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Yi el d r at e St r et ch an d Shr in k Pr odu ct io n Y ie ld X- ba r V ar ian c e • P AR MI ’ s m ai n op er at in g sc r ee n as si st s in a d dr es si n g an d st ab il iz in g th e s cr ee n p ri nt er p r oc es s …
• Managed by comparing the board image and Gerber Data,
fiducial coordinates and printed material offsets are
identified and communicated to upstream and downstream
processes supporting closed loop control.
• Innovative whole board scanning uniquely delivers precise
measurement of both the board surface and solder deposits.
• Steel castings and linear glass encoders dampen vibration,
address temperature fluctuation and provide high accuracy
and repeatability.
• Dual laser projection eliminates all
shadowing and produces the highest
level of measurement accuracy.
Using a high frame CMOS camera the
system realizes the 3D shape of the
entire board scanning area.
The Most Stable Platform
• Strong X/Y Stage and base frame
• Lightweight moving parts
• Most stable and fastest, vibration free
motion delivers high accuracy and
repeatability.
Electronic Components
Repositioned for Easier Access.
• Designed for front machine access
providing quick and easy access to the
operating system.
• Slide rail for PC makes you access to
back-side of machine easily.
All New Cover Design
• Refined and luxurious exterior
• Simple monitor console.
• Most external switches are eliminated.
Ultra-SLIM Footprint
• Efficient use of the inside space of the
machine.
• RSC 7 size reduced.
• Effectively increasing the inspection
area and reducing the machine
dimensions simultaneously.
0.85m
PCB Stretch and Shrink Management
PCB Warpage Measurement
Highest Quality Parts
Dual Laser Projection
Yield rate Stretch and Shrink Production Yield X-bar Variance
• PARMI’s main operating screen assists in addressing and stabilizing the
screen printer process by showing and analyzing the results by color, in real
time.
• User Interface windows are easily arranged, sized and saved per user
preference. Multi-level accessibility settings ensure program and process
integrity.
• Enables control of single or multiple SPI systems at remote sites. Helps to reduce manpower and obtain consistent quality
by managing all the equipment from a small number of managers.
Main Inspection Program (SPIworksPro)
• Defect analysis by time period and product model
• Analysis of defects by Warpage, Defect type, User ID, Inspection time on a
panel list basis.
• Shows 3D Images for Defective pads with adjustable viewing angles and
color.
Defect Analysis (DefectAnalyzerPro)
Variables SPC
• Average (Xbar) Control Chart
• Range Control Chart
• Standard Deviation Control Chart
• Moving range Control Chart
• Process Capability by Cp, Cpk.
Attributes SPC
• Non-adjusted Ratio Analysis, Yield rate monitoring
• Defect numbers, location, type, concentration analysis
• Height, Area, Volume Histograms
• Offset, Panel Shrink & Warp graphs
• Module & Model Yield statistical tools
Variables SPC
Attributes SPC Defect concentration
Warpage graph
• PARMI’s feature packed SPCworksPro software is practical and useful software for integrated process analysis.
Both Statistical and Attribute SPC data are provided. Monitoring and control of your Parmi machines is easily accomplished
both locally and remotely.
Statistical Process Control (SPCworksPro)
Remote Monitoring and Control (RMCworks)
Printer Doctor
PARMI’s Exclusive Printer Doctor takes prompt action to judge the
most probable reason of defects by itemizing all of the potential defect
elements in the printing process.
• Patent pending advanced technology
• Constantly analyzes solder paste deposit data in real time
• Identifies symptoms individually and by trend in real time to
determine if the process is at fault
• Offers user defined corrective actions for operators
• Defect description instructs the operator what to look for and where
the issue(s) are
• Intuitive user-friendly interface
• Manager editable descriptions allow for additional instructions for
the operator.
Single click access for information
including results and operator actions
Simple check box
shows status
Multiple process
variables monitored
• Partners : MPM, DEK, EKRA, Samsung Techwin, PDT, ESE, SJ Inno Tech, HIT,
and others
• Partners : Panasonic
Real Time Closed Loop System
Process Control by Closed Loop
Upstream Downstream
Closed Loop Feedback System Closed Loop Feed forward System
PARMI SPI communicate to placement machines
includes X, Y and rotational offsets, and bad mark data.
Automatic feedback of print offsets and print rotation as
well as the initiation of under stencil wiping routines to
continually improve print performance and reduce rework.