Nordson YESTECH FX-940.pdf
Nordson YESTECH’ s advanced megapixel color camera imaging technology offers high-speed PCB inspection with ex ceptional defect cov erage. With one top down viewing camera, four side viewing cameras and 3D inspection, th…
Nordson YESTECH’s advanced megapixel color camera
imaging technology offers high-speed PCB inspection with
exceptional defect coverage. With one top down viewing
camera, four side viewing cameras and 3D inspection, the
FX-940 inspects solder joints and verifies correct part assembly
enabling users to improve quality and increase throughput.
Programming the FX-940 is fast and intuitive. Operators
typically take less than 30 minutes to create a complete
inspection program including solder inspection. The FX-940
utilizes a standard package library to simplify training
and ensure program portability across manufacturing lines.
Advanced Fusion Lighting and newly available image processing
technology integrates several techniques, including 3D inspection,
color inspection, normalized correlation and rule-based
algorithms, to provide complete inspection coverage with an
unmatched low false failure rate.
Configurable for all line positions, the FX-940 is equally
effective for paste, pre / post-reflow and final assembly
inspection. Off-line programming maximizes machine
utilization and real-time SPC monitoring provides a valuable
yield enhancement solution.
Features:
• Proprietary megapixel color imaging
• Capture on the fly technology
• 1 top-down and 4 side angle cameras
• Quick set-up
• High speed
• High defect coverage / low false failure
• Optional 3D inspection
Automated Inspection for:
• Solder defects
• Lead defects / lifted leads
• Component presence and position
• Correct part / polarity
• Through-hole parts
• Co-planarity of chips, BGAs and other height
sensitive devices
FX-940 AOI
In-line PCB inspection
NYT-FX-940_DS(15)r2_Layout 1 2/19/15 7:24 AM Page 1
Nordson YESTECH
USA Headquarters:
2762 Loker Ave. West
Carlsbad, CA USA 92010
+1.760.918.8471 Phone
+1.760.918.8472 Fax
China:
#137 Guoshoujing Road
Zhangjiang Hi-Tech Park
Pudong,
Shanghai 201203, P.R.China
+86.21.3866.9166 Phone
+86.21.3866.9199 Fax
SE Asia:
2 Corporation Road
#03-11/12
Corporation Place 618494
Singapore
+65 6749 0538 Phone
+65 6552 7116 Fax
Europe:
62 Basepoint
1 Winnall Valley Road
Winchester
Hampshire, SO23 0LD, UK
+44 (0) 1962 832654 Phone
+44 (0) 1962 832501 Fax
Japan:
TOC Ariake Building
West Tower 17F
3-5-7 Koto-ku Ariake
Tokyo, 135-0063, Japan
+81 3 5762 2801 Phone
+81 3 5762 2802 Fax
Nordson YESTECH
USA Headquarters
2762 Loker Ave. West
Carlsbad, CA USA 92010
+1.760.918.8471 Phone
+1.760.918.8472 Fax
sales@nordsonyestech.com
www.nordsonyestech.com
Copyright © 2015 Nordson YESTECH
Specifications
Model
FX-940 Multi-function system with top-down viewing,
Capture on the fly technology
Optional Upgrades: 4 side angle cameras
Digital Fringe Projection 3D Inspection
Specifications
Throughput: Up to 30 sq. in./sec. > 1.5 million components per hour
Maximum Board Size: 20” x 21” (500mm x 525mm)
Clearance: 2” (50mm) top and bottom
Minimum Component Size: 0201; 01005 with high magnification option
False Calls: <500 PPM (<0.05% typical)
Defects Detected: Part: position, missing, wrong, polarity,
skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
Software
Algorithms: Color, OCV, OCR, barcode recognition, both image and
rule-based algorithms. Optional 3D
Data Requirements: ASCII Text, X-Y position, part #, ref. #, polarity
CAD Translation Package: Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Programming Skill Level: Technician or operator
Operating System: Windows 7
Off-line Software: Optional - Rework, Review and Program Creation
SPC Software: Optional - Real-time local and remote monitoring of first
pass yield, defect trends, and machine utilization.
Data Outputs: Text, SQL, ODBC, MS Access
Hardware
Material Handling: SMEMA, dual direction auto width conveyor,
pass / fail signals, board clamping
Lighting: Proprietary Fusion Lighting
™
multiangle LED
Imager: Up to 18 megapixel color camera sensor
25, 12 or 8 micron pixel size
Options
Conveyor: Dual lane conveyor, heavy duty chain conveyor and 3 stage
Large Board Option Optional 48” x 21” (1219mm x 510mm)
Bottom Side Camera: Optional for bottom side bar codes
Board Supports: Bottom side
Facilities
Power: 110-220VAC, 50/60 Hz, 15 amps
Air input: 60 PSI min., 1/4” air hose, 2 CFM
Footprint: 39” x 52” x 60” (1000mm x 1329mm x 1531mm)
Weight: 950 lbs (430 kg)
Machine Installation: < 1 hour
FX-940 AOI In-line PCB inspection
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