IPC-A-610D Chinese.pdf - 第7页
Marsha Hall, Simclar, Inc. Bjorn Kullman, Sincotron Sverige AB Finn Skaanning, Skaanning Quality & Certification -SQC Daniel L. Foster, Soldering Technology International Mel Parrish, Soldering Technology Internation…
Robert Zak, Honeywell
Ted S. Won, Honeywell Engines & Systems
Dewey Whittaker, Honeywell Inc.
Don Youngblood, Honeywell Inc.
William A. Novak, Honeywell Inc.
Linda Tucker, Honeywell Technologies Solutions Inc.
Fujiang Sun, Huawei Technologies Co., Ltd.
Rongxiang (Davis) Yang, Huawei Technologies Co., Ltd.
James F. Maguire, Intel Corporation
Richard Pond, Itron Electricity Metering, Inc.
Kenneth Reid, IUPUI-Indiana/Purdue University
Marty Rodriguez, Jabil Circuit, Inc.
Quyen Chu, Jabil Circuit, Inc.
Akikazu Shibata, Ph.D., JPCA-Japan Printed Circuit
Association
David F. Scheiner, Kester
Blen F. Talbot, L-3 Communications
Bruce Bryla, L-3 Communications
Byron Case, L-3 Communications
Phillip Chen, L-3 Communications Electronic Systems
Chanelle Smith, Lockheed Martin
Karen E. McConnell, C.I.D., Lockheed Martin
C. Dudley Hamilton, Lockheed Martin Aeronautics Co.
Eileen Lane, Lockheed Martin Corporation
Mary H. Sprankle, Lockheed Martin Corporation
Linda Woody, Lockheed Martin Electronics & Missiles
Vijay Kumar, Lockheed Martin Missile & Fire Control
Hue T. Green, Lockheed Martin Space Systems Company
Jeffery J. Luttkus, Lockheed Martin Space Systems
Company
Michael R. Green, Lockheed Martin Space Systems
Company
Russell H. Nowland, Lucent Technologies
Helena Pasquito, M/A-COM Inc.
Dennis Fritz, MacDermid, Inc.
Gregg A. Owens, Manufacturing Technology Training Center
James H. Moffitt, Moffitt Consulting Services
Terry Burnette, Motorola Inc.
Garry D. McGuire, NASA
Robert D. Humphrey, NASA/Goddard Space Flight Center
Christopher Hunt, Ph.D., National Physical Laboratory
Wade McFaddin, Nextek, Inc.
Seppo J. Nuppola, Nokia Networks Oyj
Mari Paakkonen, Nokia Networks Oyj
Neil Trelford, Nortel Networks
Clarence W. Knapp, Northrop Grumman
Mahendra S. Gandhi, Northrop Grumman
Randy McNutt, Northrop Grumman
Rene R. Martinez, Northrop Grumman
Alan S. Cash, Northrop Grumman Corporation
Becky Amundsen, Northrop Grumman Corporation
Bernard Icore, Northrop Grumman Corporation
Alvin R. Luther, Northrop Grumman Laser Systems
Frederic W. Lee, Northrop Grumman Norden Systems
William A. Rasmus, Jr., Northrop Grumman Space Systems
Andrew W. Ganster, NSWC - Crane
Peggi J. Blakley, NSWC - Crane
Wallace Norris, NSWC - Crane
William Dean May, NSWC - Crane
Rodney Dehne, OEM Worldwide
Ken A. Moore, Omni Training
Peter E. Maher, PEM Consulting
Rob Walls, C.I.D.+, PIEK International Education Centre BV
Denis Jean, Plexus Corp.
Timothy M. Pitsch, Plexus Corp.
Bonnie J. Gentile, Plexus NPI Plus - New England
David Posner
Kevin T. Schuld, Qualcomm Inc.
Guy M. Ramsey,R&DAssembly
Piotr Wus, Radwar SA
David R. Nelson, Raytheon Company
Fonda B. Wu, Raytheon Company
Gerald Frank, Raytheon Company
James M Daggett, Raytheon Company
Gary Falconbury, Raytheon System Technology
Gordon Morris, Raytheon System Technology
Steven A. Herrberg, Raytheon Systems Company
Connie M. Korth, Reptron Manufacturing Services/Hibbing
Beverley Christian, Ph.D., Research In Motion Limited
Bryan James, Rockwell Collins
David C. Adams, Rockwell Collins
David D. Hillman, Rockwell Collins
Douglas O. Pauls, Rockwell Collins
Bob Heller, Saline Lectronics
Donna L. Lauranzano, Sanmina-SCI Corporation
Frank V. Grano, Sanmina-SCI Corporation
Brent Sayer, Schlumberger Well Services
Kelly M. Schriver, Schriver Consultants
Klaus D. Rudolph, Siemens AG
George Carroll, Siemens Energy & Automation
Megan Shelton, Siemens Energy & Automation
Mark P. Mitzen, Sierra Nevada Corporation
Steve Garner, Sierra Nevada Corporation
iv IPC-A-610D
Marsha Hall, Simclar, Inc.
Bjorn Kullman, Sincotron Sverige AB
Finn Skaanning, Skaanning Quality & Certification -SQC
Daniel L. Foster, Soldering Technology International
Mel Parrish, Soldering Technology International
Patricia A. Scott, Soldering Technology International
Jasbir Bath, Solectron Corporation
Charles D. Fieselman, Solectron Technology Inc.
Fortunata Freeman, Solectron Technology Inc.
Sue Spath, Solectron Technology Inc.
Paul B. Hanson, Surface Mount Technology Corporation
Keith Sweatman
David Reilly, Synergetics
John Mastorides, Sypris Electronics, LLC
Raymond E. Dawson, Teamsource Technical Services
Vern Solberg, Tessera Technologies, Inc.
Les Hymes, The Complete Connection
Susan Roder, Thomas Electronics
Leroy Boone, Thomson Consumer Electronics
William Lee Vroom, Thomson Consumer Electronics
Debora L. Obitz, Trace Laboratories - East
Renee J. Michalkiewicz, Trace Laboratories - East
Nick Vinardi, TRW/Automotive Electronics Group
Martha Schuster, U.S. Army Aviation & Missile Command
Sharon T. Ventress, U.S. Army Aviation & Missile Command
Constantin Hudon, Varitron Technologies Inc.
Gregg B. Stearns, Vitel Technologies, Inc
Denis Barbini, Ph.D., Vitronics Soltec
David Zueck, Western Digital
Lionel Fullwood, WKK Distribution Ltd.
John S. Norton, Xerox Corporation
Steven T. Sauer, Xetron Corp.
Constantino J. Gonzalez, ACME Training & Consulting
Jennifer Day, Current Circuits
Robert Willis, Electronic Presentation Services
Mark Cannon, ERSA Global Connections
Steve Radabaugh, Hewlett-Packard Company
Marty Rodriguez, Jabil Circuit, Inc.
Quyen Chu, Jabil Circuit, Inc.
Blen F. Talbot, L-3 Communications
Linda Woody, Lockheed Martin Electronics & Missiles
James H. Moffitt, Moffitt Consulting Services
Mari Paakkonen, Nokia Networks Oyj
Neil Trelford, Nortel Networks
Peggi J. Blakley, NSWC - Crane
Ken A. Moore, Omni Training
1
Guy M. Ramsey,R&DAssembly
Bryan James, Rockwell Collins
Frank V. Grano, Sanmina-SCI Corporation
Norine Wilson, SED Systems Inc.
Daniel L. Foster, Soldering Technology International
Mel Parrish, Soldering Technology International
Jasbir Bath, Solectron Corporation
Vern Solberg, Tessera Technologies, Inc.
Bob Heller, Saline Lectronics
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