E By DEK Tech Spec.pdf - 第11页
11 E by DEK Machine Pro ductivity Opt ions Transport Specification Substrate Su pport Vacuum tooling capa bility Vacuum cups Vacuu m sense Grid - Lok® tooling Substrate Tr ansport Single pi ece conveyor w ith flat belts …
10
E by DEK
Machine Productivity Options
Process
Specification
Print Method
Paste Dispenser (APDII or Jar Dispenser)
Paste Roll Height Monitor
Stinger
Stencil Positioning
Semi auto loading incorporating squeegee drip tray
Semi auto loading without squeegee drip tray
Stencil Frame and Thickness
Frame variants – Fully adjustable to accommodate
frame sizes in the range of 381mm to 736mm by 38mm
frame thickness
Handling & Cleaner Options
Specification
Cycle Time Upgrade
11 seconds to 8 seconds
Substrate Handling Size (maximum)
620mm (X) x 508.5mm (Y) – Long Board Option
Under Stencil Cleaning
Blue long board Cleaner (600mm)
Software & Communications
Specification
Substrate Handling
Flexible boards
Selective print pass through
Dual speed motor (DSM)
Statistical Process Control
On board, reported via operator interface (QC-CALC)
11
E by DEK
Machine Productivity Options
Transport
Specification
Substrate Support
Vacuum tooling capability
Vacuum cups
Vacuum sense
Grid-Lok® tooling
Substrate Transport
Single piece conveyor with flat belts (heavy boards) up
to 6kg
Remote board stop (for use with heavy board option)
Substrate Fixture
Snuggers (edge clamping)
Foil-less clamps
Vision & Verification
Specification
HawkEye®
Paste on pad verification
Data Capture
Specification
Product Data Capture
Verification & Traceability (only with E by SIPLACE)
12
E by DEK
Machine Footprint