ProVIA-Plasma-System-NordsonMARCH-A4.pdf
ProVIA ™ Plasma System Features and Benefits High throughput of HDI, f lexible and rigid panels for maximum production flexibility Accommodates multiple panel sizes within a small footpr int to consume minimal floor …

ProVIA
™
Plasma System
Features and Benefits
High throughput of HDI, flexible and
rigid panels for maximum production
flexibility
Accommodates multiple panel sizes
within a small footprint to consume
minimal floor space
Fast units per hour (UPH) processing to
meet today’s demanding manufacturing
schedules
Low CF4 gas consumption for desmear
applications, contributes to the lowest
cost of ownership in its class
Patented system technologies produce
superior process uniformity at high
throughput
Superior Plasma Uniformity for High
Throughput PCB Treatment
Nordson MARCH’s ProVIA
™
system is specifically
configured to meet the demands of today’s high
throughput PCB manufacturing operations. Plasma
treatment uniformity is a key operational feature in
desmear and etch back applications for HDI, flexible
and rigid circuit board manufacturing technologies. The
ProVIA system delivers!
The ProVIA system is completely self-contained,
requiring minimal floor space. The vacuum system,
plasma chamber, control electronics, and 40 kHz power
supply are housed in a single enclosure. Full front and
rear access allows for convenient service to all interior
components. The pump is positioned on rollers for easy
removal. No side access is required allowing for even
greater floor space savings.
Application Specific Technology
The ProVIA system incorporates the best of Nordson
MARCH’s market leading technology combined with
novel application specific technology development based
on our greater than 25 years of experience. Through
extensive research and development, the ProVIA system
presents unique vacuum and gas flow technology, new
electrode designs, and superior temperature
management. The careful balance of these critical design
elements and process recipe parameters delivers a system
that creates the most uniform PCB treatment for key
applications like desmear and landing pad cleaning.
The ProVIA system’s superior performance capabilities
are complemented by very attractive low-cost-of-
ownership aspects. The system features a very compact
and service-friendly design. The vertical loading concept
and the use of easy loading carts minimizes any idle time
which generates high levels of productivity. The fast
vacuum pump down and greatly enhanced process cycle
times further add to the throughput and productivity of
the system.
Equipped with a touch-screen PC Operator Interface,
the ProVIA system provides a wide breadth of control
capability and data collection. Unlimited recipes can be
stored for easy switching of plasma processes from batch
to batch. Password protection ensures that no
unauthorized entries can be made.

Specifications: ProVIA
™
Plasma System
For more information, speak with your local representative or contact your regional office.
North America
Headquarters
Concord, CA
+1.925.827.1240
China
Shanghai
+86.21.3866.9166
EMEA
Maastricht,
Netherlands
+31.65.155.4996
S.E. Asia
Singapore
+65.6796.9500
Korea
Seoul
+82.31.736.8321
Taiwan
New Taipei City
+886.2.2902.1860
India
Chennai
+91.44.4353.9024
www.nordsonmarch.com info@nordsonmarch.com
Published 2018-03-09
Enclosure
Dimensions
W x D x H – Footprint
1652W x 1747D x 2445H mm
(65W x 69D x 97H in.)
Net Weight
1776 kg (3915 lbs)
Chamber
Number of Available Cells
13
Electrodes
Configuration
Temperature Controlled Power-Power
Working Area
762D x 610H mm; (30D x 24H in.)
RF Power
Standard Wattage
5 kW
Optional Wattage
10 kW
Frequency
40 kHz
Gas Control
Available Flow Volumes
500, 1000, 2000 or 5000 sccms
Maximum Number of MFCs
5
Control
Interface
EPC with PC-Based Touch Screen Interface
Vacuum
Pump
Standard Purged Dry Pump
530 cfm
Cooling Water Flow
9.5 slm
N2 Pump Purge Flow
14 slm
Standard Booster Pump
550 cfm
Facilities
Power Supply
208 VAC, 50 A, 3-Phase + Ground; 50/60 Hz
Process Gas Fitting Size & Type
6.35 mm (0.25 in.) Swagelok
Process Gas Purity
CF4 = 99.97%; O2 = 99.996%; N2 = 99.99%;
Ar = 99.999%; H2 = 99.999%
Process Gas Pressure
1.03 bar (15 psig) min. to 1.7 bar (25 psig) max., regulated
Purge Gas Fitting Size & Type
9.5 mm (0.375 in.) Swagelok Tube
Purge Gas Purity
N2 = 99.99%
Purge Gas Pressure
1.03 bar (15 psig) min. to 1.7 bar (25 psig) max., regulated
Pneumatic Valves Fitting Size &
Type
9.5 mm (0.375 in.) Swagelok
Pneumatic Gas Purity
CDA, Oil Free, Dewpoint ≤7°C (45°F), Particulate Size <5
µm
Pneumatic Gas Pressure
6.2 bar (90 psig) min. to 6.9 bar (100 psig) max., regulated
Exhaust
NW 40 @ Utility Panel
Compliance
USA
EH&S/Ergonomics
International
CE Marked
Ancillary
Equipment
Gas Generators
Nitrogen, Hydrogen
(requires Additional Non-Optional Hardware)
Facilities
Chiller, Scrubber, Transformer