Condenso_Series_EN.pdf - 第8页

8 Void-free (ca vity-free) soldering with unleaded solders is an important requirement for man- ufacturing power electronics. However , lower void rates can only be achieved with soldering processes where the molten sold…

Galden

storage container

Filter granules

Low medium consumption

Resource-conserving and efcient

After soldering, the assembly is passed onto the cooling process. Process gas is extracted and cleaned

at the same time. Therefore, a large part of the Galden

can be reused – which is a solution that saves

a great deal on materials, and is environmentally friendly! A vacuum is created during extraction which

also ensures that soldering material is dried quickly.

The extracted Galden

is ltered and cleared of impurities

using granules. Approx. 99.9 % of the medium can be

recovered as a result. The cleaned fluid is made available

in a container for other processes. “Loss of vaporisation” is

low during soldering due to hermetically sealing the process

chamber. As well as little need for maintenance, you benet

from low medium consumption, and save money as a result.

› No loss of vaporisation in the process chamber

› Medium filtering and re-use

› Environmentally friendly

Condenso series | Medium consumption

Void-free (cavity-free) soldering with unleaded

solders is an important requirement for man-

ufacturing power electronics. However, lower

void rates can only be achieved with soldering

processes where the molten solder is subjected

to a vacuum.

The residues that remain in the soldered joint can

escape more easily due to the vacuum. The Con-

denso series can be tted with a vacuum pump

as an option for this reason. You end up with

soldered joints with a surface binding proportion

of up to 99 %. Vacuum can also be drawn during

the melt phase, even before the actual solder-

ing process. This doesn’t just allow the Galden

steam to be evenly distributed in the process area,

but also enables the solvent and moisture to be

de-gassed from the solder paste. In addition, the

atmosphere can also be varied in the process

chamber throughout the whole dwell time as well

the temperature.

Why vacuum?

Reliable, reproducible soldered joints

Tliq

Pressure

Condenso vacuum technology is used in a wide range of processes. Oxidation is reduced

for drying and adhesive processes, and soldered joint reliability is increased during

reow soldering by reducing voids.

Condenso vacuum technology

for void-free results

›

Pre-vacuum:

- Prevention of oxidation, drying (solder paste, adhesives)

- Homogeneous Galden-gas-distribution (3-dimensional soldering)

- Micro wave plasma (pre-cleaning)

›

Vacuum during reow soldering: Improved wetting

›

Vacuum after reow soldering: Avoiding voids

Surface contacts

up to 99 %

Improved lling of

micro vias and

THD-solder joints

Minimum of voids

(particularly important on

power electronics)

Improved

wetting

With VacuumWithout Vacuum

Condenso series | Vacuum