Release-R17-1-CS_Reporting_en.pdf - 第7页

OIS for DEK Printer 08.08.2017 Page 7 ASM Assembly Systems OIS Main View for Printer  OIS client installation a t DEK printer .  If DEK printer is part of SIPLACE Pro line configuration , it appears in OIS, can be sele…

SIPLACE Pro 14.1

ASM Printer programming

8/8/2017 ASM Assembly Systems Page 6

ASM Printer Programming extends the existing SIPLACE Pro programming system by adding functionality for

editing print process data for DEK printing systems. The SIPLACE Pro programming system allows preparing,

optimizing and downloading placement and printing programs. ASM Printer Programming can be ordered

separately.

License:

DEK SIPLACE Pro – Machine Connection (Single- / Floating- license)

DEK ASM Traceability – Machine Connection (Single- / Floating- license)

 Workflow oriented Editor in ASM Studio for complete offline printer program creation.

 Central SIPLACE Pro database for print&place programs with shared objects for better process control and

data change management over all products.

 Import of existing .pr1 Printer Programs to an existing SIPLACE Pro board side.

 Program Download from SIPLACE Line Control to DEK and SIPLACE machines.

 Upload of program changes and additional data into the central database.

 Programming also for DEK standalone printers (no SIPLACE in line).

OIS for DEK Printer

08.08.2017 Page 7 ASM Assembly Systems

OIS Main View for Printer

 OIS client installation at DEK printer.

 If DEK printer is part of SIPLACE Pro line configuration,

it appears in OIS, can be selected and shows details.

PCB Overview for Printer

 Each board is listed, similar to SIPLACE machines.

 Info about recipe, setup, transport conveyor, build time, etc

Machine availability for Printer

 Machine states as pie chart and in percentage

 Detailed listing of events and duration

 Events: PCB start, printing, kneading, cleaning, waiting

Touchless placement

8/8/2017 ASM Assembly Systems Page 8

The placement process „Touchless placement“ is introduced to place very thin, breakable and sensitive components.

This process need a vacuum tooling or an chuck, so basically to use with the SIPLACE CA and SIPLACE TX micron machine.

Preconditions:

- R17-1 with 710.1 and SIPLACE Pro 14.1

- Planarity of the PCB < 20µm

- Chuck/ Vacuum-Tooling

- Stable quality of the component (thickness)

- Touchless placement mode for C&P 20 A/M/P/M2 heads possible

Recommendation: Execute the head maintenance include the test „Head Verification“

No license for this Feature!