TDS_InJet_388_TWIN_CRD_ENG.pdf - 第3页
InJet ® 388 TWIN CRD TECHNICAL DATA SHEET 3 www.dct.cleaning C R C CLEANING RINSING DRYING R D Application name Recommended application Recommended temperature Total cleaning process time Capacity per 8 hours Stencil, mi…
InJet
®
388 TWIN CRD
TECHNICAL DATA SHEET
2
www.dct.cleaning
GENERAL INFORMATION
The InJet 388 series cleaning systems represent
unique vertical Spray-In-Air technology developed
and manufactured by DCT.
The vertically installed Spray-In-Air device minimizes the
shadowing eff ect commonly seen in horizontal cleaners,
and maximizes the effi ciency of the cleaning process as
the cleaning uid is sprayed directly onto the cleaned
component.
The InJet
®
388 TWIN CRD, including a 100% closed loop,
with cleaning, rinsing and drying technology processes.
All of the processes are fully automated and take place
in 2 process chambers, whereby the cleaning takes place
in the rst inlet chamber, after which the part which is being
cleaned is automatically transported via a central transfer
area to the 2
nd
process chamber, where the rinsing
and drying takes place. This chamber is also the outlet
chamber. Both chambers can be used in parallel, which
increases the machine’s capacity and reduces
cross-contamination when compared with single-chamber
devices.
The InJet
®
388 TWIN CRD is developed primarily for the
removal of solder pastes and SMT adhesives from stencils,
PumPrints, squeegees and misprints.
The cleaning system can also be used for PCBA, or for
acombination of board cleaning and the afore-mentioned
cleaning processes.
Both chambers can be used in parallel, thereby increasing
capacity.
Depending on your cleaning requirements,
the DCT project manager, in collaboration
with a local distributor, will advise you
on a suitable water-based cleaning fl uid
and the correct setup of the entire process.
InJet
®
388 TWIN CRD
TECHNICAL DATA SHEET
3
www.dct.cleaning
C
R
C
CLEANING
RINSING
DRYING
R
D
Application
name
Recommended
application
Recommended
temperature
Total cleaning
process time
Capacity
per 8 hours
Stencil, misprint, squeegee
20 – 40°C 68 – 104 °F 18 min. 48
PumPrint
40 – 55°C 104 – 131 °F 18 min. 48
PCB
35 – 55°C 95 – 131 °F 30 min. 768 *
3 INDIVIDUAL PROCESSES
CLEANING PARAMETRES
highly recommended recommended applicable
* PCB eurocards / per 8 hours (calculated for dimension of 100 x 160 mm / 3.94 x 6.3 in)
* * Parts in soldering palette / per 8 hours (320 x 500 x 50 mm / 12,6 x 19,7 x 1,97 in)
* * * Stencils, pumpprints larger than 736 x 736 mm / 29 x 29 in
LEGEND:
InJet
®
388 TWIN CRD
TECHNICAL DATA SHEET
4
www.dct.cleaning
TECHNICAL PARAMETERS
DIMENSIONS
MINIMUM SERVICE SPACE
AROUND THE MACHINE
1830 mm
72 in
2500 mm
98.4 in
1200 mm
47.2 in
2150 mm
84.6 in
600 mm
23.6 in
600 mm
23.6 in
600 mm
23.6 in
600 mm
23.6 in
open door
450 mm
17.7 in
open door
450 mm
17.7 in
Dimensions (w x l x h) 1200 x 2500 x 2150* mm 47.2 x 98.4 x 84,6* in
Weight 750 kg 1653 lbs
Ø energy consumption per cycle 1,54 kWh 1.54 kWh
Cleaning and rinsing uid consumption
per cycle
0,05 – 0,3 l 0.01 – 0.08 gal
Compressed air consumption per cycle 1 l / 5 Bar 0.26 gal / 72.5 PSI
Max. dimensions of the cleaned parts 100 x 810 x 740 mm 3.93 x 31.89 x 29.13 in
Exchangeable mechanical lter
of cleaning and rinsing uid
5 – 200 μm 5 – 200 μm
Operating pressures
cleaning: 1,5 – 2,8 Bar,
rinsing 1: 0,1 – 2 Bar
cleaning: 27.76 – 40.61 PSI,
rinsing: 4.35 – 21.76 PSI
Cleaning uid ow rate 200 l / min 52.8 gal / min
Temperature range setting of
the cleaning and rinsing uid
From ambient temperature to 60°C From ambient temperature to 140°F
Conductivity range settings of
the rinsing uid in the tanks.
0 – 2000 μS/cm * optional 0 – 2000 μS/cm * optional
Temperature range setting of the drying From ambient temperature to 80°C From ambient temperature to 176°F
Noise level < 70 dB < 70 dB
Device control PLC + 8,4“ touchscreen PLC + 8.4“ touchscreen
Volume of the storage tanks 80 l 21 gal
* Maximum dimension in operating condition
metric units imperial units