Specification SIPLACE X-Series规格说明书2.pdf - 第5页
5 Overview of the Technical Data Maximum Values Placement ra te a IPC value Benchmark value Theoretical value a) See page 10 for a definition of the output values. 102,000 comp./h 120,000 comp./h 135,500 co mp./h Compone…

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SIPLACE X-Series
Content
01005 Placement 38
Machine Maintenance 39
SIPLACE Software Suite 40
General 40
Overview 41
SIPLACE Station Software 42
General 43
Software Version 705 With SMART GUI 44
SIPLACE Random Setup 45
Maximum Quality in Production 46
SIPLACE Services 47
Training Courses for the SIPLACE X-Series 48
Technical Data 49
SMEMA Interface 49
Connector Assignment 49
Signal Sequence 50
Siemens Signal Interface 51
Connector Assignment 51
Signal Sequence 52
Electrical Ratings and Compressed Air Supply 53
Electrical Connection, Interfaces and Compressed Air Connection 54
Dimensions and Set-Up Conditions 55
Dimensions of the Placement System 56
Placement System’s Center of Gravity 56
Maneuvering Radii for the
Component Changeover Tables 57
Maneuvering Radii for the MTC 58
Spacing Distances for the Single Conveyor 59
Spacing Distances for the Flexible Dual Conveyor 60
Spacing Distances for the Quad Lane 61
Spacing Distances for the Placement Machine With MTC 62
Transport and Delivery Configuration 63
Standard List 64
List of Options 65
List of Languages 67
SIPLACE X-Series Configuration Help 68
SR.705.xx 68
Compare SIPLACE 71
ESD Certificate for the SIPLACE X-Series 72
DIN EN (IEC) 61340-5-1 72
SIPLACE Awards 73

5
Overview of the Technical Data
Maximum Values
Placement rate
a
IPC value
Benchmark value
Theoretical value
a) See page 10 for a definition of the output values.
102,000 comp./h
120,000 comp./h
135,500 comp./h
Component range 01005 - 200 x 125 mm²
Placement accuracy
b
/
angular accuracy
b) The accuracy value was measured using the vendor-neutral IPC standard.
± 22 µm, ± 0.05° / (3),
± 30 µm, ± 0.07° / (4)
Gantry axes measuring system
X-axis resolution
Y-axis resolution
1 µm
1 µm
Feeder module types Tape feeder modules, waffle-pack trays, stick
magazine feeders, dip modules, application-
specific OEM feeder modules
Feeding capacity (component changeover
table)
160 8 mm X feeder modules
PCB format (length x width) max. 450 x 535 mm²
PCB thickness 0.3 - 4.5 mm (others available on request)
PCB weight max. 3 kg
Camera 6 illumination levels
SIPLACE X4I
SIPLACE X-Series machine colors
Machine protection: Light Basic Gray
(SIPLACE color code B002)
Pantone solid coated:
Warm Gray 3C
Hoods: Slate Gray, RAL 7015
(SIPLACE color code C002)
Hoods: Light Basic Gray
(SIPLACE color code B002)
Pantone solid coated:
Warm Gray 3C
SIPLACE X4I machine protection:
Slate Gray, RAL 7015,
(SIPLACE color code C002)

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Machine Description
Intelligent placement solu-
tions for the most rigorous
demands
If you need maximum flexibil-
ity, output or quality in the
placement process, the
SIPLACE X-series has the
technology you need to meet
any challenge associated
with SMT production.
Maximum modularity for
every need
The platform of the SIPLACE
X-series has a modular
structure, and can be per-
fectly adapted to meet all the
requirements of electronics
production.
Four different variants of the
placement machine are
available:
•SIPLACE X4I
•SIPLACE X4
•SIPLACE X3
•SIPLACE X2
The figures in the type desig-
nations represent the num-
ber of gantries. There is a
placement head on each
gantry. The optimized prop-
erties and broad component
range means that it is no lon-
ger necessary to change the
placement heads. They can
generally be matched to the
customer's requirements. As
well as the flexible SIPLACE
TwinStar for placing com-
plex models, the SIPLACE
X-series is also available
with the high-precision and
extremely fast SIPLACE
SpeedStar - the 20-segment
Collect&Place head. From
software version SR.703
onwards, all SIPLACE X
placement machines can be
equipped with the recently
developed SIPLACE Multi-
Star. The MultiStar - abbrevi-
ated to CPP head - brings
together two opposing prop-
erties: fast processing speed
and flexibility. For size 0201
to 27 x 27 mm² components
it achieves placement rates
of up to 23,500 comp./h. It
also extends the component
range up to a size of 50 x
40 mm². During placement,
the placement heads fetch
the components from the at-
rest component supply, and
set them down on the PCB,
which is also stationary. This
proven SIPLACE principle
guarantees reliable pick-up
of even the smallest compo-
nents, prevents the compo-
nents slipping on the PCB
and minimizes traversing
paths.
The user also has access to
different variants of the PCB
conveyor: the SIPLACE
single conveyor and flexi-
ble SIPLACE dual con-
veyor. The latter offers all
the benefits of the conven-
tional dual conveyor, such as
reducing non-productive
downtimes, combined with
the option of using the single
conveyor.
Quad Lane Conveyor
The quad lane conveyor
allows up to four different
products to be produced on a
line at the same time. It is so
flexible, that it can be config-
ured as a 1-lane, 2-lane or 4-
lane conveyor simply by
changing the software set-
tings. The quad lane con-
veyor can be ordered
together with SIPLACE X4I
and SIPLACE X4 placement
machines. The extremely
fast placement rate of these
machines can be efficiently
utilized, even for PCBs with
few components to be placed
or PCBs with very different
components on the top and
underside.
01005 placement without
compromise
The SIPLACE X-series is
designed to place 01005
components as standard.
There are also specially
developed nozzles for 01005
components that can be
used. With these prepara-
tions, the tiny components
can be processed without
any loss of quality and
speed. The components can
be placed with minimal spac-
ings and independently of
large components that are
beside the 01005 com-
ponent. This equates
to true 01005
capability.
SIPLACE MultiStar