XM8000 Brochure v6a web.pdf - 第3页
Measur ed Solutions TSV Metr ology XM8000-5 WB measures wafer bump characterization including voiding, presence, position, shape, size and bridging. Unlike optical tools, XM8000-5 WB can measure voids within the wafer bu…
Your Defect Detection Expert
2 | Nordson DAGE XM8000 Intelligent X-ray Metrology
Founded in 1961, Nordson DAGE is part of the Nordson Corporation
with a revenue of over $1.8 billion and over 6,000 employees worldwide.
Based in the UK, Nordson DAGE is the market leading provider of
award winning X-ray inspection systems. We enable our customers to
detect defects earlier in the manufacturing process to maximize product
quality, ROI and reduce costs.
Over 25% of Nordson DAGE employees are dedicated to Research,
Design and Development. Our vertically integrated approach gives full
control over all key technology components in our X-ray inspection and
metrology systems.
Dedicated X-ray and
Semiconductor teams
have focused their
expertize to create the
ultimate platforms for
wafer and packaging
level metrology.
Complexity Simplied
3 | Nordson DAGE XM8000 Intelligent X-ray Metrology
The semiconductor market demands increasingly complex devices that
are enabled by technologies such as TSV, PoP, 2.5D and 3D integration.
These complex products demand a new level of metrology. The XM8000
system delivers fully automated, non-destructive, radiation safe defect
detection for all complex devices.
202120202019201820172016
WLP GROWTH
2015
20142013
RF
MEMS
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CIS
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FPGA
Memory Photonic
RF
MEMS
CIS
FPGA
Memory
Photonic
TSV wafer starts, breakdown by application. Source: Yole Dévelopment September 2016.
Nordson DAGE XM8000 Intelligent X-ray Metrology | 3
Measured Solutions
TSV Metrology
XM8000-5 WB measures wafer bump characterization
including voiding, presence, position, shape, size
and bridging. Unlike optical tools, XM8000-5 WB can
measure voids within the wafer bump.
XM8000-7 TSV delivers high throughput metrology of
TSVs. Advanced 3D techniques are used to analyze
shape, ll and voiding at sub-micron levels.
Wafer Bump Metrology
Void Count
Silicon substrate
Position
Position
Presence
Prole
Position
Percentage Voiding
Fill
Size
Count, Volume
Silicon substrate
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Nordson DAGE XM8000 Intelligent X-ray Metrology | 5
Wafer Level Packaging
XM8000-WLP enables in depth analysis of all forms
of wafer level packaging. This analysis is customized
for such defects such as Cold Joints, Head in Pillow
(HiP), misalignment and missing features.
The intelligent, self learning capability of XM8000
allows unrivaled detection of micro defects in
complex packages.
Misaligned
Cold Joint
MEMS
CIS
FPGA
Memory
RF
Photonic
Head in Pillow
Layer Alignment
Silicon substrate
TSV
4 | Nordson DAGE XM8000 Intelligent X-ray Metrology
Intelligent defect measurement
The XM8000’s intelligence provides optimum
defect analysis, which eliminates the need for
operator interpretation and minimizes false calls.
As a fully automated system, exact measurement
criteria are measured, reproduced and repeatable
for consistent analysis across multiple sites,
customized to the specic device.
Continuous learning
The XM8000 continuously learns so it can improve
reliability and repeatability of defect recognition,
further eliminating false calls.
Unbeatable resolution
100nm defect recognition opens up a whole
new world of X-ray metrology applications. The
patented NT100M X-ray tube, unique to Nordson
DAGE, is 10 times brighter and intrinsically more
stable than conventional X-ray tubes. NT100M
utilizes a LaB
6
emitter instead of the traditional
tungsten lament, which typically only achieves
350nm defect recognition.
Consistency as standard
With unrivaled GR&R
to less than 5%, the
XM8000 utilizes the latest
high resolution stages to
1um accuracy providing
supreme repeatability.
Intelligent Defect Analysis
6 | Nordson DAGE XM8000 Intelligent X-ray Metrology
Clean by design
The XM8000 creates an ISO 1 environment for your sample.
Manufactured in a certied clean room environment and
specically designed for use in a semiconductor FAB, the
XM8000 design has been optimized to keep your
samples clean.
Device Protection
Nordson DAGE XM8000 Intelligent X-ray Metrology | 7
As devices become more complex and
sensitive to radiation exposure, providing
protection is ever more paramount. IC-Safe
Technology, unique to Nordson DAGE,
allows products to be safely inspected in-line
without risk of radiation damage.
IC-Safe lters
Protect samples from X-ray over exposure with IC-Safe lters.
Specically designed for your application to give total peace of
mind for your devices.
IC-Safe shields
When selective sampling is utilized, IC-Safe shields completely
eliminate radiation exposure to all other device samples not
under test.
IC-Safe Radiation Shield