IPC印制电路板设计规范-SMD元器件封装库尺寸要求_Password_Removed-副本.pdf
在线预览 IPC印制电路板设计规范-SMD元器件封装库尺寸要求_Password_Removed-副本.pdf PDF 文档。
Q/ZX 04.100.5 - 2001
目 次
1 范围............................................................................. 1
2 引用标准
.........................................................................
1
3 术语............................................................................. 1
4 使用说明......................................................................... 2
5 焊盘图形
.........................................................................
2
5.1 SMD：表面贴装方焊盘图形尺寸.............................................. 2
5.2 SMDC：表面贴装圆焊盘图形尺寸............................................. 3
5.3 SMDF 表面贴装手指焊盘图形尺寸
............................................
4
5.4 THC 通孔圆焊盘图形尺寸................................................... 5
5.5 THS 通孔方焊盘图形尺寸................................................... 6
5.6 THR 通孔矩形焊盘图形尺寸
.................................................
7
6 SMD 元器件及焊盘图形尺寸......................................................... 8
6.1 SMD 分立元件............................................................. 8
6.1.1 SMD 电阻
.............................................................
8
6.1.1.1 SMD 电阻元件尺寸..................................................... 8
6.1.2 SMD 电容............................................................ 10
6.1.3 SMD 电感
............................................................
12
6.1.4 SMD 钽电容.......................................................... 14
6.1.5 MELF（金属电极无引线端面元件）...................................... 16
6.1.6 SMD 排阻
............................................................
18
6.1.7 SOT 23.............................................................. 20
6.1.8 SOT 89.............................................................. 22
6.1.9 SOD 123
.............................................................
24
6.1.10 SOT 143......................................................... 26
6.1.11 SOT 223......................................................... 28
6.1.12 TO 252/TO 268
...................................................
30
6.1.13 SMD220 元件（对应物料代码为 15100085 等）........................ 32
6.1.14 SMA 元件(对应物料代码为 15100016a)............................... 34
6.1.15 SOT-323 元件(对应物料代码为 15100001)
............................
36
6.1.16 SOT-363 元件(对应物料代码为 15100001)............................ 38
6.2 两侧翼形引脚元件........................................................ 40
6.2.1 SOIC[Small Outline Integrated Circuits:小外形集成电路]
..............
40
6.2.2 SSOIC[Small Outline Integrated Circuits:小外形集成电路]............. 42
6.2.3 SOP[Small Outline Package Integrated Circuits:小外形封装集成电路]... 44
6.2.4 TSOP[Thin Small Outline Package:薄小外形封装]
.......................
46
6.2.5 CFP[Ceramic Flat Packs:陶瓷扁平封装]................................ 48
6.3 两侧“J”形引脚元件[SOJ]................................................ 50
6.3.1 SOJ 元件尺寸
........................................................
50
6.3.2 SOJ 的焊盘尺寸...................................................... 51
6.4 四边有翼形引脚的元件.................................................... 54
6.4.1 PQFP(Plastic Quad Flat Pack)........................................ 54
6.4.2 SQFP(Shrink Quad Flat Pack),方形.................................... 56
6.4.3 SQFP 矩形........................................................... 64
6.4.4 CQFP[Ceramic Quad Flat Pack]........................................ 68
6.5 四边有“J”形引脚的元件................................................. 70
6.5.1 方形 PLCC[Plastic leaded chip carriers]............................. 70
6.5.2 PLCC，矩形.......................................................... 72
6.5.3 LCC [Leadless ceramic chip carriers]................................ 74
6.6 改进型双列引脚元件...................................................... 76
6.6.1 DIP[Modified Dual-In-Line components]............................... 76
6.7 BGA..................................................................... 78
6.7.1 PBGA[Plastic Ball Grid Array],方形.................................. 78
6.7.2 1.27mm R-PBGA....................................................... 92