DEK TQ Technical Specification.pdf - 第6页
6 DEK TQ Machine S ta ndard C onf iguration Technical Data Transpo rt System Type 3- Stage High Thr oughput Conv eyor Width Adjustm ent Programmabl e motorized re ar rail Transport Dir ection Left to right Right to left …
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DEK TQ
Machine Standard Configuration
Standard Configuration
System Alignment Capability
> 2.0 C
mk
@ +/- 12.5µm, (±6 Sigma)
Wet Print Capability
> 2.0 C
pk
@ +/- 17.5µm, (±6 Sigma) *
Core Cycle Time
5 secs *
Maximum Print Area
400mm (X) x 400mm (Y) (for Single Stage Mode) -
boards exceeding 350mm in X, will require grid-Lok or
a dedicated tooling plate required.
Machine Control
ASM NuMotion control system
Operating System
Windows 10 IoT Enterprise
Human Machine Interface (HMI)
Colour TFT touch screen display, keyboard and
trackball with DEK V1 software.
Camera
Digital camera, using IEEE 1394
Camera Positioning
Linear motors and encoders (0.5-micron resolution)
Squeegee Pressure Mechanism
Software controlled, motorised with closed loop
feedback
Stencil Positioning
Automatic loading incorporating squeegee drip tray
Stencil Alignment
Motorised via actuators X, Y, and Theta
Under Stencil Cleaning
Independent Linear drive motor high speed cleaner,
fully programmable with wet/dry/vacuum wipe with
internal solvent tank 7L
Vacuum Assist for Under Stencil
Cleaning
Programmable vacuum unit 35 litres/sec airflow
Machine Interface
Upline and downline FMI included
Connectivity
RJ-45LAN (networking) and USB2/3 interface available
Tri Colour light tower
Audible alarm
Temperature & Humidity Sensor
Monitoring of the process environment
ESD Compatibility
Compliant with EN/IEC 61340-5-1, EN/IEC 61340-5-2,
ANSI/ESD SP10.1, ANSI/ESD S20.20
*Accuracy values fulfil conditions in the DEK scope of supply and service
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DEK TQ
Machine Standard Configuration
Technical Data
Transport System
Type
3-Stage High Throughput Conveyor
Width Adjustment
Programmable motorized rear rail
Transport Direction
Left to right
Right to left
Left to left
Right to right
Substrate Handling Size (minimum)
50mm (X) x 40.5mm (Y)
Substrate Handling Size (maximum)
250 (X) x 400mm (Y) (3-Stage Mode)
400mm (X) x 400mm (Y) (Single Stage Mode)
Substrate Thickness
0.2mm to 6mm
Substrate Weight (maximum)
3kg
Substrate Warpage
Up to 7mm including substrate thickness
Substrate Fixture
Off Belt Printing
Board clamps
Substrate Underside Clearance
Programmable 3mm to 42mm
Process Parameter
Print Pressure
0kg to 12kg
Print Speed
20mm/sec to 200mm/sec
Print Gap
0mm to 6mm
Substrate Separation
Speed: 0.1mm/sec to 20mm/sec
Distance: 0mm to 20mm
Print Modes
Print/Print
Paste Knead
Programmable: number; period; on demand
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DEK TQ
Machine Standard configuration
Technical Data
Vision
Vision System
SFF
Fiducials
2
Fiducial Types
Synthetic fiducial library or unique pattern recognition
Fiducial Size
0.3mm to 3mm
Fiducial Locations
Anywhere on substrate
Camera Lighting
Software controlled programmable LED lighting
Chase
Stencil Frame Sizes
29” x 29” / 23” x 29” / 23” x 23” / 650mm x 550mm /
600mm x 550mm
Stencil Frame Thickness
40mm to 10mm (adapter required below 25mm)
Image Position
Front
Centre
Operating Environment*
Temperature
10° to 35°C (50° to 95°F)
Humidity
30% to 70% relative humidity (non-condensing)
Altitude
Maximum 2,000 metres (6,500 feet)
Location
Internal only, not suitable for wet locations
*as described in the IPC Standard J-STD-001G-Reqirements for Soldered Electrical and Electronic
Assemblies Section 4 with respect to the following:
• Facilities - Cleanliness and ambient environments in all work areas be maintained at levels that
prevent contamination or deterioration of tools, materials, and surfaces to be soldered or
conformally coated. Eating, drinking, smoking, including use of e-cigarettes, and/or use of
tobacco products be prohibited in the work area.
• Environmental Controls - The soldering facility (controlled work area) be enclosed, temperature
and humidity controlled, and maintained at a positive pressure.
• Controlled Work Area (CWA) For the purpose of this statement, a Controlled Work Area
(CWA) is defined as an enclosed assembly / processing area maintained to a high degree of
shop cleanliness, environmental control, and foreign object debris (FOD) mitigation, either by
process or procedure, to limit the entry of contamination.