RP-2_E.pdf
High Precision Solder Paste Printer with excellent cost performance Solder Paste Printer GKG PRECISION MACHINE CO.,LTD *The monitor can be mounted on either the left or right side ． *Back to back www.juki.…
High Precision Solder Paste Printer with
excellent cost performance
Solder Paste Printer
GKG PRECISION MACHINE CO.,LTD
*The monitor can be mounted on either the left or right side
．
*Back to back
www.juki.co.jp
JUKI SMT ASIA CO.,LTD.
JUKI INDIA PVT. LTD.
www.smtjukiindia.com
JUKI AUTOMATION SYSTEMS INC.
www.jukiamericas.com
JUKI AUTOMATION SYSTEMS GMBH.
www.juki-smt.com
Apr- 2021/Rev.01
TOKYO JUKI INTERNATIONAL
TRADING (SHANGHAI) CO.,LTD.
www.jukichina.com
*Please refer to the product specifications for details.
■JUKI Specifications and appearance may be changed without notice.
Field-of-View (FOV) 10mm x 8mm
Fiducial types Circle, triangle, square, diamond, cross
Fiducial size 0.5~4.0mm
Vision methodology
Digital CCD camera look up & down
2D inspection
Max.100 windows (10mmx8mm)
Hardware LCD Monitor, Mouse & Keyboard
Operating system (OS) Windows 7
Control method Industrial PC controlled
I/O Interface SMEMA Standard
Max. Size (L x W) 510mm x 510mm
Min. Size (L x W) 50mm x 50mm
Thickness 0.4~6mm
PCB thickness adjustment Automatic
PCB Max. Weight 5kg
PCB edge clearance 3mm
PCB bottom clearance 23mm
PCB warpage Max. 1% diagonally
Clamping method
Auto retractable top clamp,
motor controlled side clamp
Support method
Magnetic support pins, bars, blocks,
vacuum suction
Conveyor direction L to R, R to L, R to R, L to L (software control)
Conveyor height 900 ± 40mm
Conveyor speed (max.) 1,000mm/s
Conveyor width adjustment Automatic
Power supply Single-phase AC200V~240V 50/60Hz
Power consumption 3kW
Air supply 0.4 ~0.6MPa/cm²
Air consumption 5L/min
Dimension
(excluding signal tower)
1,240 (L) x 1,560 (W) x 1,490 (H)
Machine weight 1,200kg
Stencil frame size (L x W) Adjustable, 470 x 370mm to 737 x 737mm
Print gap 0~20mm
Printing table adjustment
range
X: ±10 mm, Y: ±10mm θ: ± 2°
Print speed 10~200mm/s
Squeegee pressure 0~10kg (program control)
Cleaning system Auto wet, dry, vacuum (Software select)
Facilities requirement
Operator interface
Positioning accuracy ±10µm(6σ)
Printing accuracy ±18µm(6σ)
Cycle time 8.5 sec + Printing time
Product changeover time 3min or less
New product set-up time 10min or less
Performance
Board handling
Printing parameters
Optical system
Metal squeegee
210mm, 280mm, 350mm, 420mm, 520mm
Rubber squeegee 210mm, 280mm, 350mm
Squeegee angle Std. 60°
Squeegee type
The solder paste is automatically dispensed across the entire
squeegee length, maintaining at 15 mm rolling diameter,
adopting the common 500 grams’ solder paste jar.
Completely eliminates the wastage of solder paste overflowing
to the sides of squeegee.
Optimum-Paste Control (OPC) - Get ready for lights - out manufacturing
Tracing solder paste rolling diameter in real time and trigger the
auto dispensing if it falls below 10 mm. Completely eliminate
insufficient solder paste on stencil and keep the paste rolling
speed within optimum range to achieve best printing result.
Using panel light installed at the top and CCD camera below to
inspect stencil apertures.
It automatically detects the clogging of stencil apertures to
eliminate poor quality stencil being used, ensure quality printing
right from the start.
The Stencil lock sucks the stencil firmly on both sides of the
conveyor during printing cycle.
To eliminate stencil vibration by having firm contact with PCB.
The PCB clamper is a combination of retractable top clamp and
motor controlled side clamp, uniquely designed by GKG
(patented).
With these standard features, all of today’ s available and
challenging substrates can be securely clamped and print to the
highest quality.
Quality Print Control (QPC) - Nothing is more important than a GOOD print
Stencil aperture inspection system
HP
The Stencil lock & PCB clamper
Solder paste rolling diameter
monitoring system
With SPI close-loop system, machine will automatically adjust
and correct the print deposits based on the feedback given with
regards to poor printing quality. This will facilitate improved print
quality and production efficiency, by forming a complete printing
feedback system.
SPI Close-loop connection
Specifications, Options
High Precision Solder Paste Printer
with excellent cost performance
PCB size : 50×50 mm - 510×510 mm
Cycle time : 8.5 sec+Printing time
Positioning accuracy : ±10µm(6σ)
Printing accuracy : ±18µm(6σ)
Stencil frame size : 735 ×735 mm/t : 30 mm
Auto solder paste replenishment system
HP
HP
(S: Standard, O: Option, N/A: Not Applicable)
Features
RP-2
(HP)
RP-2
(B)
Printing table vacuum system S S
Auto paste dispensing (rear mounting) S N/A
N/APaste rolling diameter monitoring system S
Temperature humidity monitoring & display S N/A
N/AInternal barcode scanner for pcb traceability O
Hand held scanner O O
Stencil aperture inspection system S N/A
Spi closed-loop O O
2D Inspection (Max. 100 point) S S
Features
RP-2
(HP)
RP-2
(B)
Metal squeegee 210, 350 mm S S
Metal squeegee 280, 420, 520 mm O O
Rubber squeegee 210, 280, 350 mm O O
Stencil lock S S
Auto table adjustment for pcb thickness S S
Support block hit prevention system S S
Stencil y-direction position memory S S
Support pins set S S
Support blocks set S S
Solder Paste Printer
Basic model
Multi-function model