Essemtec_-_Archerfish_All-in-One_Production_Brochure_EN.pdf - 第4页
Wildlife consistently shows us with br eathtaking flexibilit y how nature can adapt itself to the many dier ent demands of it s environment; that is what inspires us! Essemtec A G is a company with its development and pr…
UNIQUE SOLUTION FOR
ELECTRONIC PRODUCTION
Solder Paste Jetting, Glue Jetting, Pick and Place & other
process solutions combined on a single platform.
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Placement, solder paste & other jet dispensing
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Up to 4 placement-axes and 3 dispense processes
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Monitoring sizes, volume & weight of jetted dots
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Process control adjustment and dot stabilisation
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Improve time to market/ NPI/ Immediate repair
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No waiting for stencil, process variation adaptation
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Jetting in cavities, Pin in paste jetting
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PCB design freedom - all programmable
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2.5D placement and dispensing applications
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Gerber ile conversion and CAD data import
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One click production ile generator
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Real time visualisation
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Connectivity SECS/GEM, iTac, OIC, Hermes
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One space saving platform for all processes
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Decrease of costs (no additional printer or stencils)
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Zero changeover time
combined all-in-one.
process control
.
highest flexibility.
software for all processes.
cost optimization.
COMPATIBLE WITH ALL
ADVANCED ESSEMTEC
PLATFORMS
EXPANSION IN ANY DIRECTION.
ADAPTIVE FROM PROTOTYPING
TO HIGH SPEED PRODUCTION.
Dynamic Shockwave Technology. Adaptable for
different jettable pastes (T4-7). Adaptable for special
applications (nozzle, tappet, temperature etc.).
Adaptable with needles for deep cavities. Super fast
Plug n‘ Play change of luidic and settings.
The systems grow synchronously with the custo-
mer’s requirements for performance and processes.
Conigurable heads with 1-4 placement-axes. Multi
lexible feeder concept for up to 280 lanes. Largest
component spectrum 008004 up to 80 x 80 mm.
Wide range of dispensing applications such as
SMT Glue, LED Encapsulation, Silver Epoxy, Dam
and Fill, Underill, Cavity Fill, 2.5D dispensing and
more. Process parameters can be changed freely
and optimized for any particular process.
optional.
solder paste jetting. pick and place. other dispensing solutions.
Glue Jet Solder Paste Time Pressure Screw Volume
Valve Jet Valve Valve Valve Valve
Full process control & traceabilty meeting automotive standards, Adaptation &
stabilisation, Integration & datatransfer of existing pick&place machines as Diplan,
UniCam, Cogiscan etc., Cleaning Station, High Precision Scale, Heat-/Vacuum Tables
Media Heating Needle and jet heating system
Level Detection Automatic syringe level detection
Integrated Inspection 2D defect detection for dispensing & pick and place
Increase Boardsize Table extension to increase the processable board size
Wildlife consistently shows us with breathtaking flexibility how nature can
adapt itself to the many dierent demands of its environment; that is what
inspires us! Essemtec AG is a company with its development and production
site in Switzerland. The product portfolio comprises of production equipment
for electronic assembly and more. Our high-tech solutions can be adjusted
quickly and easily to meet wide ranging requirements; we are therefore able to
respond to all manner of customer requests. That’s why “naturally adaptive” is
our motto across all ranges.
Disclaimer & Copyright:
Information in this brochure is for general information purpose only. Further
details are provided in the specification sheet. All materials contained in this
brochure are copyright © Essemtec AG, Switzerland, January 2024.
dispensing.
Optimum speed (dots/h) Glue Jet: > 720’000
Time-Pressure: 28’000
Volume: 24’000
Screw: 24’000
Dispense mode Dot, line, curve,
interpolated 2.5D contour
Placement XY dots 40 µm (3σ)
solder paste jetting.
Viscosity range < 2’000’000 mPa
*
s
Min. possible dot Ø / volume >200 µm / > 2.5 nl
Optimum speed Valve up to 720‘000 dots/h
Useable solder pastes Type 4-7 (jettable)
Valve heater Included, max. 60°C
Useable cartridge sizes 5 ccm / 10 ccm / 30 ccm
FROM NPI TO MID RANGE,
UP TO INTEGRATION IN
HIGH SPEED LINES
pick and place. puma.
2
(up to 2 valves)
puma.
4
(up to 1 valve)
fox.
2
(up to 1 valve)
Optimum placement speed 11’200 cph (2-axes) 18’100 cph (4-axes) 12’000 cph (2-axes)
Feeder capacity 8 mm tape 260 (140 inline) 280 (160 inline) 180 (120 inline)
Component size range 008004 (imp.) up to 80 x 80 mm (Note specs for details)
Placement accuracy (x, y) Chip ± 40 µm (3σ) / QFP ± 30 µm (3σ)
Max. PCB dimensions 560 x 610 / 1’800 x 610 mm 560 x 610 / 1’800 x 610 mm 406 x 305 mm
Machine footprint 1’557 x 1’357 mm (61 x 53“) 1’557 x 1’357 mm (61 x 53“) 880 x 1’090 mm (34.7 x 43“)
Vapor Phase
All-In-One
Jet Printer
Glue Jetter
Pick&Place
Inline Production
OUR FOCUS - YOUR SOLUTION
SMART SMT EQUIPMENT
Switzerland
Essemtec AG
Mosenstrasse 20
CH-6287 Aesch/LU
Tel: +41 41 919 60 60
essemtec.info@nano-di.com
Germany
Essemtec GmbH
Taunusstrasse 21
DE-80807 Munich
Tel: +49 893 803 55 15
essemtec.info@nano-di.com
France
Essemtec SAS
50, Avenue d‘Alsace
FR-68000 Colmar
Tel: +33 640 658 406
essemtec.info@nano-di.com
America
Essemtec USA LLC
300 5th Ave, Suite 1010
Waltham, MA 02451
Tel: +1 856 218 11 31
essemtec.sales-usa@nano-di.com