E By DEK Tech Spec.pdf - 第7页
7 E by DEK Machine S t andard C onf igurati on Transport Sy stem Specification Width Adju stment Programmab le motorized rear r ail Transport Dir ection Left to right Right to lef t Left to left Right to right Substrate …
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E by DEK
Machine Standard Configuration
Standard Configuration
Specification
Machine Alignment Capability
@ ±12.5µm
System Alignment Capability
> 2.0 C
mk
@ ±25um, (±6 Sigma)*
Core Cycle Time
11 secs + process
Product Changeover
< 2 minutes
New Product Setup
< 10 minutes
Printer Construction
One piece optimised welded frame
Operating System
Windows 10 IoT Enterprise
Operator Interface
Fixed mounted colour TFT display, keyboard and
trackball
Squeegee Pressure Mechanism
Software controlled, motorised with closed loop
feedback ± 1kg
Stencil Positioning
Manual with stencil depth adjuster**
Under Stencil Cleaning
300/400/520mm Interchangeable Under Stencil
Cleaner (IUSC), fully programmable with
wet/dry/vacuum wipe
Machine Interface
Upline and downline SMEMA included
Connectivity
RJ-45LAN (networking) and USB2 interface available
ESD Compatibility
Compliant with EN/IEC 61340-5-1, EN/IEC 61340-5-2,
ANSI/ESD SP10.1, ANSI/ESD S20.20
Temperature & Humidity Sensor
Monitoring of the process environment
* System Alignment Capability is certified by a 3
rd
party software QC Calc and undertaken by applying
board loading/unloading, board clamping, camera/rising table movement and print process.
Accuracy and Repeatability qualifications are certified by CeTaQ and AVS to deliver highly confident
wet print process.
** This is incompatible with the optional AWSM.
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E by DEK
Machine Standard Configuration
Transport System
Specification
Width Adjustment
Programmable motorized rear rail
Transport Direction
Left to right
Right to left
Left to left
Right to right
Substrate Handling Size (minimum)
50mm (X) x 40.5mm (Y)
Substrate Handling Size (maximum)
510mm (X) x 508.5mm (Y)
Substrate Thickness
0.2mm to 6mm
Substrate Weight (maximum)
1kg
Substrate Warpage
Up to 7mm including substrate thickness
Substrate Fixture
Over the top clamps
Substrate Handling Features
Board clamp regulator
Substrate Underside Clearance
Programmable 3mm to 42mm
Process Parameter
Specification
Print Pressure
0kg to 20kg
Print Speed
2mm/sec to 300mm/sec
Print Gap
-2mm to 6mm
Substrate Separation
Speed: 0.1mm/sec to 20mm/sec
Distance: 0mm to 3mm
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E by DEK
Machine Standard Configuration
Vision
Specification
Camera
DEK HawkEye 750 digital camera with 2-way LED
illumination
Fiducials
3
Fiducial Types
Synthetic fiducial library or unique pattern recognition
Fiducial Size
0.3mm to 3mm*
Fiducial Locations
Anywhere on substrate
Camera Lighting
Software controlled programmable LED lighting
*0.1mm to 3mm available via RFQ
Standard C Chase
Specification
Stencil Frame Size (maximum)
736mm x 736mm (29” x 29”)
Stencil Frame Thickness
25mm to 38mm (1” to 1.5”)
Image Position
Front
Centre
Custom
Operating Environment*
Specification
Temperature
10° to 35°C (50° to 95°F)
Humidity
30% to 70% relative humidity (non-condensing)
Altitude
Maximum 2,000 metres (6,500 feet)
Location
Internal only, not suitable for wet locations
*as described in the IPC Standard J-STD-001G-Reqirements for Soldered Electrical and Electronic
Assemblies Section 4 with respect to the following:
• Facilities - Cleanliness and ambient environments in all work areas be maintained at levels that
prevent contamination or deterioration of tools, materials, and surfaces to be soldered or
conformally coated. Eating, drinking, smoking, including use of e-cigarettes, and/or use of
tobacco products be prohibited in the work area.
• Environmental Controls - The soldering facility (controlled work area) be enclosed, temperature
and humidity controlled, and maintained at a positive pressure.
• Controlled Work Area (CWA) For the purpose of this statement, a Controlled Work Area
(CWA) is defined as an enclosed assembly / processing area maintained to a high degree of
shop cleanliness, environmental control, and foreign object debris (FOD) mitigation, either by
process or procedure, to limit the entry of contamination.