XM8000 Brochure v6a web.pdf - 第4页
Intelligent defect measur ement The XM8000’ s intelligence provides optimum defect analysis, which eliminates the need for operator interpretation and minimizes false calls. As a fully automated system, exact measurement…
Measured Solutions
TSV Metrology
XM8000-5 WB measures wafer bump characterization
including voiding, presence, position, shape, size
and bridging. Unlike optical tools, XM8000-5 WB can
measure voids within the wafer bump.
XM8000-7 TSV delivers high throughput metrology of
TSVs. Advanced 3D techniques are used to analyze
shape, ll and voiding at sub-micron levels.
Wafer Bump Metrology
Void Count
Silicon substrate
Position
Position
Presence
Prole
Position
Percentage Voiding
Fill
Size
Count, Volume
Silicon substrate
XXXXXXXX
XXXXXXXXXXXXX
XXXXXXXX
Nordson DAGE XM8000 Intelligent X-ray Metrology | 5
Wafer Level Packaging
XM8000-WLP enables in depth analysis of all forms
of wafer level packaging. This analysis is customized
for such defects such as Cold Joints, Head in Pillow
(HiP), misalignment and missing features.
The intelligent, self learning capability of XM8000
allows unrivaled detection of micro defects in
complex packages.
Misaligned
Cold Joint
MEMS
CIS
FPGA
Memory
RF
Photonic
Head in Pillow
Layer Alignment
Silicon substrate
TSV
4 | Nordson DAGE XM8000 Intelligent X-ray Metrology
Intelligent defect measurement
The XM8000’s intelligence provides optimum
defect analysis, which eliminates the need for
operator interpretation and minimizes false calls.
As a fully automated system, exact measurement
criteria are measured, reproduced and repeatable
for consistent analysis across multiple sites,
customized to the specic device.
Continuous learning
The XM8000 continuously learns so it can improve
reliability and repeatability of defect recognition,
further eliminating false calls.
Unbeatable resolution
100nm defect recognition opens up a whole
new world of X-ray metrology applications. The
patented NT100M X-ray tube, unique to Nordson
DAGE, is 10 times brighter and intrinsically more
stable than conventional X-ray tubes. NT100M
utilizes a LaB
6
emitter instead of the traditional
tungsten lament, which typically only achieves
350nm defect recognition.
Consistency as standard
With unrivaled GR&R
to less than 5%, the
XM8000 utilizes the latest
high resolution stages to
1um accuracy providing
supreme repeatability.
Intelligent Defect Analysis
6 | Nordson DAGE XM8000 Intelligent X-ray Metrology
Clean by design
The XM8000 creates an ISO 1 environment for your sample.
Manufactured in a certied clean room environment and
specically designed for use in a semiconductor FAB, the
XM8000 design has been optimized to keep your
samples clean.
Device Protection
Nordson DAGE XM8000 Intelligent X-ray Metrology | 7
As devices become more complex and
sensitive to radiation exposure, providing
protection is ever more paramount. IC-Safe
Technology, unique to Nordson DAGE,
allows products to be safely inspected in-line
without risk of radiation damage.
IC-Safe lters
Protect samples from X-ray over exposure with IC-Safe lters.
Specically designed for your application to give total peace of
mind for your devices.
IC-Safe shields
When selective sampling is utilized, IC-Safe shields completely
eliminate radiation exposure to all other device samples not
under test.
IC-Safe Radiation Shield
Up to 30 Times Faster
8 | Nordson DAGE XM8000 Intelligent X-ray Metrology
Maximize throughput
The XM8000 performance is unbeatable in 24/7
operation. Clean room compatible and designed to
S2 and S8 standards, XM8000 fully integrates into
your production process further reducing unit cost.
High throughput automated sample loaders for
wafers, singulated packages, tape frames and tray
loaders are available.
Fully automated solution
The XM8000 is compatible with all SECS/GEM
factory host systems. This guarantees completely
automated processing with real time results fed
back to optimize FAB performance.
Dedicated 24/7 support
Nordson DAGE provide around the clock
support. Dedicated service support
engineers maximize your system uptime.
The XM8000’s robust platform will run
continuously with minimum maintenance
and dedicated support, maximizing your
throughput.
The Nordson DAGE XM8000 is the future of defect inspection
operating 30 times faster than any conventional X-ray system.
Customized Solutions
Nordson DAGE XM8000 Intelligent X-ray Metrology | 9
Applications
With over 150 collective years of industry
experience, our technical team develop custom
algorithms to detect and measure the defects
specic to your samples.
Consistent reliability
Proven consistency with unbeatable GR&R
reliability at micron levels across a multitude
of sample applications.
Sample handling
A comprehensive range of sample formats
is supported, including wafer, tapeframe,
singulated dies and panels.
Factory automation
All XM8000 systems are congured for your
SECS/GEM factory host as standard.
Future proof
As your needs change in the future,
Nordson DAGE is with you every step of
the way providing continuous, customized
applications support ensuring your system
meets today’s and tomorrow’s technology.
The XM8000 is customized and congured for your production line.
In-Line Inspection and Metrology