Viscom_Brochure_AOI_S3088_ultra_with_gold_en.pdf - 第4页

Dimensions in mm Front view Side view T op view Headquarters: Viscom A G Carl-Buderus-Straße 9 - 15 · 30455 Hanover · Germany T el.: +49 51 1 94996-0 · Fax: +49 51 1 94996-90 0 info@viscom.com · www.viscom.com www .visco…

High-speed solder joint inspection

Highest inspection depth

Simple operation

Fast, precise, and virtually shadow-free

3D analyses with high-performance

sensor technology for rapid throughputs

Unique analysis of

QFN, DFN, and QFP dewetting

using angled views

Resolution of up to 8 µm –

reliable 03015 inspection

Simple operation,

fast inspection program generation

Confirmed zero defect escape

thanks to Integrated Verification

Viscom FastFlow Handling –

PCB change in up to 2.5 s

Powerful add-on modules:

verification, off-line programming,

and SPC evaluation

Worldwide, competent service on-site,

by hotline, remote maintenance, and

customer support area on the

Viscom website

In today‘s electronics manufacturing environment,

reliable and economical quality assurance is demand-

ed. AOI systems must be adaptable to a wide variety of

requirements. In addition, the operation must be simple

and intuitive while the inspection depth is first-class, reli-

ably covering the most up-to-date component generations in

compliance with IPC standards. All of this is combined in the

S3088 ultra – and much more: The performance is further in-

creased with the camera module XMplus in the S3088 ultra gold

model. The ideal relation of high throughput and high resolution

achieved in this system has yet to find its equal. Combination with intel-

ligent software add-ons and the Viscom Quality Uplink results in the op-

timal solution for electronics assembly and process control.

Maximum Output with a Minimum Footprint

Clear overview at the

verification station vVerify

Lifted lead, angled view

Tombstone in 3D view

Wrong polarity

Versatile configuration possibilities with latest

high-performance sensor technology

for a first-class throughput

The S3088 ultra combines the flexibility of the Viscom S3088 AOI family with

the overall convincing strengths of the high-performance camera mod-

ules XM and XMplus. Their sensor technology makes very fast inspec-

tions possible, both for high-resolution views as well as for color

3D analyses. The image data rate achieves up to 3.6 gigapixels

per second.

The high-performance 3D sensor technology works with an

integrated structured light projector. This unique solution

provides the possibility to use up to 9 cameras. This guaran-

tees virtually shadow-free 3D inspection and is the only

way to uniformly inspect the same component types on an

electronics assembly.

In addition to the orthogonal image acquisition, Viscom

uses angled camera views. This requires technically

fully-developed solutions, as for example maximum

sharpness over the entire field of view. This is the

only way to reliably detect dewetting on QFPs and typical

defects on QFNs and DFNs. Other 3D solutions and pure

orthogonal inspections fail here.

With a field of view of 50 mm x 50 mm and an inspection

speed of up to 65 cm

/s, the 3088 ultra gold model has

been designed to satisfy highest throughput demands.

Every S3088 ultra can be operated through the user

software EasyPro and using vVision. This guarantees

intuitive control and simple inspection program

generation . In connection with intelligent Viscom soft-

ware add-ons such as Extended Lifted Lead Detection ,

Integrated Verification or Viscom Quality Uplink, the

full potential of the AOI system can be completely utilized.

A further highlight is the Viscom FastFlow Handling. The

high-speed transport facilitates interference-free and extreme-

ly high throughput, thanks to the synchronous input and output

of assemblies, with a transfer time of as little as 2.5 seconds.

Together with the high-speed 3D sensor technology, extreme

cycle time requirements are met exceptionally well.

As a central feature, the integrated defect verification simplifies

the reduction of pseudo defects and offers a convenient tool to ensure

a zero defect escape strategy. Thus, the quality of the inspection pro-

grams can be confirmed quickly and easily at any time, whether for in-

house production needs or documentation during customer audits. If Viscom

SPI/AXI/MXI are used in addition to Viscom AOI, the Quality Uplink provides a

unique tool to link all inspection results. This avoids wrong defect classifica-

tions, facilitates optimization of product-specific inspection strategies and provides

an effective process control mechanism. Powerful add-on modules like verifica-

tion, off-line programming and SPC evaluation round out the offer.

Maximum Output with a Minimum Footprint

Dimensions in mm

Front view Side view Top view

Headquarters:

Viscom AG

Carl-Buderus-Straße 9 - 15

· 30455 Hanover · Germany

Tel.: +49 511 94996-0

Fax: +49 511 94996-900

info@viscom.com

www.viscom.com

Technical Specifications

S3088 ultra

S3088 ultra gold

Visit our website to find international subsidiaries and

representatives in Europe, USA and Asia:

and Intel

Core™ i7 are registered trademarks.

# Viscom_SYS_S3088_ultra_EN21100013

Inspection scope

Solder joints, placement, solder paste

Camera technology XM XMplus

Total number of megapixels Up to 65 Up to 121

3D sensor technology

Z-resolution 0.5 μm

Z-range Up to 30 mm (1.2")

Angled view cameras

Number of cameras 4 (8, optional) 8

Orthogonal camera

Resolution 8 µm 10 µm

Field of view 40 mm x 40 mm (1.6" x 1.6") 50 mm x 50 mm (2" x 2")

Inspection speed

Up to 50 cm

/s Up to 65 cm

Software

User interface Viscom vVision/EasyPro

Statistical process control Viscom vSPC/SPC, open interface (optional)

Verification station Viscom vVerify/HARAN

Remote diagnosis Viscom SRC (optional)

Programming station Viscom PST34 (optional)

System computer

Operating system Windows

Processor Intel

Core™ i7

PCB handling

PCB dimensions 508 mm x 508 mm (20" x 20")

PCB support Optional

Transport height 850 - 950 mm ± 20 mm (33.5"- 37.4" ± 0.8")

Width adjustment Automatic

Transport concept Single track transport

PCB clamping Pneumatic

Upper transport clearance 50 mm (2")

Lower transport clearance 45 mm (1.8"), up to 85 mm (3.3") optional;

40 mm (1.6") with PCB support

Other system data

Positioning/handling unit Synchronous linear motors

Interfaces SMEMA, SV70

Power requirements 400 V (other voltages on request), 3P/N/PE, 8 A,

4 - 6 bar working pressure

System dimensions 997 mm x 1600 mm x 1540 mm (39.3" x 63" x 60.6") (W x H x D)

Weight Max. 800 kg (1764 lbs)