Operation-Spec-Oxford-System-100-Rev-C.pdf - 第3页
Oxford Instruments Plasmalab 100 ICP-RIE Page 3 of 8

Oxford Instruments Plasmalab 100 ICP-RIE
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3. Ready sample and close the chamber:
a. If your sample is not a standard 4-inch wafer, use Kapton tape to mount it to the
carrier wafer.
i. Ensure the sample is away from the outside edge of the carrier wafer.
The clamp may hit your sample if it is mounted too close to the edge.
b. Place the wafer into the loadlock.
i. Ensure the wafer is sitting flat and that the round edge is touching the
two circular knobs.
ii. If the carrier wafer has a major flat, face it to the right (towards the
process chamber).
c. Close the loadlock door.
d. Press “STOP” on the pump menu.
4. Load, edit, and run your recipe:
a. Select “PROCESS” in the top left of the screen.
b. Select “Recipes”
c. Select “Load”
d. Select “YES” to overwrite the current recipe. This does NOT delete the recipe; it
loads a new one.
i. The prompts for overwriting a recipe and loading a new one are similar
and can be easily confused. Look at which action is highlighted (load or
save) before proceeding.
e. Select desired recipe from the list.
f. To edit a recipe, right-click a recipe step and select “Edit Recipe”.
i. Time is in “hh:mm:ss”.
ii. See “Appendix A - Recipe Parameter Information” for recipe constraints.
g. Select “RUN” when the recipe is ready.
i. ALWAYS ENTER A WAFER NAME. Not naming a wafer can cause
software errors.
ii. The system will automatically evacuate the loadlock, move the sample
into the process chamber, and begin the recipe.
5. While running the recipe:
a. Notice that at the top left of the “Process” => “Chamber 1” screen, there is a box
that shows the current running recipe name, recipe step, and step time left in
hh:mm:ss.
b. Fill out the logbook as your recipe is running.
6. Unload your sample:
a. Before venting, visually confirm the sample is in the loadlock, and that the tool is
finished moving.
b. Follow the instructions above to vent the loadlock and unload the sample.
c. Place the carrier wafer back into the loadlock.
7. Run a chamber clean:
a. Load and run the “OPT-CHAMBER O2 CLEAN” recipe.
b. Ensure the LN2 valve is open to allow cooling of the chamber substrate before
beginning this recipe.
i. You may log out of the tool as the clean is running.
c. Close the LN2 when the recipe is finished.
8. Log out:
a. Click “System” then Password”.
b. Click “Verify” then “OK”.
Oxford Instruments Plasmalab 100 ICP-RIE
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Oxford Instruments Plasmalab 100 ICP-RIE
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V. SIGNATURES AND REVISION HISTORY
a. Author of this document: Elijah Colter
b. Author Title or Role: Student Technician
c. Date: 10 January 2022
d. Revision: C
e. Revision notes: Re-formatted and clarified operation instructions
Approvals:
Technical Manager Signature: ___Sandra G Malhotra_____________________________
Date: ____1/10/2022_______________________________________
Revision History:
Revision
Author
Date
Original Issue
L. Rehn
03 April 2014
Rev A
E. Morse
21 October 2019
Rev B
E. Morse
15 January 2020
Rev C
Elijah Colter
10 January 2022
Rev D
Rev E