IPC-A-610C(电子组装件的验收条件).pdf - 第6页
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of the IPC-A-610 Task Group (7-31b) of the Product Assurance Subcommittee (7-30) are shown below, it i…
IPC-A610
ADOPTION NOTICE
IPC-A610, "Acceptability of Electronic Assemblies", was adopted
on 12-FEB-02 for use by the Department of Defense (DoD).
Proposed changes by DoD activities must be submitted to the DoD
Adopting Activity: Commander, US Army Tank-Automotive and
Armaments Command, ATTN: AMSTA-TR-E/IE, Warren, MI 48397-5000.
Copies of this document may be purchased from the The Institute
for Interconnecting and Packaging Electronic Circuits, 2215
Sanders Rd, Suite 200 South, Northbrook, IL 60062.
http://www.ipc.org/___________________
Custodians: Adopting Activity:
Army - AT
(Project SOLD-0060)
Army - AT
Navy - AS
Air Force - 11
Reviewer Activities:
Army - AV, MI
AREA SOLD
DISTRIBUTION STATEMENT A:
Approved for public release; distribution
is unlimited.
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of the
IPC-A-610 Task Group (7-31b) of the Product Assurance Subcommittee (7-30) are shown below, it is not possible
to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend
their gratitude.
Product Assurance
Committee
IPC-A-610
Task Group
Chair
Mike Hill
Viasystems Technologies Corporation
Technical Liaisons of the
IPC Board of Directors
Stan Plzak
Pensar Corp.
Peter Bigelow
Beaver Brook
Circuits Inc.
Co-Chairs
Constantino J. Gonzalez
ACME, Inc.
Jennifer Day
Soldering Technology International
Mel Parrish
EMPF/ACI
Members of the IPC-A-610 Task Group
Kermit Aguayo, XeTel Corporation
Michael Aldrich, Ametek Aerospace
Kari Anderson, Raytheon Technical Services Co.
Gad Arbel, IAI
Peter Ashaolu, Cisco Systems Inc.
William J. Balon, Bayer Corporation
Timothy E. Bates, Alcatel USA
Chris Beaufait, General Electric Co.
Ronald P. Belanger, M/A-COM Inc.
Craig Bennett, NSWC - Crane
Evon C. Bennett, Powerwave Technologies, Inc.
Dennis F. Bernier, Kester Solder Division
Peggi J. Blakley, NSWC - Crane
Richard W. Boerdner, EJE Research
G. L. Bogert, Bechtel Plant Machinery, Inc.
Diana Bradford, Soldering Technology International
Bruce Bryla, L-3 Communications
Carl Buchanan, U.S. Aviation & Missile Command
Terry Burnette, Motorola Inc.
William G. Butman, Circuit Technology Center Inc.
Jeff Cannis, Amkor Technology Inc.
Dennis J. Cantwell, Printed Circuits Inc.
Ken H. Carlson, Harris Corporation
Thomas A. Carroll, Hughes Space and Communications Co.
Byron Case, L-3 Communications
Alan S. Cash, Northrop Grumman Corporation
Rick Cash, CyberOptics Corporation
Gary W. Chance, Nokia Telecommunications
Dr. Bev Christian, Nortel Networks Ltd.
Ray Cirimele, Diversified Systems Inc.
Jeffrey C. Colish, Northrop Grumman Corporation
Brian Crowley, Hewlett Packard Laboratories
David D’Amore, ACT Manufacturing Inc.
Derek D’Andrade, Surface Mount Technology Centre
J. Gordon Davy, Northrop Grumman ES&SD
Jennifer Day, Soldering Technology International
Lyn Dayman, ATTEC Australia
Rodney Dehne, OEM Worldwide
Stacey DeLorenzo, Northrop Grumman Corporation
Ramon A. Diaz, Solectron Technology Inc.
Michele J. DiFranza, The Mitre Corp.
Darrin Dodson, Alcatel USA
Nick D’onofrio, CAE Electronics Ltd.
Nancy Dutcher, U.S. Assemblies Hallstead Inc.
Kathy Edsinger, MCMS
Tommy R. Etheridge, Boeing Aircraft & Missiles
Gary Falconbury, Raytheon Technical Services Co.
James E. Farrell, Atlantis Aerospace Corp.
Jeff Ferry, Circuit Technology Center Inc.
Daryl Feryance, Eaton/Cutler-Hammer
Charles D. Fieselman, Solectron Technology Inc.
Skip Forbes, Republic Technology
Daniel L. Foster, Electronics Training Advantage (ETA)
Mike Freed, Rockwell Automation/Allen-Bradley
Lionel Fullwood, WKK/Wong’s Kong King Int’l
Mahendra S. Gandhi, Raytheon Systems Company
Floyd L. Gentry, Sandia National Labs Albuquerque
John J. German, Orbital Sciences Corporation
Constantino J. Gonzalez, ACME, Inc.
Randall Goodnight, Solectron Technology Inc.
Acknowledgment
iiiIPC-A-610C January 2000
Michael R. Green, Lockheed Martin Missiles & Space
Robert Gregory, CAE Electronics Ltd.
Jose Guzman, Honeywell Inc.
C. Dudley Hamilton, Lockheed Martin Corporation
Patrick B. Hassell, Electronic Packaging Services
Steven A. Herrberg, Raytheon Systems Company
Michael E. Hill, Viasystems Technologies Corp.
David D. Hillman, Rockwell Collins
Phillip E. Hinton, Hinton ’PWB’ Engineering
F. D. Bruce Houghton, Celestica International Inc.
Dawn Houser, Zero Defects Inc.
Charles Hubert, Intergraph-Intense 3D
Constantin Hudon, Varitron Technologies Inc.
Trevor Hughes, Fisher-Rosemont Limited
Dr. Christopher Hunt, National Physical Laboratory
Greg Hurst, Marconi Aerospace Defense Systems
Les Hymes, The Complete Connection
Phil Irby, Metric Systems Corporation
Martin W. Jawitz, Eimer Company
James Jenkins, Harris Corporation
Martin E. Johns, Polaris Contract Services
Bill Keaton, Itron Inc.
Cindy A. Kemp, Evenflo Company Inc.
Terence Kern, Axiom Electronics, Inc.
William Killion, Kimball Electronics Group
Clarence W. Knapp, Litton Guidance & Control Systems
Edward Knowles, Lockheed Martin Astronautics
Jeffry F. Koon, Raytheon Company
Connie M. Korth, K-Byte/Hibbing Manufacturing
Leo P. Lambert, EPTAC Corporation
Charles A. Lawson, General Dynamics Advanced
Technology Systems
Frederic W. Lee, Northrop Grumman Norden Systems
Larry Lichtenberg, Process Optimization Specialists
Miles Littlefield, Pensar Corporation
Alvin R. Luther, Litton Laser Systems
Jeffery J. Luttkus, Lockheed Martin Missiles & Space
Kim MacDougall, Sanmina Corporation
James F. Maguire, Boeing Phantom Works
Peter E. Maher, PEM Consulting
Alan Mahoney, CAE Electronics Ltd.
Wesley R. Malewicz, Siemens Medical Systems Inc.
Reggie Malli, Glenayre Electronics Ltd.
Steven R. Martell, Sonoscan Inc.
John Mastorides, Group Technologies Corp.
William Dean May, NSWC - Crane
Mark McDonough, Chandler Evans Control Systems
Garry D. McGuire, Hernandez Engineering Inc.
Ronald McIlnay, Medtronic Physio-Control
Pete A. McKeon, AlliedSignal Inc., AT & R
William E. McManes, PEI Electronics, Inc.
Randy McNutt, Northrop Grumman
Stephen Meeks, Jr., Motorola Computer Group
Michael A. Mele, Lockheed Martin Corporation
Renee J. Michalkiewicz, Trace Laboratories - East
Christine A. Miller, FORE Systems Inc.
Kelly J. Miller, CAE Electronics Ltd.
James H. Moffitt, Moffitt Consulting Services
Marsha Moore, Techdyne, Lytton Inc.
Gordon Morris, Raytheon Technical Services Co.
Barry Morris, Advanced Rework Technology-A.R.T
Michele Mozingo, Storage Technology Corp.
Karl B. Mueller, Boeing Aircraft & Missiles
Mary Muller, Eldec Corporation
Mike G. Murley, Lockheed Martin
David F. Nelson, Adtran Inc.
David Nicol, Lucent Technologies Inc.
Benny Nilsson, Ericsson Radio Systems AB
Ed Noble, Industrial Scientific Corp.
Riley L. Northam, EMPF/ACI
John S. Norton, Tektronix Inc.
William A. Novak, Honeywell Int’l Inc.
Seppo Nuppola, Nokia Networks
R. Bruce Officer, Sanders, A Lockheed Martin Co.
Gregg Owens, Omni Training Corporation
Bill Page, Plexus Corporation
Bruce Panke, Kanata, ON Canada
Mel Parrish, EMPF/ACI
Helena Pasquito, M/A-COM Inc.
Douglas O. Pauls, CSL Inc.
Frank Piccolo, Aimtronics Corporation
Scott Poole, MCMS
David Posner, Gamma-Metrics
Jim D. Raby, Soldering Technology International
William F. Ramm, Siemens-Furnas Controls
David Reilly, Synergetics
Nancy W. Reynolds, Kemet Electronics Corporation
Julie D. Riles, Viasystems Technologies Corp.
Don Ripplinger, ITT Aerospace/Communications
David E. Robertson, Hexacon Electric Company
Teresa M. Rowe, AAI Corporation
Dave Ruiz, Lockheed Martin Missiles & Space
Acknowledgment (cont.)
iv IPC-A-610CJanuary 2000