Condenso_Series.pdf - 第21页

Process documentation, traceability & co. Th e variet y of ME S syste ms on the market re quires indivi- dual a djust ment o f d ata tran sfer from the Reh m refl ow so l- dering syste m to th e client’s su perordina…

Innovativesoftware

Big data and process management

Integratinghighlyspecialisedsoftwareinmodernmanufacturewillbecomemoreand

morecommoninfuture.Systemsandprocessesaremanaged,monitored,analysedand

optimised.Theorder,productdata,eciencyandstatusdata,speciedsettings,archived

prolesandcurrentvaluesareincorporatedintothemachinecontrolsystemproduct

documentationandanalysis.

With ViCON Condenso, Rehm offers a clear software package for the Condenso series that

is intuitive to use with its touchscreen interface. All messages, commands and parameters

arevisibleataglanceonthemainscreenwithitsmachineview.Simpleprolingwithclearly

structured process stages is therefore possible – with or without the vacuum option.

With numerous other features, such as a favourites bar that can be set up as required, struc-

tured grouping of parameters and individual process monitoring and documentation, ViCON

offers you optimal support for your manufacturing processes.

Process documentation, traceability & co.

The variety of MES systems on the market requires indivi-

dual adjustment of data transfer from the Rehm reflow sol-

dering system to the client’s superordinate manufacturing

management system (MES). Superordinate to this is the

ERP system, which the whole company looks at, and which

allows for logistic optimisations across all sites. However,

the MES system focuses on a company’s individual produc-

tion lines. Rehm uses an ROI interface (Rehm open inter-

face)totransferindividualdata.Machine-specicoperati-

onal data that is due for the respective system is collected

and passed onto the MES system as a bundle. It is possible

to ensure the seamless traceability of products, compo-

nents or batches in this way. A data set is created for every

assembly, which documents the relevant process parameter

duringtherun.Theassemblycanbeclearlyidentiedand

assigned via a barcode scan on the assembly itself, or by

scanning the batch card. Process locking is also available

as an option. Here, the scan is compared with the database

and the assembly is only transported to the system in the

event of approval. Defects can be detected and prevented in

this way and therefore lead to process improvements.

ManufacturingExecutionSystem(MES)

Productioncontrolatoperationallevel

Superordinate manufacturing management system for planning

and monitoring production processes

EnterpriseResourcePlanningSystem(ERP)

RehmOpenInterface(ROI)

Datatransmission

Data is transmitted using an interface with the superordinate

manufacturing management system

Linemonitoring

OIC(OverallInline

Communication)

Processlocking

Control

Comparisonofthecongured

program with the assembly to

be manufactured

Traceability

of all process-relevant data

Companylevel

Dataacquisition

Productionmonitoring

Process-relevant data is collec-

ted with the system software

Operationallevel

Stop

If there is no

match, an alarm

message is issued

Productionlevel

Condenso series | Software

Accurateprolingcapability

3stepstoaprole–5stepswithvacuum

5 steps with vacuum

A pre-vacuum doesn’t just allow the Galden

steam to be evenly

injected, it also enables solvents and moisture to be de-gassed

from the solder paste. After the max. soldering temperature has

been reached, the gases that are still present can escape from

the solder paste more easily using an end vacuum. Surface

binding of up to 99 % occurs as a result.

1.Pre-vacuum|UniformdistributionoftheGalden

2.InjectionoftheGalden

|Pre-heatingofthePCB

3.InjectionoftheGalden

|Idealsolderingtemperature

4.Vacuumduringthemeltingphase|Void-freesolderjoint

5.ExhaustoftheGalden

|Cooling

Thismakesprolingsimple!WiththeRehmCondensoseries,

youonlyneedthreestepstocreateanoptimumproleforyour

assembly. What’s more, the possibilities are endless for further

reningandadjustingyourprole,dependingonyourrequire-

ments. However, the following steps are usually enough to

reachtheoptimumtemperatureproleforyourapplication:

1.InjectionoftheGalden

|Pre-heatingofthePCB

2.InjectionoftheGalden

|Idealsolderingtemperature

3.ExhaustofGalden

|Cooling

Only3stepstoaprole

Injection1 Injection2 Exhaust/Cooling

3stepstoaprole

liq

(217°)

Injection2 Exhaust/Cooling

5stepstoaprole

Vacuum

(Pre-/Endvacuum)

liq

(217°)

Condenso series | Software