Horizon-8EE.pdf
www.asm- smt.com DEK H ORIZO N 8 EE Platfo rm Technical Specification Part No. 222941 – Issue 0 5 – Sept ember 201 8
www.asm-smt.com
DEK HORIZON 8EE Platform
Technical Specification
Part No. 222941 – Issue 05 – September 2018
2
DEK Horizon 8EE
Machine Standard Configuration
Standard Configuration
Specification
Machine Alignment Capability
>2.0 C
pk
@ +/- 12.5µm, (±6 Sigma) *
Process Alignment Capability
>2.0 C
pk
@ +/- 25µm, (±6 Sigma) *
Core Cycle Time
10 secs
Maximum Print Area
508mm (X) x 508mm (Y)
Printer Construction
One piece optimised welded frame
ISCAN
TM
Machine Control
Motion control using CAN BUS network
Operating System
Windows 7 Standard embedded
Operator Interface
Colour TFT touch screen display, keyboard and trackball with DEK Instinctiv
TM
software. Machine mountable on either left or right hand side.
Camera
HawkEye® 750 digital camera, using IEEE 1394 interface. Multi channel. LED
lighting. FOV 11.3mm x 8.7mm (split between two views). Inspection window
26mm
2
Camera Positioning
Rotary motors and encoders with 4 micron resolution
Squeegee Pressure Mechanism
Software controlled, motorised with closed loop feedback
Adjustable Stencil Mount (ASM)
Frame variants – Fully adjustable to accommodate frame sizes in the range of
305mm to 736mm (12” to 29”) by 38mm height
Image position: centre/front/custom
Stencil Positioning
Manual with screen depth adjuster
Stencil Alignment
Motorised via actuators X, Y, and Theta
Under-Stencil Cleaning
Interchangeable Under Stencil (IUSC) cleaner, fully programmable with
wet/dry/vacuum wipe with external solvent tank. Specify length (300mm,
400mm, 520mm)
Vacuum Assist for Under-Stencil Cleaning
On board vacuum unit 25 litres/sec airflow
Squeegee
Clamped double trailing edge squeegee (1 set included)
Tooling Deviation Monitor
Verification of tooling setup via squeegee pressure feedback
Machine Interface
Upline and downline FMI included
Connectivity
RJ-45LAN (networking) and USB2 interface available
Tri Colour Beacon
Programmable with audible alarm
Temperature & Humidity Sensor
Monitoring of the process environment
Documentation
Hard copy manuals comprising: Operator, Installation, Electrical Drawings.
CD containing manuals and tutorials supporting operator functions.
* DEK’s machine accuracy and repeatability qualification is certified by 3rd party and undertaken using production
environment process variables. Print Speeds, Print Pressures, Rising Table and Camera Movements are included in the
process capability figure.
3
DEK Horizon 8EE
Machine Standard Configuration
Transport System
Specification
Type
Single piece with 3mm round transport belts, front rail fixed
ESD Compatibility
Black transport belts and guides with surface resistivity of greater than 10
6
ohms.
Width Adjustment
Programmable motorized rear rail
Transport Direction
Left to right
Right to left
Left to left
Right to right
Substrate Handling Size (minimum)
50mm (X) x 40.5mm (Y)
Substrate Handling Size (maximum)
510mm (X) x 508.5mm (Y)
Substrate Thickness
0.2mm to 6mm
Substrate Weight (maximum)
1kg
Substrate Warpage
Up to 7mm including substrate thickness
Substrate Fixture
Patented over the top clamps
Substrate Handling Features
Soft rail lift / land
Board clamp regulator
Substrate Underside Clearance
Programmable 3mm to 42mm
Process Parameters
Specification
Print Pressure
0kg to 20kg
Print Speed
2mm/sec to 300mm/sec
Print Gap
0mm to 6mm
Substrate Separation
Speed: 0.1mm/sec to 20mm/sec
Distance: 0mm to 20mm
Print Modes
Print / Print
Print / Flood
Flood / Print
Adhesive
Paste Knead
Programmable: number; period; on demand
Vision
Specification
Vision System
Cognex
Fiducial Recognition
Automatic fiducial teach and find incorporating 0.1mm fiducial capture
Fiducials
2 or 3
Fiducial Types
Synthetic fiducial library or unique pattern recognition
Fiducial Size
0.1mm to 3mm
Fiducial Locations
Anywhere on substrate
Fiducial Error Recovery
Auto lighting adjustment
Auto fiducial search
Camera Lighting
Software controlled programmable LED lighting