E By DEK Tech Spec.pdf - 第8页
8 E by DEK Machine S t andard C onf igurati on Vision Specification Camera DEK HawkE ye 750 digit al camer a with 2 - way LED illuminat ion Fiducia ls 3 Fiducial Ty pes Synthetic fiducial library or un ique pat tern reco…
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E by DEK
Machine Standard Configuration
Transport System
Specification
Width Adjustment
Programmable motorized rear rail
Transport Direction
Left to right
Right to left
Left to left
Right to right
Substrate Handling Size (minimum)
50mm (X) x 40.5mm (Y)
Substrate Handling Size (maximum)
510mm (X) x 508.5mm (Y)
Substrate Thickness
0.2mm to 6mm
Substrate Weight (maximum)
1kg
Substrate Warpage
Up to 7mm including substrate thickness
Substrate Fixture
Over the top clamps
Substrate Handling Features
Board clamp regulator
Substrate Underside Clearance
Programmable 3mm to 42mm
Process Parameter
Specification
Print Pressure
0kg to 20kg
Print Speed
2mm/sec to 300mm/sec
Print Gap
-2mm to 6mm
Substrate Separation
Speed: 0.1mm/sec to 20mm/sec
Distance: 0mm to 3mm
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E by DEK
Machine Standard Configuration
Vision
Specification
Camera
DEK HawkEye 750 digital camera with 2-way LED
illumination
Fiducials
3
Fiducial Types
Synthetic fiducial library or unique pattern recognition
Fiducial Size
0.3mm to 3mm*
Fiducial Locations
Anywhere on substrate
Camera Lighting
Software controlled programmable LED lighting
*0.1mm to 3mm available via RFQ
Standard C Chase
Specification
Stencil Frame Size (maximum)
736mm x 736mm (29” x 29”)
Stencil Frame Thickness
25mm to 38mm (1” to 1.5”)
Image Position
Front
Centre
Custom
Operating Environment*
Specification
Temperature
10° to 35°C (50° to 95°F)
Humidity
30% to 70% relative humidity (non-condensing)
Altitude
Maximum 2,000 metres (6,500 feet)
Location
Internal only, not suitable for wet locations
*as described in the IPC Standard J-STD-001G-Reqirements for Soldered Electrical and Electronic
Assemblies Section 4 with respect to the following:
• Facilities - Cleanliness and ambient environments in all work areas be maintained at levels that
prevent contamination or deterioration of tools, materials, and surfaces to be soldered or
conformally coated. Eating, drinking, smoking, including use of e-cigarettes, and/or use of
tobacco products be prohibited in the work area.
• Environmental Controls - The soldering facility (controlled work area) be enclosed, temperature
and humidity controlled, and maintained at a positive pressure.
• Controlled Work Area (CWA) For the purpose of this statement, a Controlled Work Area
(CWA) is defined as an enclosed assembly / processing area maintained to a high degree of
shop cleanliness, environmental control, and foreign object debris (FOD) mitigation, either by
process or procedure, to limit the entry of contamination.
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E by DEK
Machine Standard Configuration
Services
Specification
Voltage
115 Volts to 230 Volts ±10%. Single phase 50/60 Hz
Maximum Current at 115V
6 Amps
Maximum Current at 230V
3 Amps
Over Current Protection
An external circuit breaker ≤20 Amps is required to be
fitted in line with the machine supply
Air Supply
To ISO 8573.1 Standard Quality Class 2.3.3
Pressure 5 bar to 8 bar
Shipping Information
Specification
Approximate Weight
810kg boxed (dependent upon configured options
selected with machine)
654kg unboxed (dependent upon configured options
selected with machine)
Approximate Dimensions
1342mm x 1624mm x 1472mm High
Certification
Specification
CE
98/37/EC
89/336/EEC
73/23/EEC
Subsequent amendments