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HiSOL Probe Syste m Products

HiSOL ProbeSystemProducts

● Wafersize2”to12”
● ManualandSemi‐automatic
● Ultralow currentmeasurementinfAlevel
● Low capacitancemeasurementinfF level
● Highfrequency measurementupto67GHz
● Thermaltestfrom‐65゜Cto+400゜C(Atmospheric)
● Thermaltestfrom 4kto+500゜C(Vacuum)
● 1/fnoise,RTNmeasurement
● PulseI‐Vtest,Ultra
highspeedI‐Vtest
● Highcurrentmeasurement(~200Apulse)
● Highvoltagemeasurement(~10kV)
● Electrostaticdischarge(ESD)evaluation
● Failureanalysis
● Magneticstimulation measurement
● Optoelectronics (VCSEL,PDetc.)measurement
● Waferlevelreliabilitytest (EM/TDDB/HCI/NBTI/BT)
From
From
UltraLow
UltraLow
SignaltoHighPower
SignaltoHighPower
test
test
,
,
FromDC
FromDC
,
,
I
I
‐
‐
V
V
,
,
C
C
‐
‐
V
V
m
m
easurement
easurement
toRF
toRF
m
m
easurement
easurement
OurProbingSolutions
WeofferyouanalysisprobesystemsforsemiconductorandFPD (Flat‐paneldisplay).
Wecanprovidevariousprobesystemsfromaffordablecompactmanual probersforR&Dtohigh‐end
300mmsemi‐automatic probesystemfor‐65゜Cto+300゜Cthermaltest.
Wecancustomizethemostsuitableprobing solutionthatmatchestoyourmeasurement
application.
Ourprobesystemscorrespondtowidevarietyofapplicationfrom ultra lowsignaltesttohighpower
devicetest,fromDCparametric measurementtoRFmeasurement,waferlevelreliabilitytest,
magnetic fieldimpressionmeasurement,andopticaldevicemeasurement.
WesupportyourdevelopmentofR&Dandtechnicalimprovement.
HiSOL,Inc.isacertifiedsolutionpartnercompany
ofKEYSIGHTTechnologies
ManualProber
Semi‐AutomaticProber
ProbeSystemforFPD
Vacuumprobesystem
Specialty Probesystem
Accessories
Applications
2

3
4inch 6inch
Model HMP-400 / HMP-600
・
Model HMP-400 is for 4" wafers.
・
Model HMP-600 is for 6" wafers.
BestsellingCompactManualProber
ThisisacompactmanualproberforR&Dthatsupportswafermeasurementsrangingfromsmallchip upto4” or6” wafers.
Proberiscapableofmeasuringultra low curren tsonthefAlevelorlowcapacitanceonthepFlevelbyselectingappropriate
options.
Hightemperaturetestscanbealsomadebyincorporatingahotchuck
thatsupportsatemperaturerangefrom
roomtemperature to+300°C.
‐ UltralowsignalI‐Vmeasurements(fAlevel)
‐ VariousC‐Vmeasurements(quasi‐staticC‐V,HF‐CV)
‐ 4‐terminalresistancemeasurements
‐ Temperaturecharacteristicstestsinrangefromroomtemperature to
+200°Cor+300°C
‐ Mountsinglovebox
‐ Probecardsupport
‐ RFmeasurements(upto67 GHz)
‐ Ultrahigh‐speedI‐Vmeasurements
‐ High‐powerdevicemeasurements
(100Apulse,±3kVtriaxial,±10kVcoaxial)
‐ Light‐receiving/emittingcharacteristicsevaluationapplicationsfor
optoelectronics (suchasLED,
LD,VCSEL,andPD)
Extended applications
Applications
■ MANUAL PROBER
Wafer Size
X‐Ycoarsetravel
X‐Yfinetravel
θ travel
PlatenZaxisaction
Unitdimension(W×D×H)*
Weight*
PlatenZaxisadjustment
HMP‐400 HMP‐600
upto φ100mm upto φ150mm
X:105mm,Y:150mm X:155mm,Y:200mm
350×390×450mm
390×450×450mm
28kg 36kg
XY:13mm / Micrometerhead
coarse±30°,fine±2.5°
0‐ 20mmfree
0~15mm
*Itemswithasteriskvarydependingonsystemconfiguration.
ManualProber