Viscom_Brochure_Bond_S6056BO_en.pdf
Ideally suited for double tr ack operation and high thr oughput Pro ven Visc om machine design for a wide range of applications P er fect for large inspection objects High-per formance Visc om inspec tion soft ware Extre…
Ideally suited for double track
operation and high throughput
Proven Viscom machine design for a
wide range of applications
Perfect for large inspection objects
High-performance
Viscom inspection software
Extremely high accuracy
and inspection depth
Bond
With the inspection system S6056BO, Viscom offers the best
in-line technology and top performance for automatic optical
inspection of wire bonds. Where high throughput is a must, dou-
ble
track operation can significantly cut inspection times. The
system is particularly easy to customize beyond the standard
features. Thus, even large inspection objects can be reliably and
effectively inspected.
The high-precision inspection guarantees reliable defect detection
for ribbons, die, ball-wedge, wedge-wedge and security bonds.
The inspection scope can be individually adapted for further ap-
plications beyond the range of standard defects. Damaged and
misplaced components are also reliably detected. The high-per-
formance Viscom inspection software takes on combined inspec-
tion of wire bonds and SMD assembly. With the high resolution,
all bond sites and wires are detected. Wire path, dies and compo-
nent position are only a part of the inspection scope. It makes no
difference whether
the connections are of copper, aluminum or
gold, or whether ribbon
or thick or thin wires are involved.
With a high-power Viscom SPC evaluation, numerous conclusions
regarding the process can be made. As a result, defect causes are
reduced to increase production quality. Remote diagnosis, world-
wide maintenance and a Service hotline complete the offer.
www.viscom.com
High-Performance Automatic
Wire Bond Inspection
S6056BO
Defect detection on multiwire
connections and multiple loops
Bent wires
www.viscom.com
Headquarters: Viscom AG
·
Carl-Buderus-Straße 9 - 15
· 30455 Hanover
·
Tel. +49 511 94996-0
·
Fax +49 511 94996-900
·
info@viscom.com
·
www.viscom.com
You will find our international subsidiaries
and representatives under:
#Viscom_S6056BO_EN19100003 Subject to technical changes. Windows
®
and Intel® Core™ i7 are registered trademarks.
Dimensions in mm
Front view Top view
Technical Specifications
Side view
S6056BO
Transport system Single track Double track Dual shuttle
Inspection concept Single inspection
Inspection scope
Bond Ball bond, wedge bond, wire, die/SMD, ribbon
Camera technology
Standard conguration XM Bond HR*
Number of modules per machine 1
Number of cameras 1
Pixel size 4.5µm/pixel
Software
Software
User interface Viscom EasyPro
SPC Viscom SPC (statistical process control), open interface (optional)
Verification station
Viscom HARAN
Remote diagnosis Viscom SRC (software remote control) (optional)
Programming station Viscom PST34 (optional)
System computer
Operating system Windows®
Processor Intel® Core™ i7
Substrate handling
Max. substrate size 300 mm x 400 mm
(11.8" x 15.7") (L x W)*
290 mm x 200 mm
(11.4" x 7.9") (L x W)*
Transport clearance 860 - 1180 mm ± 20 mm (33.9" - 46.5" ± 0.8")
Substrate clamping Vacuum or mechanical clamping
Upper transport clearance
Up to 35mm (1.4")
Inspection speed
Up to 65 cm
2
/s, minimized handling time
Other system data
Positioning/handling unit Synchronous linear motors
Interfaces SMEMA, SV70, customer-specific
Power requirements 400 V (other voltages on request), 3P/N/PE, 8 A, 4 - 6 bar working pressure
System dimensions 1100 mm x 1650 mm x 1692 mm (43.3" x 65" x 66.6") (W x H x D)
Weight 1700kg (3748 lbs)
*Other camera technologies and substrate sizes on request