDEC Trays
Available without any special tooling
• Automotive Performance PAK
• NAND Flash Bad Block Management
• Serial Number Server
• ConneX® Service Software
• LumenX Software with:
VerifyBoost license available for UFS
Command Line Interface
• NexTeach Software
Any combination of input/output media I/O
VALUE ADDED SOFTWARE
• Fiber Laser Marker:
• Power:
• Ink Dot Marking:
DEVICE MARKING OPTION
Mark size as small as 1 mm x 1 mm
0 - 10 Watts
Marks parts as small as 4 mm x 4 mm
ADDITIONAL OPTIONS
• 2D Tape-out Inspection
• Integrated Ionizers
• Barcode Scanner
• PSV3500 Basic Spares Kit
• Spares Kit for PSV Options
• Operator Training
• Extended Service Contracts:
The rst year of support is included in the system purchase price and can
be extended via extended service support renewal. Data I/O oers a suite
of options to cover both hardware and system software (consumables are
not included).
SUPPORT OPTIONS & SERVICE
REQUIREMENTS
• Input Voltage:
• Operating Temperature:
• Humidity:
• Air Pressure:
• Air Flow:
208-240 VAC, 50/60 Hz, Single-phase
10 A Max
55°F to 86°F (+13°C to + 30°C)
35% to 90% RH Non-Condensing
80psi (5.5 bar)
6 SCFM (max)
Programmer:
• FlashCORE III
• LumenX®
Socketing Technology:
• Standard burn-in sockets (typically 5,000 - 10,000 insertions per socket)
• Medium Insertion Count (MIC) for BGA, QFN, QFP, SOP
(50,000 insertions per socket)
• High Insertion Count Sockets (HIC) for BGA, TSOP, QFP
(typically 100,000 to 250,000 insertions per socket)
Package Support:
PLCC, SOIC, SON, WSON, SSOP, CSP, BGA, uBGA and FPGA, QFP, TQFP, TSOP,
PoP, DIP and more
PROGRAMMING ENGINE, ADAPTERS & DEVICE SUPPORT
Universal Device Support:
• FlashCORE III: Flash Memory (NOR, NAND, MCP, MMC, e.MMC, SD,
MoviNAND, OneNAND, iNAND, Serial Flash, EEPROM, EPROM and more),
Microcontrollers and Logic devices (CPLD, FPGA’s, PLD’s) and more
• LumenX®: eMMC, UFS, SD, microcontrollers, and SPI NOR with support
for additional device technologies in process
Device Programming & Testing:
Program, continuity, checksum, blank check, mis-insertion, test, verify,
backwards device, two pass verify, ID check, Illegal bit-check
Updated: 6-6-24