4600 Brochure (1).pdf - 第4页

6 | Nordson DAGE 4600 Series - Automated Bondtesters W afer lev el T est wafers fr om 2 inches to 8 inches Automate with the multi-functional cartridge µ pillar shear bump pull µ pillar pull We ’ve Go t it Cov ered 2” 4”…

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4 | Nordson DAGE 4600 Series - Automated Bondtesters Nordson DAGE 4600 Series - Automated Bondtester | 5
Operator free - remove all errors and
achieve the most accurate results
every time.
Load large batches of samples and
benet from robotic handling to load,
align and transfer each device to the
Bondtester.
Repeatable Results
Every Time
Our linear encoder stages with 100nm
resolution ensure you get to the right
location every time.
Data is Everything
Achieve maximum data integrity
with multiple on-board cameras
to recognize ducial markings and
automatically capture failure mode
images.
Remove the Expert
Paragon™ software is easy to use and
simple to set-up for a new product,
meaning you don’t need to rely on expert
operators as a single point of failure. A
single operator can manage multiple
systems if required.
Improve Tool ROI
Start the test then attend to other
work while the system automatically
completes large batch testing. Tests can
be controlled and data exported using
SECS/GEM protocols integrated with
your factory.
Ultimate Product Safety
Using robotic handling with vacuum you
can safely load and unload your product
and protect from handling errors and
damage. There is no risk of losing a batch
and no need to ever repeat a test.
Maximum UPH
Fully integrated cassette handling and
mapping capabilities combined with
device mapping delivers maximum
efciency. Achieve consistent UPH results
24/7 regardless of who is operating the
Bondtester.
Life with Automation
Improve data spread
Automated
Manual
6 | Nordson DAGE 4600 Series - Automated Bondtesters
Wafer level
Test wafers from 2 inches
to 8 inches
Automate with the multi-functional cartridge
µ pillar shear
bump pull
µ pillar pull
We’ve Got it Covered
2”
4”
6”
8”
Micro-electronics
Test every interconnect or die
Leadframes and strips
Package substrates
BGA
MEMS
Electronic systems have a range of test requirements including wire pull, ball shear, die shear and
surface mount shear.
Battery
Automate battery interconnect strength testing to
ensure maximum automotive safety.
For battery systems the intercell
connection technology requires
mechanical testing in either:
Wirebond Ribbon
To Busbar
Tab Weld
Destructive mode (sample testing)
Non-destructive mode (100% testing)
wire pull wedge/ball bond shear ball shear die shear SMD shear
270°180°
90°
Silicon, glass, laminate,
composite, compound and
warped wafers
Pillars and bumps <50µm
Test in any direction with the
rotational shear cartridge
8 | Nordson DAGE 4600 Series - Automated Bondtesters Nordson DAGE 4600 Series - Automated Bondtesters | 9
Test More with Automation
For the most complex devices
with a high density of bumps or
very ne pitch wires, automation
is the only way to ensure
maximum test accuracy.
Automation gives you the
precision required to achieve
the highest data integrity, test
after test.
Small dimensions
High density
Complex product
Fine pitch
Test the Extreme Data that Correlates
Manual 4600 Handler
Wafer/leadframe
Test repeatability
Rotary encoders High resolution linear encoders
Data integrity
Operator alignment
Fiducial recognition
alignment
Fiducial recognition
+ OCR
Test procedure
Operator control Automatic test
Product safety
Manual
load/unload
Automatic
load/unload
Throughput and ROI
Variable
(operator dependent)
The measurement cartridge is at the heart of every Bondtester and is critical to achieving accurate
and consistent results.
Nordson DAGE cartridge technology is interchangeable between each of our systems, enabling new
data to correlate with data up to 20 years old.
Future proof your bond testing systems:
Save costs and improve ROI - cartridges from older systems are
compatible with the latest mainframes
Guarantee data correlation - results
correlate across all platforms from the
4000 Series to the 4800 INTEGRA
!
Seamless transition - no adaptors
or cartridge alterations needed
New mainframes are designed
to accommodate new and old
cartridge technology