WisDuo - RAK3272S Breakout Board Datasheet LoRaWAN Module Specs.pdf
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RAK
3272
S Breakout Board Datasheet
Overview
Description
RAK
3272
S Breakout Board
is designed to provide easy access to the board's pins, streamlining development and testing. Its footprint enables
the RAK
3172
stamp module pins to be routed to
2
.
54
mm headers.
The board itself has the RAK
3172
at its core, integrating a
STM
32
WLE
5
CC
chip. It has an ultra-low power consumption of
1
.
69
uA in sleep mode.
This module complies with Class A, B, and C of LoRaWAN
1
.
0
.
3
speci
fi
cations. It also supports LoRa Point-to-Point (P
2
P) communication mode,
which helps you in implementing your own customized LoRa network quickly.
Features
Based on RAK
3172
Custom
fi
rmware using Arduino via RUI
3
API
I/O ports: UART/I
2
C/GPIO/SPI
Serial Wire Debug (SWD) interface
Module size:
25
.
4
mm x
32
.
3
mm
Ultra-low-power consumption of
1
.
69
uA in sleep mode
Supply Voltage:
2
.
0
V ~
3
.
6
V
Temperature Range: -
20
° C ~
85
° C
Speci
fi
cations
Overview
The top view of the RAK
3272
S Breakout Board is shown in
Figure
1
.
Figure
1
:
RAK
3272
S Top and Bottom View
Hardware
Page 1 of 6
Shenzhen RAKwireless Technology Co., Ltd.
Room 506, Bldg B, New Compark, Pingshan First Road, Taoyuan
Street, Nanshan District, Shenzhen, Guandong Province, The
People's Republic of China
www.RAKwireless.com
+86-755-86108311
inquiry@RAKwireless.com
The hardware speci
fi
cation is categorized into
fi
ve (
5
) parts. It discusses the interfacing, pinouts, and their corresponding functions and
diagrams. It also covers the electrical and mechanical parameters of the board, including the tabular data of the functionalities and standard
values.
Interface
SWD Programming Interface
When programming via a ST-Link tool, it is required to have the following four pins connected to your ST-Link tool:
3
V
3
SWDIO
SWCLK
GND
UART Interface
This board provides two UART interfaces:
UART
1
: Can be used for AT commands if con
fi
gured via RUI
3
Serial Port Mode.
UART
2
/LPUART
1
: Supports AT commands and
fi
rmware updates.
I
2
C and SPI Interface
Only one I
2
C and SPI interface of RAK
3272
S:
I
2
C
2
SPI
1
RF Interface
J
3
is soldered to the antenna connector. Depending on your choice, it comes with either SMA or IPEX style connector. Make sure to select the one
you need when ordering.
Pin De
fi
nition
Figure
2
:
RAK
3272
S Breakout Board Pinout
The tables below show the pin de
fi
nition of the RAK
3272
S Breakout Board:
J
5
Pin De
fi
nitions
Page 2 of 6
Shenzhen RAKwireless Technology Co., Ltd.
Room 506, Bldg B, New Compark, Pingshan First Road, Taoyuan
Street, Nanshan District, Shenzhen, Guandong Province, The
People's Republic of China
www.RAKwireless.com
+86-755-86108311
inquiry@RAKwireless.com
Pin No. Name Description STM
32
WLE
5
CC Pin
1
SPI_MOSI GPIO and SPI (MOSI) PA
7
2
SPI_MISO GPIO and SPI (MISO) PA
6
3
SPI_CLK GPIO and SPI (CLK) PA
5
4
SPI_CS GPIO and SPI (NSS) PA
4
5
UART
1
_RX UART
1
Interface PB
7
6
UART
1
_TX UART
1
Interface PB
6
7
GND Ground -
8
BOOT
0
Boot
0
mode enable pin - high active -
9 3
V
3
Power Supply -
J
4
Pin De
fi
nitions
Pin No. Name Description STM
32
WLE
5
CC Pin
1
I
2
C
2
_SDA I
2
C
2
interface PA
11
2
I
2
C
2
_SCL I
2
C
2
interface PA
12
3
RST MCU Reset -
4
GND Ground -
5
SWDIO SWD debug pin (SWDIO) PA
13
6
SWCLK SWD debug pin (SWCLK) PA
14
7
UART
2
_TX UART
2
/LPUART
1
Interface (AT Commands and FW Update) PA
2
8
UART
2
_RX UART
2
/LPUART
1
Interface (AT Commands and FW Update) PA
3
9 3
V
3
*Power Supply (check warning) -
WARNING
The J
4
pin de
fi
nition table applies to
RAK
3272
S VerC
. For
RAK
3272
S VerB
, note that
pin
9
is
not
3
V
3
but is instead
connected to PA
8
.
A dedicated internal SPI interface, called
SUBGHZSPI
, is used for communication with the RF subsystem of the
STM
32
WLE
5
CC
.
RF Characteristics
The RAK
3272
S module supports the LoRaWAN bands listed in the table below. When purchasing a RAK
3272
S module, ensure you specify the
correct core module,
RAK
3372
PL
or
RAK
3372
, based on your region. The
L
su
ffi
x indicates compatibility with low-frequency regions, while
modules without a su
ffi
x (
RAK
3172
P
) are designed for high-frequency regions.
Page 3 of 6
Shenzhen RAKwireless Technology Co., Ltd.
Room 506, Bldg B, New Compark, Pingshan First Road, Taoyuan
Street, Nanshan District, Shenzhen, Guandong Province, The
People's Republic of China
www.RAKwireless.com
+86-755-86108311
inquiry@RAKwireless.com