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Improve production quality Improve production efficiency Improve profits Benefits provided with Saki’ s 3D-AOI series P r o d u c t i v i t y C o s t s P r o fi t s 4 5 Programming ⁃ One common platform supports 3D-SPI, 3D-A…

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3D-SPI
3D-AOI
3D-AOI
3D-AOI
3D-AXI
2D-AOI
Conformal Coating
Inspection Process
X-Ray
Inspection Process
Selective Soldering
Inspection Process
SMT Process
SMT Process
SMT Process
Internet
Cloud-based
Management System
2 3
Saki's Total Smart Factory Inspection Solution
QUALITY DRIVEN Production
SAKI maximizes production efficiency by
improving production-line quality.
Advantages of SAKI's Total Inspection Solutions
Today's technologies and markets demand advanced manufacturing,
high-mix low-volume production, precision quality, short lead times,
and low total cost-of-ownership. Saki's high-speed, high-accuracy
inspection and measurement systems, with enhanced software and
hardware platforms, satisfy those requirements. 
Saki's data capture capabilities and machine-to-machine (M2M)
connectivity maximize production efficiency for the Smart Factory.
Saki systems inspect the entire assembly process:
• Screen printing
• Dispensing
• Component placement
• Reflow
• Selective soldering
• Conformal coating
※ SPI: Solder Paste Inspection AOI: Automated Optical Inspection
Improve
production
quality
Improve
production
efficiency
Improve
profits
Benefits provided with Saki’s 3D-AOI series
Productivity
Costs
Prots
4 5
Programming
One common platform supports 3D-SPI, 3D-AOI, and 3D-AXI
Saki Self-Programming (SSP) Software
Compliant with IPC standards
Job Data Convert Function automatically converts Pick-and-Place machine data to inspection
machine data. This function greatly reduces the time required to create inspection data.
※1
※2
Measurement Inspection & Tuning Function
Offline-debugging with real-time program adjustments
Height and extra component detection (ECD)
functions
Through-hole device solder inspection
Verification
History Management System for
data logging and history
Golden & Silver Sample Check Function for
process verification
Side cameras capture areas missed by overhead cameras
Machine Stability and Accuracy
Self-diagnostic functions
Rigid gantry structure and dual motor drive system
High resolution linear scale for accurate positioning
CoaXPress camera for faster inspection & measurement process
Flexible Configurations for Diverse Requirements
Accurate 3D inspection & measurement for entire PCBA
Scalable optical resolutions of 7µm,
12 µm, and 18 µm
Flexible gantry for M/L/XL PCBA
sizes and dual lanes
Side Cameras
Saki’s innovative Z-axis optical-head
control feature is now available with
3Di Series inline AOI systems
Quality First
QUALITY DRIVEN Production
Saki's 3D-AOI systems
improve process quality,
efficiency, and productivity
to improve profits.
Saki combines proprietary hardware and software to produce a stable,
highly accurate system that improves production and maximizes
process efficiency and product quality.
AOISPI
Key Factor 1
Advanced Hardware Features
Key Factor 2
Advanced Software Features
Key Factor 3
Applied Technology
Machine-to-Machine Systems
Feed-back from SPI to printer
Feed-forward from SPI to Pick-and-Place
Feed-back from AOI to Pick-and-Place
Stand-alone Systems
RMS remotely manages multiple BF2-Monitors with one PC
MPV lets operators see every inspection result in real time
AOISPI AOISPI
※ 1 Get in touch to ask about details of
the machines on which it is available.
※ 2 Optional function.
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Key Factor 2
Advanced Software Features
Applied Technology
SAKI Technology for M2M Communication
Key Factor 1
Advanced Hardware Features
Proprietary Hardware provides
accurate measurements
Saki's machines are built with hardware that's made
to last.
A closed-loop, dual servo-motor drive system, high-
resolution linear scale, and rigid gantry structure
provide unsurpassed accuracy and repeatability for
absolute measurements.
An optimized conveyor
system, driven by step
motors, enables fast
PCBA loading and
unloading.
Self-diagnostic System
Saki's predictive and preventive maintenance
management system assures stable machine
conditions and repeatable, consistent performance.
Every key component is monitored along with system
conditions, and a detailed diagnostic log is recorded.
The optimized preventive maintenance plan reduces
maintenance time, machine down-time, manpower,
and costs.
Optical Unit
Four, multi-frequency digital projectors provide
accurate 3D measurements for high-quality images.
Three camera resolution levels—7µm, 12µm, 18µm—
are available to match application requirements.
Saki's CoaXPress interface in the overhead camera
captures images 1.7 times faster than previous models.
Enhanced 2D and 3D calibration uses multiple
calibration height targets for positive and negative
heights to guarantee height measurement accuracy.
Side Cameras *factory-installed option
A quad side camera system ensures inspection of the
entire board, including dead angles and areas missed
by overhead cameras.
Advantages of the new Z-axis package for the
3Di Series:
*factory-installed option
Extends maximum height-measurement range up to
40mm;
Uses standard AOI equipment to inspect special
components such as tall press-fit pins;
Enables accurate defect
detection and optical
character recognition (OCR)
of tall components;
Provides accurate inspection
when the PCB assembly is
clamped in a jig, allowing
standard AOI to tackle PCB
back-end processes.
Programming
Special BF2 software has a common user-interface
for Saki's 3D SPI, AOI, and AXI systems.
The software saves a full 3D image of the whole
PCBA, so the operator can create inspection data
without using the physical board.
Saki Self-Programming (SSP) Software
Saki's Self-Programming Function was developed on
the concepts of Board less, Skill less, and Stress less.
Inspection data can be easily created by using various
PCB design data in addition to Gerber data and CAD
data.
Inspection Data per IPC Standards
Default thresholds of inspection data conform to IPC
standards.
Measurement Inspection and
Tuning Function
Offline Debugging
Operator can edit
inspection data to check
previous Good/NG images,
or real-time defect images,
offline without any
production interruptions.
Warpage Adjustment
Warpage is compensated automatically. An accurate
height map is made
of the entire PCBA
surface, enabling the
Extra Component
Detection function to
detect foreign material.
Fujiyama (Through-hole Device Solder Inspection)
The Fujiyama algorithm
provides complete
through-hole joint
inspection in a single
step. It simultaneously
inspects for copper
exposure, pin detection,
pin-holes, solder fillets, and bridges.
Inspection Data Verification
History Management
System
The History Management
System records the detailed
data modification system
in detail (who, what, when,
where, why, and how)
Golden & Silver Sample
Check Function
Maintains inspection accuracy
by checking machine status
and inspection conditions
before starting auto
operation.
Time Based Maintenance
Condition Based Maintenance
TOP Camera Image
SIDE Camera Image
Gerber
Gerber
CAD XY
ECAD Design
Height ECD function
3D DIP Soldering
Linear scale image