FA1116_datasheet_eng_20191022H.pdf

FL YING PROBE TESTER F A1 1 16 N o w w i th ne w l y de v e l oped l o w -imp act pr obe s and preci s i on s o ft - l anding co n tro l 30 % f aste r cy cl e times f or g o l d p la ting and n e pa tter n tes ting H al…

FLYING PROBE TESTER FA1116

Now with newly developed low-impact probes and precision soft-landing control

30% faster cycle times for gold plating and ne pattern testing

Half the impact mark depth

High-speed testing at up to 100 points/sec.

Call us：400-806-2189

Reduced-impact link probes

CP1072-01

(option)

High capacitance measurement resolution of 5

aF (1 aF = 10

-18

Capacitance measurement master creation

algorithm

Laser Hight-adjustment unit

FA1950-06(option)

Reduced fine pattern test times

Optional functionality for enhanced capability

Improved front cover for more efficient use

By combining newly designed reduced-impact probes and

precision soft-landing control, the FA1116-03 makes it possible

to approach the maximum speed setting during fine pattern

testing.

Stable, high-resolution measurement ensures that fine pattern

defects such as standalone pads are detected. Since capacitance

values are displayed directly, differences from the reference

board can be easily identified.

A proprietary algorithm designed by Hioki to keep defective

boards from being sent on to the next manufacturing process

aids in the creation of capacitance master data, which can be

created from a single known-good reference board.

Large testing area

The 610 (W) × 510 (D) mm testing area can accommodate

everything from small pieces to large-format boards.

Support for 10 mm probe-up height

Thick ceramic boards and probe cards can be easily positioned

in the tester.

Vacuum suction for easy board clamping

A vacuum suction system is used to clamp the board under test.

Even thin boards and round boards can be clamped with ease.

High-speed image processing system

A new image processing driver (with Windows 7 support) speeds

alignment, reducing test time.

The laser board thickness compensation unit checks the height

of the testing surface at the start of automatic testing to reduce

the effect of differences in board deflection and thickness on

probe impact. Probe damage caused by a failure to properly

clamp the board can also be prevented.

The FA1116-03 delivers continuous testing of a 15 μm fine

pattern at 50 points/sec. (0.03 mm movements, simultaneous use

of two arms, capacitance measurement).

■

MLCC Measurement Unit 1937-40

A dedicated multi-layer ceramic capacitor (MLCC) mode

allows JIS-compliant measured value acquisition.

■

Insulation Measurement Feature 1938-10

A high-speed insulation test function operates at up to 500

MΩ/250 V. Arc detection support is also available on a

special-order basis.

■

Blue Coaxial Downward Illumination Unit 1945-70

The FA1116-03’s coaxial downward lighting uses blue

LEDs to provide effective lighting of ceramic and glass

boards.

■

Dot Marking Function FA1941-01

The FA1116-03 uses oil-based ink to create marking dots

with a diameter of 2 mm. It can also mark CSPs and other

small pieces.

The size of the opening on the front of the tester has been

increased by 30%. Increased rigidity and a large handle make it

easy to open and close the cover quickly.

Precision soft-landing function

Probes are lowered at high speed.

Then, just before they come into

contact with the pattern, the motor’s

acceleration is controlled in an

optimal manner to lessen the force

of impact at contact.

Featuring newly designed probes and precision control for

half the impact mark depth of previous designs

Rapid testing, regardless of board type

Previous size

The Z-axis descent speed for gold plating and fine pattern testing can be set higher than with

previous models.

Easily position the target board and start testing, even for thin-film boards and thick,

round boards.

Extensive measurement functions and optional units reduce backlogs of untested boards.

*Compared to the C HiTester 1116.

Distance (D)

Board

surface

Time (T)

Soft landing

The FA1116-03 can be used in conjunction with the UA1782, which supports boards with embedded passive

and active devices, to facilitate repair work. Support for not only the FA1116-03, but also all Hioki electrical

testing systems, including the FA1282, C HiTester 1116, and 1230 series (designed for mass-production testing),

makes it easy to build a bare board testing system.

High-speed pattern testing using

capacitance measurement

Methods for calculating the number of test

steps

Any given pattern on the board under test will have a certain

capacitance relative to the electrically isolated test electrode, and

that capacitance is proportional to the area of the pattern. Any

short or break in the pattern will cause a corresponding change in

the area of the pattern, with a resulting change in its capacitance

value. By comparing the measured value to data for a known-

good reference board, it is possible to detect pattern shorts and

breaks. Since capacitance values can be read directly, judgments

can be made based even on minuscule changes in the capacitance.

Furthermore, the FA1116-03’s master extraction algorithm allows

the same approach to be used without regard to board type, from

single-sided glass boards to multi-layer and high-density boards.

In continuity testing, testing for breaks in pattern A require three

test steps: (1)-(2), (1)-(3), and (1)-(4). Similar tests are required for

patterns B and C. Furthermore, when testing for shorts between

patterns A, B, and C, it is necessary to test A-B, A-C, and B-C.

As the complexity of the circuits increases, an enormous number

of test steps become necessary. In testing using capacitance

measurement, it is possible to test for both breaks and shorts with

the minimum number of test points and arm movements since

only the endpoints of each pattern need to be tested.

If there is a break near the end of a pattern as

shown below, the capacitance at point B will vary

significantly, even though the capacitance at point A

varies only slightly. In this way, the break can be

reliably detected.

Capacitance value with no break: CX = CX1 + CX2

Capacitance value with break: CX = CX1

With a break, the detected capacitance value is less than

the corresponding value for the known-good reference

board. With a short, the capacitance value increases by

the capacitance of the other pattern.

Location of break

Cx1

Cx2

Pattern

Test

electrode

Fail Visualizer UA1782 for repair work

Capacitance test route

(4)

(2)

(3)

(1)

Break

Pattern

Comparison of test steps

For 100 nets and 500 total endpoints

Resistance measurement Capacitance measurement

Testing for

breaks

All nodes on same net

500 - 100 = 400

Detection of breaks and

shorts using capacitance

measurements for all

endpoints

500

Testing for

shorts

nCr =

100

100 × (100 - 1) / 2 = 4,950

Total steps 5,350 500

EPA-LINE

Barcode scanning

FLY-LINE

Real-time monitoring

UA1782 Fail Visualizer

Simultaneous display of components and patterns

Importing of display databases Importing of fail results