SIGMA_X_EN.pdf - 第6页

P ARMI CO., L TD Daed uk At omic V alle y 461 -63, J eonmin -Dong, Y useong -Gu, D aejeon City, 305-8 11, R. O.Kor ea TEL : +82- 42-478 -9900 F AX : +8 2-42-4 78-990 5 P ARMI Ameri ca (Bo ston) 362 Elm St ree t Unit 9 Ma…

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Yield rate Stretch and Shrink Production Yield X-bar Variance
• PARMI’s main operating screen assists in addressing and stabilizing the
screen printer process by showing and analyzing the results by color, in real
time.
• User Interface windows are easily arranged, sized and saved per user
preference. Multi-level accessibility settings ensure program and process
integrity.
• Enables control of single or multiple SPI systems at remote sites. Helps to reduce manpower and obtain consistent quality
by managing all the equipment from a small number of managers.
Main Inspection Program (SPIworksPro)
• Defect analysis by time period and product model
• Analysis of defects by Warpage, Defect type, User ID, Inspection time on a
panel list basis.
• Shows 3D Images for Defective pads with adjustable viewing angles and
color.
Defect Analysis (DefectAnalyzerPro)
Variables SPC
• Average (Xbar) Control Chart
• Range Control Chart
• Standard Deviation Control Chart
• Moving range Control Chart
• Process Capability by Cp, Cpk.
Attributes SPC
• Non-adjusted Ratio Analysis, Yield rate monitoring
• Defect numbers, location, type, concentration analysis
• Height, Area, Volume Histograms
• Offset, Panel Shrink & Warp graphs
• Module & Model Yield statistical tools
Variables SPC
Attributes SPC Defect concentration
Warpage graph
• PARMI’s feature packed SPCworksPro software is practical and useful software for integrated process analysis.
Both Statistical and Attribute SPC data are provided. Monitoring and control of your Parmi machines is easily accomplished
both locally and remotely.
Statistical Process Control (SPCworksPro)
Remote Monitoring and Control (RMCworks)
Printer Doctor
PARMI’s Exclusive Printer Doctor takes prompt action to judge the
most probable reason of defects by itemizing all of the potential defect
elements in the printing process.
• Patent pending advanced technology
• Constantly analyzes solder paste deposit data in real time
• Identifies symptoms individually and by trend in real time to
determine if the process is at fault
• Offers user defined corrective actions for operators
• Defect description instructs the operator what to look for and where
the issue(s) are
• Intuitive user-friendly interface
• Manager editable descriptions allow for additional instructions for
the operator.
Single click access for information
including results and operator actions
Simple check box
shows status
Multiple process
variables monitored
• Partners : MPM, DEK, EKRA, Samsung Techwin, PDT, ESE, SJ Inno Tech, HIT,
and others
• Partners : Panasonic
Real Time Closed Loop System
Process Control by Closed Loop
Upstream Downstream
Closed Loop Feedback System Closed Loop Feed forward System
PARMI SPI communicate to placement machines
includes X, Y and rotational offsets, and bad mark data.
Automatic feedback of print offsets and print rotation as
well as the initiation of under stencil wiping routines to
continually improve print performance and reduce rework.
PARMI CO., LTD
Daeduk Atomic Valley 461-63, Jeonmin-Dong, Yuseong-Gu, Daejeon City, 305-811, R.O.Korea
TEL : +82-42-478-9900 FAX : +82-42-478-9905
PARMI America (Boston)
362 Elm Street Unit 9 Marlboro, Ma 01752
TEL : +1-508-485-8120
PARMI China (Dongguan)
9-122 Xinyi No1 cuiyi Rd Changan town, Dongguan City Guangdong province, CHINA(523000)
TEL : +86-769-8150-1199
www.parmi.com
Specifications
Model SIGMA X Blue SIGMA X Orange
RSC VII 3D Sensor Camera
Measuring Principle Shadow free Dual Laser Optical Triangulation Shadow free Dual Laser Optical Triangulation
Camera System High Frame Rate C-MOS Sensor (4 Mega Pixels) High Frame Rate C-MOS Sensor (4 Mega Pixels)
Scan Speed (sq.cm/sec) 60 100
*
X-Y Resolution (µm) 10 x 10 10 x 10
Lateral Length (mm) 32 32
Height Resolution (µm) 0.1 0.1
Paste Type Supported All (Pb or Pb Free) All (Pb or Pb Free)
Board Type Supported All Colors and All Pads All Colors and All Pads
X-Y-Z robot Sensor Head Move in X-Y-Z Axis Sensor Head Move in X-Y-Z Axis
Performance
Height Repeatability 3 Sigma < 1 µm, on a certification target 3 Sigma < 1 µm, on a certification target
Area Repeatability 3 Sigma < 1%, on a certification target 3 Sigma < 1%, on a certification target
Volume Repeatability 3 Sigma < 1%, on a certification target 3 Sigma < 1%, on a certification target
Height Accuracy 2 µm, on a certification target 2 µm, on a certification target
Gage R&R
<< 10 % << 10 %
Measurement
*
Inspection Type Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink
PCB Warpage ±5 mm (2%) ±5 mm (2%)
Min. Paste Size (µm) 100 × 100 100 × 100
Max. Paste Size (mm) 20 × 20 20 × 20
Min. Paste Pitch (µm) 80 80
Max. Paste Height (µm) 1000 1000
Board Dimension
Minimum Size (mm) 50 x 50 50 x 50
*
Maximum Size (mm) 480 x 350
Standard : 480×350 (3 Stage Conveyor Option : 350 x 350)
Large : 580 x 510
Board Thickness 0.4 to 5 mm 0.4 to 5 mm
Maximum Board Weight (kg) 2 Standard : 2, Large : 5
TOP/Bottom Edge Clearance (mm/mm) 2.5/3.0 2.5/3.0
Underside Clearance 30 30
System Dimension
*
Dimensions (W x D x H) 850 x 1205 x 1510
Standard : 850 x 1205 x 1510
(3 Stage Conveyor Option : 1210 x 1205 x 1510)
Large : 950 x 1365 x 1510
Weight (kg) 800 Standard : 800, Large : 900
Conveyor Height (mm) 860 - 980 860 - 980
Conveyor Speed Range 300 mm/sec ~ 1000 mm/sec 300 mm/sec ~ 1000 mm/sec
Flow Direction Left > Right or Right > Left (Factory Setting) Left > Right or Right > Left (Factory Setting)
Conveyor Width Adjusting Auto Adjustable Auto Adjustable
Computer & Console
CPU I5 2500, RAM 16GB I5 2500, RAM 16GB (Large : RAM 32 GB)
Operating System MS-Window 7 64bit MS-Window 7 64bit
Display 20" LCD 20" LCD
Enclosure Conforms to CE Regulations Conforms to CE Regulations
Supplies AC 220V, 5 Kgf/sq.cm AC 220V, 5 Kgf/sq.cm
Software System
Inspection Program SPIworksPro SPIworksPro
Offline Teaching EPM-SPI EPM-SPI
SPC & Process Monitoring SPCworksPro SPCworksPro
Remote Machine Control RMCworks RMCworks
Defect Analyzer AnalyzerPro AnalyzerPro
System Diagnosis SPImanager SPImanager
Options
Ultra Sonic Sensor PCB Detect by Ultrasonic Sensor PCB Detect by Ultrasonic Sensor
Fixed Barcode System
Top/Bottom Side Recognition (Input Conveyor 150mm Extension) /
1D or D+2D
Top/Bottom Side Recognition (Input Conveyor 150mm Extension) /
1D or D+2D
Sensor Embeded Barcode System Topside Recognition (1D+2D) Topside Recognition (1D+2D)
Back Up Plate Back Up Plate / Back Up Pin (Bottom Clearance 25 mm) Back Up Plate / Back Up Pin (Bottom Clearance 25 mm)
UPS PC Power Save (7~8 min) PC Power Save (7~8 min)
HDD RAID System HDD Mirroring System HDD Mirroring System
• Please note that specifications and product information in this catalog are subject to change without notice.