Viscom_Brochure_iX7059_Heavy_Duty_en.pdf - 第4页

iX7059 Heavy Duty Inspec tion X-ra y technology X-ra y tube Sealed microfocus X -ray tube High voltage 130 kV (up to 180 kV optional) T ube current 300 µA (500 µA) Detector Flat panel detector FPD type T2 (optional T3), …

Power electronics are a key component in the elds of

electromobility, telecommunications and renewable energies.

Fully automated 3D X-ray inspection is the rst choice when it

comes to ensuring that high-power electronics components

function perfectly. Ultimately, targeted inspection is the only way

to guarantee the awless product quality needed to ensure the

necessary high eciency and functional reliability over the long

term. iX7059 Heavy Duty Inspection is an advanced inline X-ray

solution that uses innovative inspection technology and a special

handling concept to inspect electronic assemblies and mechanical

components on goods carriers.

Fully Automatic Inspection for Solid

Inspection Objects on Workpiece Carriers

Reliable inspection for heavy, solid and encased components

thanks to powerful X-rays

Precise solder joint inspection of power electronics protects

against overheating

Intelligent void check – identifying and measuring air inclusions

for awless heat dissipation

Maximum-speed 3D X-ray technology combined with special

handling concept meets the highest throughput requirements

Inline system with minimal footprint

Intuitive operating software for fast programming and

extremely simple verication

Service, hotline support and remote maintenance worldwide

Poor THT solder joint, insufficient degree

of filling

Head-in-pillow defect

Poor QFN, insufficient solder volume

Transformer including THT terminals

with varying fill levels

STRONG, PRECISE, RELIABLE

Special transport concept for handling assemblies on workpiece

carriers or in solder frames

Depending on the application, the complex inspection

objects can be irradiated with 130kV or, as an option, up to

180kV.

As a result, the high-performance X-ray tube can be

used to

reliably inspect extremely solid electronics without

damag

ing the components. The 3D technology produces

the best

analysis results based on the uniquely fast image

acquisition approach

Evolution 5.

In cases where high currents are owing or are converted,

defective solder joints can subsequently lead to over-

heating if they are too slender, for example. Hollow areas,

known as voids, in surface solder joints, can lead to over-

heating if there is an excessive number of them or their

diameter is too large. The broad inspection scope of the

iX7059 Heavy Duty Inspection system extends to damage,

twisted, missing or incorrect components, concealed blow

holes/voids as well as the degree of lling and pin heights

of THT solder jonts.

The high-precision system stands out thanks to a resolu-

tion of 8 μm to 30 μm, depending on the conguration.

The integrated computer tomography (optional) delivers

excellent images of layers in premium quality, making

verication very easy. Inspection objects and workpiece

carriers with dimensions of up to 500 mm x 500mm and

a weight of up to 40kg can be inspected for all defects,

completely automatically and at high throughput rates.

The system can be seamlessly integrated into the pro-

duction line or nal assembly line, and networking to

implement smart factory concepts is also an option.

Invest in cutting-edge 3D X-ray technology, custom-

designed for the requirements of power electronics,

e.g. especially for electric vehicles (EV)

The iX7059 Heavy Duty Inspection was designed

especially for high-precision, rapid inspection of large

assemblies including, for example, high-voltage/power

electronics which are integrated in sensitive and safe-

ty-relevant end products. Essential criteria include here

perfect safety, lasting functionality and high reliability.

The machine is based on a compact system design,

perfect-t transport for large, heavy inspection objects

on workpiece carriers and uniquely powerful 3D X-ray

technology with high levels of radiation.

iX7059 Heavy Duty Inspection

X-ray technology

X-ray tube Sealed microfocus X-ray tube

High voltage 130 kV (up to 180 kV optional)

Tube current 300 µA (500 µA)

Detector Flat panel detector FPD type T2 (optional T3), 14-bit grayscale value depth

Resolution 8 - 30 µm/pixel*

X-ray cabinet Designed to meet requirements for fully protected devices in accordance with

German Radiation Protection Act (StrlSchG) and German Radiation Protection

Ordinance (StrlSchV). Radiation leakage rate < 1µSv/h

Detector configuration 1 FPD on xy-table

Software

User interface Viscom vVision/EasyPro

Statistical process control Viscom vSPC/SPC, open interface (optional)

Verification station Viscom vVerify/HARAN

Remote diagnosis Viscom SRC (optional)

Programming station Viscom PST34 (optional)

Operating system Windows®

Processor Intel® Core™ i7

Inspection object/

workpiece carrier

handling

Inspection object size Up to 500mm x 500mm (19.7" x 19.7") (L x W)*

Inspection object weight Up to 40kg (88.2 lbs)

Transfer height 860 - 980mm ± 20mm (33.9" - 38.6" ± 0.8")

Width adjustment Via manual adjustment

Support area 50mm (2")

Upper transport clearance 150 mm (5.9") as standard, more on request

Lower transport clearance 50 mm (2")

Other system data

Positioning unit Synchronous linear motor

Interfaces SMEMA, IPC Hermes (optional)

Power requirements 400V (other voltages on request), 3P/N/PE, 8A, 4-6bar working pressure

System dimensions 1493 mm x 1654 mm x 2207 mm (58.8" x 65.1" x 86.9") (W x H x D)

Line integration dimension +30mm (1.2") on both sides

Weight 2245kg (4949 lbs)*

Dimensions in mm

Front view Top view

Technical Specifications

Side view

www.viscom.com

Headquarters: Viscom AG

Carl-Buderus-Str. 9 - 15

· 30455 Hanover, Germany

Phone +49 511 94996-0

Fax +49 511 94996-900

info@viscom.com

You will find our international subsidiaries and

representatives at:

*Depending on the configuration