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Brilliant image quality , easiest oper ation, comprehensiv e analysis The X8068 reliably inspects the entire range of inspection objects up to a diameter of 722 mm (28.4"). The open X-ray tube ensures the high- est …

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Fast, Convenient, High Performance
Two inspection concepts in one system:
Viscom XMC and Viscom SI
Powerful open
microfocus transmission tube
Flat panel detectors for
brilliant image quality
Highest magnifications
Suited for large and heavy
inspection objects up to a
diameter of 722 mm (28.4")
Intuitive operation and
comprehensive analysis functions
Unique Quality Uplink for simplified
classification and process control
Worldwide, competent service on-site,
hotline and remote maintenance
Use of planar and rotative
XVR-CT software from Viscom
BGA overview under
angled radiation
High resolution
X-ray inspection –
made by Viscom
Whether hidden soldered connections in SMD assembly, power electronics
or non-destructive testing of non-standard components – the X-ray inspec-
tion system X8068 guarantees the highest flexibility. The application scope
reaches from random sample analysis and special inspection of individual
components, up to automatic start-up support and series inspection. Even
large inspection objects, such as printed circuit board panels, are inspected
quickly and reliably. The brilliant image quality, automatic analysis routines
and convenient operation make this system the reliable partner in quality
control.
QFP orthogonally
radiated
BGA defect analysis
QFP under angled
radiation
Brilliant image quality,
easiest operation,
comprehensive analysis
The X8068 reliably inspects the entire range of inspection objects up
to a diameter of 722 mm (28.4"). The open X-ray tube ensures the high-
est resolution and detail recognition in first-class image
quality. Thus even the smallest defective structures are reliably de-
tected. The system delivers with a mature technology which
demonstrates its full strength in the interaction of all the hard-
ware and software components. The user-friendly new IPS
monitor depicts the X-ray results in the best quality, inde-
pendent of the viewing angle. In order to attain the largest
possible inspection area, the detector swivel range is up to
60 degrees. System operation is easy and convenient.
The special strength of the X8068: It combines two in-
spection concepts, Viscom XMC and Viscom SI, in one
inspection system. Therefore the Viscom XMC software
is available for special inspections or non-standard
components. Thanks to intuitive operation and com-
prehensive automatic analysis functions, inspection
objects can be quickly and precisely checked. In addi-
tion, 3D reconstruction with the Viscom proprietary
XVR computed tomography is also possible here. Thus,
in addition to the improved localization of defects, indi-
vidual slices or section images can also be visualized
with this process.
The proven SI software of the Viscom X7056 family is em-
ployed for the fully automatic X-ray analysis. It culminates
over 30 years‘ experience in assembly inspection and is spe-
cially suited for SMD production. This means the unique Viscom
Quality Uplink can also be used. Through the linking of inspec-
tion results from SPI, AOI, AXI and MXI, this function provides a
simplified classification and effective process control. For ex-
ample, all inspection data from the Viscom 3D solder paste inspection
can be displayed on the verification station of the X8068. Defect causes
are easier to track down and process optimization is simplified.
Closed Loop
SPI/Print SPI/P&P
SPI-MXI-UplinkSPI-AOI-/AXI-Uplink
# Viscom_SYS_X8068_EN19090009
Specifications subject to change without notice. Windows® and Intel® Core™ i7 are registered trademarks.
Headquarters:
Viscom AG
Carl-Buderus-Straße 9 - 15 · 30455 Hanover · Germany
Tel.: +49 511 94996-0 · Fax: +49 511 94996-900
info@viscom.com · www.viscom.com
Visit our website to find international subsidiaries and
representatives in Europe, USA and Asia:
www.viscom.com
Technical Specifications
X8068
X-ray technology
X-ray tube Open microfocus transmission tube Viscom XT9160 T-ED
(other X-ray tubes available upon request)
High voltage 20 - 160 kV
Tube current 5 - 1000 µA
Target power Max. 40 W
Geometric magnification > 2500 times
Proven resolution < 4 µm
(at 90 kV/80 µA)
Image converter diagonal 7.3" or 11.0" FPD, 14 Bit
X-ray cabinet Designed to meet requirements for fully protected devices in
accordance with German Radiation Protection Act (StrlSchG),
German Radiation Protection Ordinance (StrlSchV), CE mark
and additional international standards for worldwide use.
Radiation leakage rate < 1 µSv/h
Software
User interface Viscom XMC / Viscom SI optional
Available software packages
BGA analysis software
QFN analysis software
THT analysis software
ACA analysis software (surface analysis)
Fully automatic Viscom SI analysis software
XVR-CT software (planar, rotary)
Verification station Viscom HARAN
Viscom Quality Uplink to AOI, AXI, and SPI from Viscom
for process optimization
System computer
Operating system Windows
®
Monitor High-resolution 24" LCD display for special depiction of grayscale
values in the SMT and electronics sectors (DICOM Standard)
Inspection object handling
Manipulator 5 axes with sample table
Horizontal x/y-axis Travel range: 720 mm x 1000 mm (28.4" x 39.4")
Vertical z-axis Travel range: 320 mm (12.6")
Detector axis 0° - 60° pivoting
Rotational axis n x 360°
Inspection object size Up to 722 mm (28.4") (diameter)
Inspection object weight Up to 15 kg (33 Ibs)
Sample change Motorized window opening
Optional additional axes Yes
available
Other system data
Power requirements 230 V (other voltages on request), 1P/N/PE, 16 A
System dimensions 1859 mm x 2202 mm x 2155 mm
(73.19" x 86.69" x 84.84") (W x H x D)
Weight < 3200 kg (7055 Ibs)
Dimensions in mm
Front view
Side view Top view