RAPID-NX-LINE-UK.pdf

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NEXT> is the new generation of flying

probers featuring a renovated and sleek look

thanks to the premium materials of the chassis,

and innovative electrical worth discovering

performances, undoubtedly the most complete

ﬂying probing test platform on the market.

Printed circuit boards are becoming increasingly

complex, featuring dozens of increasingly

smaller layers and pads, and as products

become smaller and smaller, designers have

begun to integrate both passive and active components, such as microcontrollers, voltage regulators or even power

devices like MOSFETs directly into the PCB. The result is, rather than being a passive support for the electronics, the

PCB has become an integral part of the circuitry of the ﬁnished product. This technological shift presents new

challenges to PCB manufacturers across their entire process, including test; the electrical test strategy must now be

extended to cover the veriﬁcation of the

embedded components and have the means to differentiate the types of

stimuli and measurements required to test the entire PCB without damaging these components.

INDUSTRY 4.0

Information, and the technology needed to

collect and analyze data is key to the

successful digitalization of the

manufacturing process, which is at the

heart of the

Industry 4.0 concept.

All the

RAPID NEXT> testers

feature the

Industrial Monitoring solution

“4.0 ready”

by Seica, to monitor current

absorption, supply voltage, temperature,

light indicators and other parameters useful to indicate the

correct operation, to ensure predictive maintenance and make

the systems compatible with the new standards of the fourth

industrial revolution ongoing nowadays.

ERSATILITY AND INNOVATION

The RAPID NEXT> line of Flying Probe test

systems offers unparalleled versatility eliminating

the need to manufacture a dedicated fixture for

every type of board. This considerably reduces

the time and costs needed for test setup.

These solutions are perfectly suited for testing

prototypes and pre-, as well as the low-volume,

high mix production lots which are typical in many

of today’s manufacturing scenarios.

Design modifications or variations can be

implemented immediately, and since there is no

constraint for a specific PCB layout, the system

can test on any geometry of today’s substrates

and have the capability to adapt to future

requirements. This maintains the value of the

capital investment over time.

FLE

IBLE ARCHITECTURES

FOR DIFFERENT MAR

ETS

To better meet the requirements of different operational and

manufacturing process flows, the

RAPID NEXT> Line

includes two mechanical architectures.

The

horizontal architecture presents systems oriented to the in-

line configuration for a completely operator-free test process,

whether it be high-volume, low mix or in today’s market, in-line

automation can also mean, or low-volume, high mix.

The

vertical architecture presents a reduced footprint, optimizing

the use of space, and has a highly ergonomic configuration in

terms of operator access and ease of use.

RAPID NEXT> LINE

is the new generation of seica solutions flying probers for PCBs, Ceramics

and Substrate Technologies

RAPID NEXT>: TEST CHARACTERISTICS

The RAPID NEXT> line of ﬂying probe systems is based on the VIVA Integrated Platform (VIP), Seica’s common-core

hardware and software platform which includes a complete set of high performance automated tools and instruments to develop

and execute test programs.

DIGITAL SIGNAL PROCESSOR

The integrated DSP-based instrumentation takes

advantage of the high deﬁnition and resolution of

the digital world to execute precision testing of even

the lowest value parameters. This ensurs repeatable,

full-range measurements even in the most critical

test situations and pushing fault coverage to

maximum levels.

FIBER OPTIC BUS

The proprietary, optical bus included in VIP ensure

noise-free communication between real time

devices and the system PC.

DRIVER/CONTROLLERS

The VIP platform includes proprietary motion driver/controllers that

are speciﬁcally designed for ﬂying probe test applications, which

means optimised test time, and no electrical interference in test

measurements caused by general-purpose motion electronics.

VIVA SOFTWARE

The innovative VIVA software organizes

test program development into a simple

3-step, Prepare-Verify-Test process,

which guides the user through a series of

automated operations in an intuitive,

self-explanatory environment. This

drastically reduces programming time

and practically eliminates the possibility for error and omissions,

consequently ensuring the quality of the ﬁnal test program.

GUARANTEED MECHANICAL RELIABILITY

With twenty years of experience as a leader in Flying Probe test

technology, Seica has the know-how and capability to equip the Rapid

line with a reliable, accurate and integrated mechanical system. The X-Y

axes utilize the latest generation technology linear guides and ball

screws, controlled by brushless motors, and are arranged in a geometry

designed to minimize the overall dimensions while optimizing the

motion and positioning accuracy.

The Z axes are driven by linear motors and are designed for maximum

accuracy and controlled dynamics of the probes.

Motion control is achieved with new generation

Seica digital drivers,

connected via optical ﬁber digital channels, for electrical noise-free

operation.

ULTRA FAST AND HIGH PRECISION

The new capacitive measurement unit, integrated directly on the mobile probes and based on DSP technology, enables the

RAPID NEXT> Line testers to perform high-precision capacitive measurements, further minimizing the test time.