2020 DS X Series SMT EN.pdf
X -series SMT setup High Speed Inline AXI Platform X -series SMT setup Solder Joint Inspection PTH Power devices Cooling plates With the X -series platf orm Nordson MA TRIX presents a dedic ated high spee d automatic X -…
X-series
SMT setup
High Speed Inline AXI Platform
X-series
SMT setup
Solder Joint
Inspection
PTH Power devices
Cooling plates
With the X-series platform Nordson MATRIX presents a dedicated high speed
automatic X-ray inspection system concept for the inspection of PCB-assembly
boards for single/multipanels or samples in trays. All solder joints of SMD and
PTH components are covered by a dedicated AXI algorithm library.
The Nordson MATRIX system solutions present a modular inspection concept.
The platforms feature up to 4 advanced technologies in one system: Transmis-
sion X-ray imaging (2D) with patented Slice-Filter-Technique™ (SFT), O-Axis
technology (2.5D) and 3D SART (Simultaneous Algebraic Reconstruction Tech-
nique).
The X-series platform is available in the following congurations:
X2 Transmission (2D) + SFT
TM
X2.5 Transmission (2D) + SFT
TM
+ O-Axis (2.5D)
X3 Transmission (2D) + SFT
TM
+ O-Axis (2.5D) + 3D SART
Inspection & Process Software
PC- Station with multi - core processor setup
Windows 10 platform
MIPS 5 Inspection Platform
Advanced algorithm library
CAD import for automatic inspection list generation
Simultaneous Algebraic Reconstruction Technique
(3D SART; X3 only)
Automatic Tree Classication (ATC) for Auto-Rule-Genera-
tion
Oine programming for AXI program generation & simula-
tion, tuning and defect reference catalogue
Verication & Process control
MIPS Verify link with closed loop repair
MIPS Process with real time SPC
Features and Benets
High Speed AXI system for inline setups
Microfocus X-ray tube (sealed tube / maintenance free)
Multiple programmable motion system with
linear motor axes
Digital CMOS atpanel detector
Automatic grey-level and geometrical calibration
Barcode scanner for serial number and product type
selection
Full product traceability via various Industry 4.0
MES-Interfaces
IPC-CFX ready
X-series SMT setup
Specications
Applications
Electronic components and solder joint
A unique advanced algorithm library is available for electronic
applications, specically for component and solder-joint
inspection on PCB, hybrid or chip level assembly processes.
All standard SMD and THT/PTH components
BGA & dedicated o-axis head-in-pillow (HIP) algorithm
Comprehensive QFN & gullwing algorithm
Robust solder / heatsink void inspection
Pin in paste barrel ll measurement
Discrete down to 1005 pitches
For more information,
speak with your
Nordson MATRIX
representative.
Germany/ Headquarters
Feldkirchen (Munich)
+49.89.2000.338.200
info@nordsonmatrix.com
Hungary/ Europe
+36.30.876.5038
hungary@nordsonmatrix.com
Americas
+1.760.930.3301
serviceusa@nordsonmatrix.com
South East Asia
+65.6552.7533
sea@nordsonmatrix.com
China
+86.512.6665.2008
china@nordsonmatrix.com
Japan
+81.3.3599.5920
info@nordsonmatrix.com
Korea
+82.31.736.8321
info@nordsonmatrix.com
Taiwan
+886.963.004.675
cs.taiwan@nordson.com
India
+91 44 4353902
sea@nordsonmatrix.com
Facilities
Dimensions: 1630 mm (H) x 1800 mm (W) x 1575 mm (D)
Adjustable conveyor height (SMEMA) 950 mm
Weight: 2.800 kg
Safe Operating Temperature: 15° - 28 °C optimal 20° - 25° C
Power Consumption: max. 6 kW
Line Voltage: 400 VAC, 50/60 Hz 3 phase, 16 A/
208 VAC, 50/60 Hz 3 phase, 25 A
Air: 5-7 Bar, < 2 l/min, ltered (30µ), dry, oil free
X-ray Image Chain
X-ray Source (sealed tube)
Energy: SMT-Setup
130 kV/40 W
Grey resolution: 14 Bit
Detector Types:
CMOS Flatpanel Detector 50 µm pixel size (5 MPix)
75 µm pixel size (3 MPix)
Motion System
Multiple axes programmable motion system
Installed axes
x,y (linear drives) sample table
z (servo) magnication
u,v (linear drives) detector movement
Conveyor setup
Inline set-up automatic width
adjustment
Inspection speed
Transmission (X2, X2.5, X3) up to 6 views /s
O-Axis (X2.5, X3) up to 5 views /s
3D SART (X3) up to 1 s /FoV
Inspection features
Max. sample size: 460 mm x 360 mm
Max. inspection area: 460 mm x 360 mm
Min. sample size 80 mm x 80 mm
Sample thickness 0,8-10 mm
Max. sample weight: 5 kg
Angle shot capability: up to 50 deg
Resolution 3-4 µm/pix
Assembly clearance
Topside (incl. sample thickness): 35 mm
Bottom side
(excl. sample thickness):
35 mm
Min. edge clearance for clamping: 3 mm
Options
Barcodereader
Low-dose radiation lter
Auto BCR scanning station (x-y gantry)
Semi Compliance
+49.89.2000.338.200 Phone
+49.89.2000.338.400 Fax
info@nordsonmatrix.com
nordsonmatrix.com
Matrix Technologies GmbH
Kapellenstraße 12
85622 Feldkirchen (Munich)
Germany
Copyright © 2020 Matrix Technologies GmbH
Specication subject to change without further notice
DSX55/01