FuzionSC_Platform_brochure.pdf - 第4页

Differentiation Through Knowledge All Markets Leverage process expertise and years of experience Advanced Process Lab focused on realizing rapid product introduction, maximizing yield and optimizing reliability • Leading…

New Benchmark

Achieve best accuracy at highest speed over largest area

±10µm accuracy, < 3µm placement repeatability

• High-stiness frame, within 1µm from corner to corner

• Proprietary VRM linear motor: thermally stable, dual-drive, 1µm resolution

• Optimized motion control for sub-micron repeatability

• Environmental thermal management

• High-resolution optics, mapping and calibration routines

• Two-step precise global ducial nd

• Look before pick

• Top Alignment Process (TAP)

• Accuracy Management System (AMS) validates accuracy while in production

• AOI feedback and placement adjustment

High throughput up to 10K cph APAS, 30K cph standard applications

• Dual-drive VRM linear motor with fast motion response and settling times

• Available dual-beam congurations with multiple heads

• Multiple heads/spindles reduces number of cycles from pick to place

• Gang pick and gang dip maximizes cycle time eciency

• On-the-y vision with large eld of view

Populate the largest panels to process higher die counts

• Traditional platforms follows wafer form factor, limiting assembly size

• Populate panels without sacricing speed or accuracy

• Achieve a 7X processing increase!

300mm

~71K mm

625mm x 813mm

~508K mm

All-in-one platform for any assembly challenge

Place broad range of die and components on one platform

• High-accuracy ip chip, bare die, surface mount, and odd-form

• Full range of die: 0.5–40mm, 0.05–4mm thick

• Advanced vision algorithms, programmable lighting, bump recognition down to 20µm

• SMT: 01005–55mm square and up to 25mm tall

• Supports solder/ux dipping and pin transfer

• 150–5000g placement force (lower-force options available), dynamic force control

Placement capability from ANY feeding option

• Wafer, tray, tape, tube, and bulk

• Supports wafers up to 300mm and multiple die part numbers

• Tape: 4 x 1mm (01005) up to 56mm

• Matrix tray: supports stationary and automated stackable feeders (2x2, 4x4, JEDEC)

All-Around Performer

Place on ANY substrate

• Thin, thick, narrow, and large assembly area

• Substrates, wafers, lead frames, ceramics, glass, ex, and laminates

• Reel-to-reel systems

Bare Die

Flip Chip

Chip

LED

Tant Cap

SOIC

TSOP

DPAK

QFP

BGA

PLCC

CSP

Electrolytic Cap

Connectors

CCGA

BNGA

Odd-Form

Pin-in-Paste

Differentiation Through Knowledge

All Markets

Leverage process expertise and years of experience

Advanced Process Lab focused on realizing rapid product introduction, maximizing yield and

optimizing reliability

• Leading-edge, fully equipped laboratory

• Optimized assembly solutions (design, materials, process, pioneering equipment technology)

for new and existing products

• Prototyping and development, rst article build, NPI, volume production

• Design for Manufacture (DfM), Design for Reliability (DfR)

• Research partnerships: industry-leading Consortium, multiple University collaborations

APAS applications since 1990; thousands of platforms, all markets

• Flip Chip in Package

• System-in-Package

• Wafer-Level Packaging

• Embedded

• High-Accuracy Place

• High-Speed Passive

One solution for all advanced packaging application challenges

The precision performance and versatile capabilities of the FuzionSC deliver maximum throughput per oor space for virtually any application. With

an unbeatable combination of speed, accuracy and exibility, FuzionSC will have you well-positioned for your next product.

• Substrate and carrier handling with

precision lifter and vacuum tooling

• Flux dip capability with Linear Thin

Film Applicator (LTFA)

• Supports up to 4 Innova direct die

feeders for multi-die applications

• High-speed passive/SMT device

placement

• Vision algorithms/lighting support

all substrate materials & packages

• Look-before-pick ensures highest

pick accuracy

Flip Chip in Package

• Best accuracy (±10µm) at highest

speed over largest area

• Supports panels up to 610mm x

813mm

• AOI accuracy feedback for

post-process compensation

• Software supports high die count

assemblies

• Precision material handling and

thermal stage options

• Die-level traceability SECS–GEM

Wafer-Level Packaging

• Thin and narrow substrate handling

• Bad circuit detection, electronic

pass-down

• Gang ux dip for maximum cph

• Supports up to 4 Innova direct die

feeders for multi-die applications

• High-density passive placement,

01005 and smaller, 4x1 feeding

• Small ducial & ducial teach-by-

show pattern nd

• Highest speed ip chip placement

System-in-Package

• Best accuracy (±10µm) at highest

speed over largest area

• Panels up to 610mm x 813mm

• Supports high device count, both

passives and actives

• AOI accuracy feedback for

post-process compensation

• Precision material handling and

thermal stage options

• Die-level traceability SECS–GEM

• Top-side alignment (TAP) process

Embedded

• Available dual-beam congurations

with multiple heads

• Up to 14 spindles with gang pick

• Up to 30,750 cph

• 4 x 1mm tape feeders

• High-speed & high-accuracy modes

• Bad circuit detection, electronic

pass-down

• Custom applications tooling:

nozzles, substrate support

• Motion proles for sensitive

device handling

High-Speed Passive

• High speed, high accuracy

• 01005–55mm sq & up to 25mm tall

• Top-side alignment (TAP) process

for LED headlamps, CPV

• Advanced vision algorithms,

programmable 3-axis lighting

• Wafer, tray, tape, tube, and bulk

feeding formats

• Custom applications tooling:

nozzles, grippers, substrate support

• Up to 5000g force, 30 seconds

dwell

High-Accuracy Place

FuzionSC Portfolio & Solutions

Capability Designed In

FuzionSC2-14

For higher throughput requirements

FuzionSC1-11

Lower cost with additional exibility

Dual-beam, dual-drive overhead gantry system Single-beam, dual-drive overhead gantry system

2 FZ7 (7-spindle) placement heads 1 FZ7 (7-spindle) + 1 optional FZ4 (4-spindle) placement head

450ms tact time (w/ ux dipping), 360ms (w/out) 750ms tact time (w/ ux dipping), 600ms (w/out)

FuzionSC2-14 Specications FuzionSC1-11 Specications

Throughput (cph) 30,750 (Max) / 14,200 (4-Bd IPC Chips) 16,500 (Max) / 8,400 (4-Bd IPC Chips)

Accuracy (µm@>1.00 Cpk) ±10 (Array Devices/Flip Chip) / ±38 (Passives/Chips) ±10 (Array Devices/Flip Chip) / ±38 (Passives/Chips)

Max Board Size 508 x 813mm (20 x 32”), larger board specials available 508 x 813mm (20 x 32”), larger board specials available

Max Feeder Inputs (8mm) 120 (2 ULC) 120 (2 ULC)

Feeder Inputs Types Wafer (up to 300mm), tray, tape, tube, and bulk Wafer (up to 300mm), tray, tape, tube, and bulk

Component Range (mm) (0201) .25 x .5 x .15 (Min) to 150 square (MFoV), up to 25 tall (0201) .25 x .5 x .15 (Min) to 150 square (MFoV), up to 25 tall

Min Bump Size & Pitch (µm) Bump Size: 20, Bump Pitch: 40 Bump Size: 20, Bump Pitch: 40

Advanced technologies for advanced applications

FuzionSC features specialized technologies to address leading-edge component packaging challenges.

Fast, precise PEC Camera

Advanced vision algorithms

& lighting

Precision lifter & tooling

Versatile substrate handling

VRM Linear Motor

Positioning System

Accurate, exible

FZ™ placement heads

Multiple feeding options for

ip chip, bare die, SM

High-resolution Magellan™

digital cameras

• High-accuracy (1µm resolution), closed-loop positioning

control supports converging & emerging technologies

• High acceleration (up to 2.5G), thermally stable

• Self-correcting, dual-drive control reduces settle times

VRM Linear Motor Positioning System

• High-resolution (.27MPP)

• Programmable lighting, wavelength illumination, cross

polarization

• Standard/taught ducial and pad site recognition

Fast, precise PEC Camera

• Precision accuracy (27µm @ Cpk>1)

• 0201 – 150mm square (MFoV), up to 25mm tall

• High-speed IC and chip, gang pick up to 7 components

• Standard Package-on-Package (PoP) functionality

Accurate, exible FZ™ placement heads

• Front, side, and on-axis combination lighting

• Lighting calibration performed on the machine,

eliminating machine-to-machine intensity variation

• Lighting intensity is consistent across viewable area

Advanced vision algorithms & lighting

• Wafer, tray, tape, tube, and bulk

• Up to 4 direct die feeders, wafers up to 300mm

• Stationary and stackable matrix trays

• Standard and dual-lane tape for small passives

Multiple feeding options for ip chip, bare die, SM

• Handles strips/lead frame, auer boats, carriers/pallets,

boards/panels from 0.10mm – 12.0mm thick

• Integral vacuum generator

• Precise registration of the substrate in x, y and z axis

Precision lifter & tooling

• Supports all ip chip and SM devices

• High resolution of 1024 x 1024 enables small part

feature recognition

• 2.3, 0.94, 0.5, 0.2MPP (supports 20µm bumps/pillars)

High-resolution Magellan digital cameras

• Thin, thick, narrow, and large assembly area

• Substrates, wafers, lead frames, ceramics, glass, ex,

and laminates

• Large substrates up to 625mm x 813mm

Versatile substrate handling

Scalable solutions for cost-ecient productivity

Stand-alone machine solution – All-in-one eciency

Single-beam for high exibility, dual-beam for higher throughput; Wafer, tray, tape, tube,

bulk feeding – Fan-Out WLP, Die Attach, Lid Attach, High-Accuracy Place, Embedded

Mass reow – Full-process, high-mix/NPI

Complete process solution supporting multiple feeding formats and ux or solder paste

dipping – Package-on-Package, System-in-Package, 2.5D, Flip Chip, SMT, Odd-Form

Mass Reow – Scaled assembly, Medium-mix, medium-volume

Complete process solution with dedicated chip placer and exible high-accuracy placer

supporting HVHM tray packaging – High-Speed Passive, High-Accuracy Flip Chip

Mass Reow – Medium to high-volume

Complete process solution with chip placer and high-accuracy placer; higher volume,

same footprint – System-in-Package, High-Speed Passive, High-Accuracy Flip Chip

Mass Reow – Versatile high-volume

High-throughput full process solution with large feeder capacity for streamlined change-

overs – System-in-Package, High-Speed Passive, High-Accuracy Flip Chips, WLP

FuzionSC1-11 FuzionSC2-14

FuzionSC1-11 PTF

FuzionSC1-11 PTFFuzion1-30

FuzionSC2-14Fuzion2-60

FuzionSC2-14 PTFFuzion4-120Fuzion4-120