Specification SIPLACE X-Series规格说明书2.pdf - 第8页

8 Modular Machine Concept Step 1: Placement machine without heads and component changeove r tables SIPLACE X4I SIPLACE X4 SIPLACE X3 SIPLACE X2 Step 2: Select the plac ement heads SpeedStar (C&P20) MultiStar (CPP) Tw…

Machine Description

Incredibly fast new prod-

uct introduction (NPI) with

external set-up preparation

and SIPLACE vision teach-

ing

The SIPLACE X-series dem-

onstrates its strengths in

terms of the flexible produc-

tion environment, as well on

the high-performance side.

For example, NPI can be

implemented as fast as pos-

sible with the SIPLACE Vir-

tual Product Build. This NPI

solution allows you to pro-

gram offline, set up and

check offline and to make

adjustments offline with the

SIPLACE Pro software.

This increases machine utili-

zation and reduces waste.

And with respect to the cur-

rent production run, the

SIPLACE vision teaching

station also makes it

extremely simple and fast to

generate package form

descriptions, even for com-

plex components. The set-up

process starts once you have

optimized the product and

defined all the components in

the programming system.

This is also done externally

and then checked by means

of the barcode and data

transfer.

Lowest dpm with set-up

verification and sophisti-

cated sensors

The highest machine quality

allows the SIPLACE X-series

to produce the highest prod-

uct quality. This is guaran-

teed by a number of addi-

tional features. Sensors

check the presence and

position of the components

before and after every pick-

up and placement operation

at the placement head. The

digital vision system

detects the components

faster and more reliably than

the old analog technology. In

addition, set-ups are verified

on the component roll and by

the intelligent SIPLACE X

feeder modules with refer-

ence to the barcode. This

network of tests considerably

lowers dpm rates and

increases the first pass yield.

100% uptime with intelli-

gent feeder modules

The SIPLACE X-series

works with intelligent feeder

modules that greatly simplify

set-up and set-up change

tasks. For example, the

SIPLACE X feeder modules

can even be simply con-

verted while production is

running, thus greatly reduc-

ing machine stoppages.

SIPLACE X4 LED placer

SIPLACE X4-series place-

ment machines occupy a

sizeable segment of the mar-

ket for the production of LED

backlight units for monitors.

With software SR.705

onwards we provide a config-

uration for SIPLACE X4

machines that is specially tai-

lored to the needs of custom-

ers who produce these LED

backlight units.

The SIPLACE X4 LED placer

is based on a SIPLACE X4

machine with four C&P20 or

CPP placement heads. Spe-

cial component tables are

installed in place of compo-

nent trolleys. Special cus-

tomer-specific bowl feeders

supply the LED compo-

nents. If there is only a bowl

feeder set up at the location,

a tape cutter must not be

installed at the same loca-

tion. The feeders are opti-

mally supported by the

station software with func-

tions such as the empty

feeder function, for example.

It is also possible to set up

additional SIPLACE X-feeder

modules. The PCB single

and dual conveyors pro-

cess printed circuit boards up

to 850 mm long.

Modular Machine Concept

Step 1: Placement machine without heads and

component changeover tables

SIPLACE X4I

SIPLACE X4

SIPLACE X3

SIPLACE X2

Step 2: Select the placement heads

SpeedStar (C&P20)

MultiStar (CPP)

TwinStar (TH)

Step 3: Select the conveyor

Single conveyor

Flexible dual conveyor

Quad lane conveyor

Step 4: Select the component changeover table

and MTC

SIPLACE X component changeover table

MTC

Step 5: Select the feeder modules

X tape feeder modules

Label presenter

Reject conveyor

Waffle-pack tray holder

Modular Machine Concept

Example of the SIPLACE X4

NCH2

NCH1

NCH2

NCH1

C&P20/CPP/TH

MTC/X

C&P20/CPP/TH

NCH2

NCH1

NCH2

NCH1

PA1

PA2

C&P20/CPP/TH

MTC/X

C&P20/CPP/TH

33 Stationary IC camera, type 33

(with MultiStar and TwinStar only)

BZ Buffer zone

C&P20 SpeedStar

CPP MultiStar

MTC Matrix Tray Changer

NCH1 Nozzle changer, row 1

NCH2 Nozzle changer, row 2

OP Operator panel

PA1 Placement area 1

PA2 Placement area 2

TH TwinStar

X SIPLACE X component changeover table

PLEASE NOTE: The head configurations can be found in the

“Machine Performance” section from page 10.